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quality High Voltage MLCC AIDE CAPACITOR 0603C0G220K500NT for DC DC Power Chargers and Switch Power Supplies factory
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quality High Voltage MLCC AIDE CAPACITOR 0603C0G220K500NT for DC DC Power Chargers and Switch Power Supplies factory
>
Specifications
Voltage Rating:
50V
Capacitance:
22pF
Temperature Coefficient:
C0G
Tolerance:
±10%
Mfr. Part #:
0603C0G220K500NT
Model Number:
0603C0G220K500NT
Package:
0603
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are ideal for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode
  • Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
  • RoHS/REACH Compliance: Meets standard

Technical Specifications

Item Description Specification
Application Field Coupling, wave filtering, resonant in high voltage circuits
Switch power supplier
AC-DC power charger
DC-DC power charger
Networking/Communication interface
LCD backlight unit power supplier
Amperite of energy saving lamps
Medium and High voltage MLCC
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) 250 25, 251 250, 252 2500 (V)
Dimension Code & Size Code L*W (inch) / L*W (mm)
0201 0.02*0.01 / 0.50*0.25
0402 0.04*0.02 / 1.00*0.50
0603 0.06*0.03 / 1.60*0.80
0805 0.08*0.05 / 2.00*1.25
1206 0.12*0.06 / 3.20*1.60
1210 0.12*0.10 / 3.20*2.50
1808 0.18*0.08 / 4.50*2.00
1812 0.18*0.12 / 4.50*3.20
1825 0.18*0.25 / 4.50*6.30
2211 0.22*0.11 / 5.70*2.8
2225 0.22*0.25 / 5.70*6.30
Construction Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
Dimensions (mm) Part Number L L W W T T WB WB
0201 (0603) 0.60 0.10 0.30 0.05 0.30 0.05 0.10 0.05
0402 (1005) 1.00 0.15 0.50 0.15 0.50 0.10 0.20 0.10
0603 (1608) 1.60 0.20 0.80 0.15 0.80 0.15 0.30 0.10
0603 (1608) 1.60 0.20 0.80 0.15 0.80 0.15 0.60 0.10
0805 (2012) 2.00 0.20 1.25 0.20 0.80 0.20 1.00 0.20
0805 (2012) 2.00 0.20 1.25 0.20 0.80 0.20 0.50 0.20
0805 (2012) 2.00 0.20 1.25 0.20 0.80 0.20 1.25 0.20
0805 (2012) 2.00 0.20 1.25 0.20 0.80 0.20 0.80 0.20
1206 (3216) 3.20 0.30 1.60 0.30 1.00 0.20 1.25 0.20
1206 (3216) 3.20 0.30 1.60 0.30 1.00 0.20 0.60 0.30
1206 (3216) 3.20 0.30 1.60 0.30 1.00 0.20 1.60 0.30
1210 (3225) 3.20 0.30 2.50 0.30 2.70 0.80 0.30
1808 (4520) 4.50 0.40 2.00 0.20 2.70 0.80 0.30
1812 (4532) 4.50 0.40 3.20 0.30 3.50 0.80 0.30
1825 (4563) 4.50 0.40 6.30 0.50 3.50 0.80 0.30
2220 (5750) 5.70 0.50 5.00 0.50 3.50 1.00 0.40
2225 (5763) 5.70 0.50 6.30 0.50 6.20 1.00 0.40
Specification and Testing Method Item Specification/Requirement Testing Method
Temperature -55~+125 -
Visual/Dimension 1. No Damage 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static Capacity Meet standard specification and tolerance NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF)
X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)
Dissipation Factor (DF) NPO: DF0.56 (Cr5 pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr)
X7R/X7T/X7P: See Note 1
NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr>1000pF)
X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr>10uF)
IR Insulation Resistance NPO: IR50000M (C10nF); IR*Cr500S (C>10nF)
X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C>25nF)
Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current:50mA
Hi-pot (DC) No dielectric breakdown or damage Voltage based on rated voltage (Ur): 2.5x (Ur=100V), 2.0x (Ur=200/250V), 1.5x (Ur=450/500/630V), 1.2x (1KVUr2KV), 1.1x (Ur>2KV). Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area90% Pre-heating: 80-120 (10-30s), Lead free solder, flux. Soldering: 2455 (20.5s)
Resistance to the heat of soldering No damage, soldering area90% Pre-heating: 100-200 (102 s), Soldering: 2655 (51s). Cleaning with solvent. Room temperature, 242 hours.
Electrostatic Capacity Change Rate NPO: C/C0.5% or 0.5pF
X7R: C/C15%
X7T: -33% C/C22%
X7P: C/C10%
Refer to NO#3 for initial capacitance testing (Pre-heating 150 for 1 hour, then 48 hours under normal conditions)
Flexural Strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO: C/C2.5% or 0.25pF
X7R/X7P: C/C0.5%
X7T: C/C10%
Pre-condition (X7R characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles. Test after 242 hours normal temp & humidity.
Temperature Moisture Exposure Visual: No visual damage
Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%
DF: 2 times initial standard
IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S
Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours normal temp & humidity.
High Temperature Exposure Visual: No visual damage
Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%
DF: 2 X initial standard
IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S
Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature.
PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB, then pressing direction based on the photo.
Embossed Plastic Taping See detailed dimensions for 0805 to 1812 types -
Paper Tape Reel Packing See detailed dimensions for 1005, 0201, 0402, 0603, 0805, 1206 types -
Reel Dimensions 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
-
Taping Specification Top tape peeling strength: 0.1N < peeling strength < 0.7N -
Packing Quantity See table for Paper T/R and Plastic T/R quantities by size -

Precautions for Use

To avoid MLCC failure, adhere to specified ratings and conditions. Severe electrical or mechanical stress beyond specifications can lead to failure modes such as short circuit, open circuit, burn out, flaming, or glowing. Consult engineering or factory for handling precautions.

Soldering Recommendations

  • Soldering Profile: Follow recommended temperature profiles to prevent cracks from sudden temperature changes.
  • Manual Soldering: Exercise caution to avoid thermal cracks. Ensure proper soldering iron tip selection and temperature control.
  • Optimum Solder Amount: Refer to recommendations for reflow soldering.
  • Recommended Soldering Method: RReflow Soldering, WWave Soldering (specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance).
  • Soldering Temperature Profile: Keep temperature difference between soldering temperature and chip surface temperature T150 during preheating.

2509251626_AIDE-CAPACITOR-0603C0G220K500NT_C49326310.pdf

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