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Specifications
Voltage Rating:
50V
Capacitance:
270pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G271J500NT
Model Number:
0603C0G271J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving critical roles in coupling, wave filtering, and resonance within power supplies and communication interfaces. They are suitable for various electronic devices including switch power supplies, AC-DC and DC-DC power chargers, networking equipment, LCD backlight units, and energy-saving lamps. Available in a range of sizes and temperature characteristics, these MLCCs offer reliable performance under specified conditions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- ROHS/REACH Compliance: Meets standard
Technical Specifications
| Item | Description/Specification | Testing Method | ||
|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps (Medium and High voltage MLCC). | |||
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) Terminal Composition Packing (T: Tape/Reel, P: Bag packing) | |||
| Dimension Codes & Sizes (mm) | 0201 (0.50*0.25) / 0402 (1.00*0.50) / 0603 (1.60*0.80) / 0805 (2.00*1.25) 1206 (3.20*1.60) / 1210 (3.20*2.50) / 1808 (4.50*2.00) / 1812 (4.50*3.20) 1825 (4.50*6.30) / 2211 (5.70*2.8) / 2225 (5.70*6.30) | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |||
| Dimensions (mm) | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
| Temperature Range | -55~+125 | Naked eye (Visual inspection), Digital calliper | ||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF) | ||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, 605s, Humidity:75%, Temperature:255, Current :50mA | ||
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time2S | ||
| Solderability | Soldering area90%, No Damage | Pre-heating: 80-120 (10-30s), Solder: lead free, flux. Soldering temp: 2455 (20.5s) | ||
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating: 100-200 (102 s), Soldering temp: 2655 (51s). Cleaning with solvent. Room temperature, time: 242 hours. | ||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Refer to NO#3 | ||
| Flexural Strength | No damage, C/C10% | Base board: Al2O3 /PCB (Thickness: 1.6mm, Length: 100mm, Width: 40mm). Flexural depth: 1mm, Bend speed: 0.5mm/sec. | ||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R): Upper limit temp 1h, 241h. 5 cycles. Test after 242h at normal temp & humidity. | ||
| Temperature Moisture Exposure | Visual: No damage Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242h at normal temp & humidity. | ||
| High Temperature Exposure | Visual: No damage Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature: 1253, Time: 100048 hours. Voltage: 2x Rated voltage (250VV), 1.5x rated voltage (250VV1KV), 1.2x rated voltage (1KVV). Test after 48h at normal pressure & temperature. | ||
| PCB Flexural Strength | No crack and other defect | MLCC soldered on PCB, pressing direction based on diagrams. IR measurement. | ||
| Embossed Plastic Taping Dimensions (mm) | T | A | B | C | D | E | F | G | H | J 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | |||
| Paper Tape Reel Packing Dimensions (mm) | Code | Papersize | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |||
| Reel Dimensions (mm) | Unit:mm 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |||
| Top Tape Peeling Strength | (a) Paper Taping, (b) Embossed Taping: 0.1N < peeling strength < 0.7N | |||
| Packing Quantity (Pcs) | Paper T/R: 0805(4000), 1005(4000), 0201(4000), 0402(4000), 0603(4000), 0805(4000), 1206(4000) Plastic T/R: 0805(3000), 1206(3000 T1.35mm, 2000 T>1.35mm), 1210(3000 T1.60mm, 2000 T>1.60mm), 1808(1000 T1.85mm, 800 T>1.85mm), 1812(500) | |||
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent issues like burnout, flaming, or glowing, adhere to safety precautions and application notes. Contact engineering or the factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
- Optimum Solder Amount & Recommended Soldering Methods: Refer to specific guidelines for reflow and wave soldering based on size, temperature characteristics, rated voltage, and capacitance.
- Soldering Temperature Profile: Maintain T150 temperature difference between soldering temperature and chip surface temperature during preheating.
2509251626_AIDE-CAPACITOR-0603C0G271J500NT_C49326315.pdf
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