Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are ideal for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets standard
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||
| Switch power supplier | |||||
| AC-DC power charger | |||||
| DC-DC power charger | |||||
| Networking/Communication interface | |||||
| LCD backlight unit power supplier | |||||
| Amperite of energy saving lamps | |||||
| Medium and High voltage MLCC | |||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | ||||
| Dimension Code & Size | Code | L*W (inch) / L*W (mm) | |||
| 0201 | 0.02*0.01 / 0.50*0.25 | ||||
| 0402 | 0.04*0.02 / 1.00*0.50 | ||||
| 0603 | 0.06*0.03 / 1.60*0.80 | ||||
| 0805 | 0.08*0.05 / 2.00*1.25 | ||||
| 1206 | 0.12*0.06 / 3.20*1.60 | ||||
| 1210 | 0.12*0.10 / 3.20*2.50 | ||||
| 1808 | 0.18*0.08 / 4.50*2.00 | ||||
| 1812 | 0.18*0.12 / 4.50*3.20 | ||||
| 1825 | 0.18*0.25 / 4.50*6.30 | ||||
| 2211 | 0.22*0.11 / 5.70*2.8 | ||||
| 2225 | 0.22*0.25 / 5.70*6.30 | ||||
| Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer | ||||
| Dimensions (mm) | Part Number | L L | W W | T T | WB WB |
| 0201 (0603) | 0.60 0.10 | 0.30 0.05 | 0.30 0.05 | 0.10 0.05 | |
| 0402 (1005) | 1.00 0.15 | 0.50 0.15 | 0.50 0.10 | 0.20 0.10 | |
| 0603 (1608) | 1.60 0.20 | 0.80 0.15 | 0.80 0.15 | 0.30 0.10 | |
| 0603 (1608) | 1.60 0.20 | 0.80 0.15 | 0.80 0.15 | 0.60 0.10 | |
| 0805 (2012) | 2.00 0.20 | 1.25 0.20 | 0.80 0.20 | 1.00 0.20 | |
| 0805 (2012) | 2.00 0.20 | 1.25 0.20 | 0.80 0.20 | 0.50 0.20 | |
| 0805 (2012) | 2.00 0.20 | 1.25 0.20 | 0.80 0.20 | 1.25 0.20 | |
| 0805 (2012) | 2.00 0.20 | 1.25 0.20 | 0.80 0.20 | 0.80 0.20 | |
| 1206 (3216) | 3.20 0.30 | 1.60 0.30 | 1.00 0.20 | 1.25 0.20 | |
| 1206 (3216) | 3.20 0.30 | 1.60 0.30 | 1.00 0.20 | 0.60 0.30 | |
| 1206 (3216) | 3.20 0.30 | 1.60 0.30 | 1.00 0.20 | 1.60 0.30 | |
| 1210 (3225) | 3.20 0.30 | 2.50 0.30 | 2.70 | 0.80 0.30 | |
| 1808 (4520) | 4.50 0.40 | 2.00 0.20 | 2.70 | 0.80 0.30 | |
| 1812 (4532) | 4.50 0.40 | 3.20 0.30 | 3.50 | 0.80 0.30 | |
| 1825 (4563) | 4.50 0.40 | 6.30 0.50 | 3.50 | 0.80 0.30 | |
| 2220 (5750) | 5.70 0.50 | 5.00 0.50 | 3.50 | 1.00 0.40 | |
| 2225 (5763) | 5.70 0.50 | 6.30 0.50 | 6.20 | 1.00 0.40 | |
| Specification and Testing Method | Item | Specification/Requirement | Testing Method | ||
| Temperature | -55~+125 | - | |||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | |||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5 pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr>1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr>10uF) | |||
| IR Insulation Resistance | NPO: IR50000M (C10nF); IR*Cr500S (C>10nF) X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C>25nF) | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current:50mA | |||
| Hi-pot (DC) | No dielectric breakdown or damage | Voltage based on rated voltage (Ur): 2.5x (Ur=100V), 2.0x (Ur=200/250V), 1.5x (Ur=450/500/630V), 1.2x (1KVUr2KV), 1.1x (Ur>2KV). Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | Soldering area90% | Pre-heating: 80-120 (10-30s), Lead free solder, flux. Soldering: 2455 (20.5s) | |||
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating: 100-200 (102 s), Soldering: 2655 (51s). Cleaning with solvent. Room temperature, 242 hours. | |||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Refer to NO#3 for initial capacitance testing (Pre-heating 150 for 1 hour, then 48 hours under normal conditions) | |||
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10% | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles. Test after 242 hours normal temp & humidity. | |||
| Temperature Moisture Exposure | Visual: No visual damage Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours normal temp & humidity. | |||
| High Temperature Exposure | Visual: No visual damage Capacitance Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction based on the photo. | |||
| Embossed Plastic Taping | See detailed dimensions for 0805 to 1812 types | - | |||
| Paper Tape Reel Packing | See detailed dimensions for 1005, 0201, 0402, 0603, 0805, 1206 types | - | |||
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | - | |||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | - | |||
| Packing Quantity | See table for Paper T/R and Plastic T/R quantities by size | - | |||
Precautions for Use
To avoid MLCC failure, adhere to specified ratings and conditions. Severe electrical or mechanical stress beyond specifications can lead to failure modes such as short circuit, open circuit, burn out, flaming, or glowing. Consult engineering or factory for handling precautions.
Soldering Recommendations
- Soldering Profile: Follow recommended temperature profiles to prevent cracks from sudden temperature changes.
- Manual Soldering: Exercise caution to avoid thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount: Refer to recommendations for reflow soldering.
- Recommended Soldering Method: RReflow Soldering, WWave Soldering (specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance).
- Soldering Temperature Profile: Keep temperature difference between soldering temperature and chip surface temperature T150 during preheating.
2509251626_AIDE-CAPACITOR-0603C0G220K500NT_C49326310.pdf
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible