<
>
Specifications
Voltage Rating:
50V
Capacitance:
120pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G121J500NT
Model Number:
0603C0G121J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0pF, 10010pF, 101100pF | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 25025V, 251250V, 2522500V | ||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Packing | T (Tape/Reel), P (Bag packing) | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Operating Temperature Range | Specification | Testing Method | |||
| -55~+125 | Naked eye (Visual inspection) / Digital calliper | ||||
| Static Capacity | Specification | Testing Method | |||
| Meets standard specification and tolerance | Refer to specification (NPO, X7R/X7T/X7P characteristics) | ||||
| Dissipation Factor (DF) | Specification | Testing Method | |||
| Refer to specification (NPO, X7R/X7T/X7P characteristics) | Refer to specification | ||||
| Insulation Resistance (IR) | Specification | Testing Method | |||
| NPO: IR50000M, C10nF; IR*Cr500S, C>10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Rated voltage, 605s, Humidity:75%, Temperature:255, Current:50mA | ||||
| Hi-pot (DC) | Specification | Testing Method | |||
| No dielectric breakdown or damage | Voltage Raising time:110S, Voltage maintaining time2S (based on rated voltage) | ||||
| Solderability | Specification | Testing Method | |||
| Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| Resistance to the heat of soldering | Specification | Testing Method | |||
| No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | ||||
| Flexural Strength | Specification | Testing Method | |||
| Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB, Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. | ||||
| Terminal Bonding Strength | Specification | Testing Method | |||
| No visual damage | Applied Force: 5N, Duration: 101S | ||||
| Thermal Shock | Specification | Testing Method | |||
| NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | 5 cycles, test after 242 hours at normal temp & humidity. | ||||
| Temperature Moisture Exposure | Specification | Testing Method | |||
| NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% | Temperature 402, Humidity 90~95%RH, time 50024 hours. | ||||
| High Temperature Exposure | Specification | Testing Method | |||
| NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% | Temperature 1253, Time 100048 hours. Voltage dependent on rating. | ||||
| PCB Flexural Strength | Specification | Testing Method | |||
| No crack and other defect | MLCC soldered on PCB, pressing direction based on diagrams. | ||||
Packing Specifications
Embossed Plastic Taping
| Code | Tape Size (mm) | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
Paper Tape Reel Packing
| Code | Paper Size (mm) | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper Size (mm) | A | B | C | D | E | F | G | H | J | T |
|---|---|---|---|---|---|---|---|---|---|---|---|
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
Reel Dimensions
| Unit: mm | A | B | C | D | E | F | G |
|---|---|---|---|---|---|---|---|
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
Packing Quantity
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | 3000 (T>1.35mm) | |
| 1210 | 2000 (T1.60mm) | |
| 1808 | 3000 (T>1.60mm) | |
| 1812 | 2000 | |
| 1812 | 1000 (T1.85mm) | |
| 1000 (T>1.85mm) | ||
| 800 | ||
| 500 |
Precautions for Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To prevent potential issues like burnout, flaming, or glowing, adhere to the following precautions and application notes.
- Soldering Profile: Follow recommended temperature profiles to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, selecting appropriate tips and temperatures, and avoiding direct contact with the ceramic body.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering Method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, maintain the temperature difference between soldering temperature and surface temperature of chips as T150.
2509251626_AIDE-CAPACITOR-0603C0G121J500NT_C49326293.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
