<
>
Specifications
Voltage Rating:
50V
Capacitance:
15pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G150J500NT
Model Number:
0603C0G150J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics like C0G, X7R, and X5R, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
- Packing Options: Tape/Reel (T), Bag packing (P)
Technical Specifications
| Item | Specification/Requirement | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) | N/A |
| Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A |
| Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A |
| Temperature Range | -55~+125 | N/A |
| Dissipation Factor (DF) - NPO Characteristic | DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms |
| Dissipation Factor (DF) - X7R/X7T/X7P Characteristic | See Note 1 | Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24, 0.5V0.1rms |
| Insulation Resistance (IR) - NPO Characteristic | IR50000M, C10nF; IR*Cr500S, C10nF | Rated voltage, 605s, Humidity:75%, Temperature:255, Current:50mA |
| Insulation Resistance (IR) - X7R/X7T/X7P Characteristic | IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, 605s, Humidity:75%, Temperature:255, Current:50mA |
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area90% | Pre-heating: 80-120, 10-30s; Solder: Lead free, Flux; Soldering Temp: 2455, Time: 20.5s |
| Resistance to the heat of soldering | No damage, Soldering area90% | Pre-heating: 100-200, 102 s; Soldering Temp: 2655, Time: 51s. Cleaning with solvent. Room temperature, 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then 48 hours under normal conditions. |
| Flexural Strength | No damage; Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB; PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | 5 cycles. Test after 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No damage; Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No damage; Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction as per diagram. |
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Code | Tape size | A | B | C | D | E | F | G | H | J |
| 0805 | T | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 |
| 1206 | T | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 |
| 1210 | T | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 |
| 1808 | T | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 |
| 1812 | T | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Code | Paper size | W1 | L1 | D | C | B | P1 | P2 | P0 | d |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | |
| Reel Dimensions (mm) | |||||||
|---|---|---|---|---|---|---|---|
| Unit | A | B | C | D | E | F | G |
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| Packing Quantity (Pcs) | ||||
|---|---|---|---|---|
| Dimension | Paper T/R | Plastic T/R | ||
| 0603 | 4000 | - | ||
| 0805 | 4000 | 3000 (T1.35mm) | ||
| 1206 | - | 3000 (T>1.35mm) | ||
| 1210 | - | 2000 (T1.60mm) | ||
| 1808 | - | 3000 (T>1.60mm) | ||
| 1812 | - | 2000 | ||
| 1812 | - | 1000 (T1.85mm) | ||
| 1000 (T>1.85mm) | ||||
| 800 | ||||
| 500 | ||||
Precautions For Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes like burnout, flaming, or glowing, adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is carefully handled and appropriate for the temperature and contact.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
| Recommended Soldering Method | ||||
|---|---|---|---|---|
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
Soldering method: RReflow Soldering, WWave Soldering
| Soldering Temperature Profile | ||
|---|---|---|
| Condition | Temperature Difference | |
| Preheating | T150 (between soldering temperature and surface temperature of chips) | |
| Preheating | T150 (between soldering temperature and surface temperature of chips) | |
2509251626_AIDE-CAPACITOR-0603C0G150J500NT_C49326294.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
