quality Ceramic capacitor for high voltage switch power supplies and LCD backlight units AIDE CAPACITOR 0603C0G151J500NT multi layer design factory

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Specifications

Voltage Rating:

50V

Capacitance:

150pF

Temperature Coefficient:

C0G

Tolerance:

±5%

Mfr. Part #:

0603C0G151J500NT

Model Number:

0603C0G151J500NT

Package:

0603

Key Attributes

Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics (C0G, X7R, X5R) with precise specifications for capacitance, tolerance, and voltage ratings. They are manufactured with a ceramic dielectric, inner and outer electrodes, and nickel/tin layers for terminal composition. The product meets RoHS and REACH compliance standards.

Product Attributes

Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item	Description/Specification	Details
Application Field
	Coupling	High voltage circuits
	Wave filtering	High voltage circuits
	Resonant	High voltage circuits
	Switch power supplier	Medium and High voltage MLCC
	AC-DC power charger	Medium and High voltage MLCC
	DC-DC power charger	Medium and High voltage MLCC
	Networking/Communication interface	Medium and High voltage MLCC
	LCD backlight unit power supplier	Medium and High voltage MLCC
	Amperite of energy saving lamps	Medium and High voltage MLCC
Testing Conditions
Normal Condition	Temperature	15~35
	Humidity	45~75%RH
	Atmosphere	86~106kPa
Relative Condition	Temperature	252
	Humidity	60~70%RH
	Atmosphere	86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code	0201 (0.020.01 inch / 0.500.25 mm), 0402 (0.040.02 inch / 1.000.50 mm), 0603 (0.060.03 inch / 1.600.80 mm), 0805 (0.080.05 inch / 2.001.25 mm), 1206 (0.120.06 inch / 3.201.60 mm), 1210 (0.120.10 inch / 3.202.50 mm), 1808 (0.180.08 inch / 4.502.00 mm), 1812 (0.180.12 inch / 4.503.20 mm), 1825 (0.180.25 inch / 4.506.30 mm), 2211 (0.220.11 inch / 5.702.8 mm), 2225 (0.220.25 inch / 5.706.30 mm)
2. Temperature Characteristic	C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity	8R0 = 8.0pF, 100 = 10pF, 101 = 100pF
4. Tolerance of Electrostatic Capacity	B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC)	250 = 25V, 251 = 250V, 252 = 2500V
6. Terminal Composition	Au/Ag-Ni-Sn (From the inside out)
7. Packing	T (Tape/Reel), P (Bag packing)
Construction
Item	Description
1	Ceramic dielectric
2	Inner electrode
3	Outer electrode
4	Nickle layer
5	Tin layer
Dimension (mm)
Part number	L	W	T	WB
0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
1210 (3225)	3.200.30	2.500.30	2.70	0.800.30
1808 (4520)	4.500.40	2.000.20	2.70	0.800.30
1812 (4532)	4.500.40	3.200.30	3.50	0.800.30
1825 (4563)	4.500.40	6.300.50	3.50	0.800.30
2220 (5750)	5.700.50	5.000.50	3.50	1.000.40
2225 (5763)	5.700.50	6.300.50	6.20	1.000.40
Specification and Testing Method
Item	Specification/Requirement	Testing Method
1. Temperature	-55~+125
2. Visual/Dimension	1. No Damage, 2. Dimension meet Spec	Naked eye (Visual inspection), Digital calliper
3. Static Capacity	Meet standard specification and tolerance	NPO: 1000pF 1MHz10% 1.00.2Vrms; >1000pF 1KHz10% 1.00.2Vrms. X7R/X7T/X7P: 10uF 1KHz10% 1.00.2Vrms; >10uF 120Hz24 0.50.1Vrms
4. Dissipation Factor (DF)	NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms. (See Note 1 for exceptions)
5. IR Insulation Resistance	NPO: IR50000M, C10nF; IRCr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IRCr100S, C25nF. Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA
6. Hi-pot (DC)	No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time:110S, Voltage maintaining time2S
7. Solderability	Soldering area90%	Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. Visual-No damage
8. Resistance to the heat of soldering	Visual-No damage, soldering area90%	Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours.
9. Flexural strength	No damage	Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural deepth 452
10. Terminal bonding strength	No visual damage	Applied Force: 5N, Duration: 101S
11. Thermal shock	NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
12. Temperature moisture exposure	Visual No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IRCr25S (Lower reading). X7R/X7T/X7P: IR1000M or IRCr25S (Lower reading).	Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity.
13. High temperature exposure	Visual No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IRCr40S (Lower reading). X7R/X7T/X7P: IR2000M or IRCr50S (Lower reading).	Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature.
14. PCB flexural strength	No crack and other defect	Soldering the MLCC on the PCB, Then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6
EMBOSSED PLASTIC TAPING
Code	Tapesize A	B	C	D	E	F	G	H	J	T
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.50 Max
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10	1.85 Max
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	3.2 Max
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10	3.0 Max
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	4.0 Max
Paper Tape Reel Packing
Code	Papersize W1	L1	D	C	B	P1	P2	P0	d	t
1005	0.24 0.02	0.45 0.02	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.30 Below
0201	0.37 0.10	0.67 0.10	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.80 Below
0402	0.65 0.10	1.15 0.10	8.00 0.10	3.50 0.05	1.75 0.10	2.00 0.05	2.00 0.05	4.00 0.10	1.50 -0/+0.10	0.80 Below
Code	Papersize A	B	C	D	E	F	G	H	J	T
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
Reel Dimensions (unit: mm)
Unit:mm	A	B	C	D	E	F	G
7REEL	1782.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
13REEL	3302.0	3.0	130.5	210.5	21 or Bigger	1010.5	12max
Taping specification
(a) Paper Taping Reel type
(b) Embossed Taping	Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing quantity
Dimension	Paper T/R Pcs	Plastic T/R (Pcs
0603	4000
0805	4000	3000 T1.35mm
1206		3000 T1.35mm
1210		2000 T1.60mm
1808		3000 T1.60mm
1812		2000
1812		1000 T1.85mm
		1000 T1.85mm
		800
		500
Precautions For Use
1. Soldering Profile	To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page).
2. Manual Soldering	Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip.
3. Optimum Solder Amount for Reflow Soldering
4. Recommended Soldering amounts
Recommended Soldering Method
Size	Temperature Characteristics	Rated Voltage	Capacitance	Soldering Method
1005	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
0201	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0402	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0603	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C1uf	R	C1uf	R/W
	Y5V	/	C1uf	R	C1uf	R/W
0805	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C4.7uf	R	C4.7uf	R/W
	Y5V	/	C1uf	R	C1uf	R/W
1206	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C10uf	R	C10uf	R/W
	Y5V	/	C10uf	R	C10uf	R/W
1210	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
Soldering method: RReflow Soldering WWave Soldering
The temperature profile for soldering
While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603C0G151J500NT_C49326297.pdf

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