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Specifications
Voltage Rating:
50V
Capacitance:
200pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G201J500NT
Model Number:
0603C0G201J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage applications.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- Compliance: ROHS/REACH
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |
|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC)). | |||
| Testing Condition | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | (No special requirements) | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | For data not matching testing specification | ||
| Part Number Description | Example: 1812 X7R 684 M 251 N T | |||
| Item | Description | |||
| 1 Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | (Dimensions in inch and mm provided) | ||
| 2 Temperature characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| 3 Nominal electrostatic capacity | 8R08.0, 10010, 101100 (pF) | |||
| 4 Tolerance of electrostatic capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||
| 5 Rated voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||
| 6 Terminal composition | Au/Ag-Ni-Sn (From the inside out) | |||
| 7 Packing | T Tape/Reel, P Bag packing (PE) | |||
| Construction | Item | Description | ||
| 1 Ceramic dielectric | ||||
| 2 Inner electrode | ||||
| 3 Outer electrode | ||||
| 4 Nickle layer | ||||
| 5 Tin layer | ||||
| Dimension | Part number | Dimension (mm) | British system / Metric system | |
| 0201 | 0.600.10 (L), 0.300.05 (W), 0.300.05 (T), 0.100.05 (WB) | 0603 | ||
| 0402 | 1.000.15 (L), 0.500.15 (W), 0.500.10 (T), 0.200.10 (WB) | 1005 | ||
| 0603 | 1.600.20 (L), 0.800.15 (W), 0.800.15 (T), 0.300.10 (WB), 0.600.10 (WB) | 1608 | ||
| 0805 | 2.000.20 (L), 1.250.20 (W), 0.800.20 (T), 1.000.20 (WB), 0.500.20 (WB), 1.250.20 (WB), 0.800.20 (WB) | 2012 | ||
| 1206 | 3.200.30 (L), 1.600.30 (W), 1.000.20 (T), 1.250.20 (WB), 0.600.30 (WB), 1.600.30 (WB) | 3216 | ||
| 1210 | 3.200.30 (L), 2.500.30 (W), 2.70 (T), 0.800.30 (WB) | 3225 | ||
| 1808 | 4.500.40 (L), 2.000.20 (W), 2.70 (T), 0.800.30 (WB) | 4520 | ||
| 1812 | 4.500.40 (L), 3.200.30 (W), 3.50 (T), 0.800.30 (WB) | 4532 | ||
| 1825 | 4.500.40 (L), 6.300.50 (W), 3.50 (T), 0.800.30 (WB) | 4563 | ||
| 2220 | 5.700.50 (L), 5.000.50 (W), 3.50 (T), 1.000.40 (WB) | 5750 | ||
| 2225 | 5.700.50 (L), 6.300.50 (W), 6.20 (T), 1.000.40 (WB) | 5763 | ||
| Specification and testing method | 1 Temperature | -55~+125 | ||
| 2 Visual/ Dimension | 1, No Damage; 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||
| 3 Static capacity | Meet standard specification and tolerance | NPO characteristic: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P characteristic: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF). | ||
| 4 Dissipation factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 110%MHz, 1V0.2rms. Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P characteristic: see Note 1. Cr10uF, 110%KHz, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. | |||
| 5 IR Insulation Resistance | NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF. X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| 6 Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| 7 Solderability | soldering area90% | Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||
| 8 Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |||
| DF | Refer to NO#4 | |||
| IR | Refer to NO#5 | |||
| 9 Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural deepth 452. | ||
| 10 Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||
| 11 Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading); X7R/X7P- characteristic: C/C0.5%; X7T characteristic: C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||
| 12 Temperature moisture exposure | Visual No visual damage | Test it after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 500+24 hours. Electrost atic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | ||
| 13 High temperature exposure | Visual No visual damage | Test it after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Electrost atic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | ||
| 14 PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2. SIZE A B C. 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6. | ||
| Embossed Plastic Taping | Embossed tape reel packing for 0805(2012)~1812(4532) type | (Dimensions A, B, C, D, E, F, G, H, J, T provided for various codes) | ||
| Paper Tape Reel Packing | Paper tape reel packing for 10050402~12063216 | (Dimensions W1, L1, D, C, B, P1, P2, P0, d, t provided for various codes) | ||
| Structure of leader part and end part of the carrier paper | ||||
| Reel Dimensions | 7REEL 1782.0, 3.0 (A), 130.5 (B), 210.5 (C), 21 or Bigger (D), 1010.5 (E), 12max (F) | 13REEL 3302.0, 3.0 (A), 130.5 (B), 210.5 (C), 21 or Bigger (D), 1010.5 (E), 12max (F) | (unit: mm) | |
| Taping specification | Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping, (b) Embossed Taping | |
| Packing quantity | 7, ROHS/REACH compliance | 7.1 RoHS: meet the standard; 7.2 REACH: meet the standard | ||
| Precautions For Use | MLCCs may fail in short circuit mode under severe conditions. Follow "precautions for safety" and Application Notes. Contact engineering for handling questions. | |||
| Soldering Profile | Avoid cracks from sudden temperature change. Follow the temperature profile in the adjacent graph. | |||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |||
| Optimum Solder Amount for Reflow Soldering | Recommended | |||
| Recommended Soldering Method | Size | Temperature Characteristics | Capacitance | Soldering Method |
| 1005 | NPO / R; X7R/X5R/X7S/X6S / R | / | / | |
| 0201 | NPO / R; X7R/X5R/X7S/X6S / R; Y5V / R | / | / | |
| 0402 | NPO / R; X7R/X5R/X7S/X6S / R; Y5V / R | / | / | |
| 0603 | NPO / R/W; X7R/X5R/X7S/X6S / C1uf R C1uf R/W; Y5V / C1uf R C1uf R/W | RReflow Soldering, WWave Soldering | ||
| 0805 | NPO / R/W; X7R/X5R/X7S/X6S / C4.7uf R C4.7uf R/W; Y5V / C1uf R C1uf R/W | |||
| 1206 | NPO / R/W; X7R/X5R/X7S/X6S / C10uf R C10uf R/W; Y5V / C10uf R C10uf R/W | |||
| 1210 | NPO / R; X7R/X5R/X7S/X6S / R; Y5V / R | |||
| The temperature profile for soldering | Preheating: keep temperature difference between soldering temperature and surface temperature of chips as T150. | |||
| Packing quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | |
| 0603 | 4000 | |||
| 0805 | 4000 | 3000 (T1.35mm) | ||
| 1206 | 3000 (T1.35mm) | |||
| 1210 | 2000 (T1.60mm) | |||
| 1808 | 3000 (T1.60mm) | |||
| 1812 | 2000 | |||
| 1812 | 1000 (T1.85mm) | |||
| 800 (T1.85mm) | ||||
| 500 | ||||
2509251626_AIDE-CAPACITOR-0603C0G201J500NT_C49326307.pdf
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