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Specifications
Voltage Rating:
50V
Capacitance:
2pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G2R0C500NT
Model Number:
0603C0G2R0C500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC)) | - |
| Testing Condition | Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - |
| Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - | |
| Part Number Description Example | 1812 X7R 684 M 251 N T | |
| Dimension Code (Example) | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | - |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | - |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - |
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | - |
| Packing | T Tape/Reel, P Bag packing (PE) | - |
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | - |
| Dimension (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30 1210 (3225): L 3.200.30, W 2.500.30 (2.70), T 0.800.30 1808 (4520): L 4.500.40, W 2.000.20 (2.70), T 0.800.30 1812 (4532): L 4.500.40, W 3.200.30 (3.50), T 0.800.30 1825 (4563): L 4.500.40, W 6.300.50 (3.50), T 0.800.30 2220 (5750): L 5.700.50, W 5.000.50 (3.50), T 1.000.40 2225 (5763): L 5.700.50, W 6.300.50 (6.20), T 1.000.40 | Digital Calliper |
| Temperature | -55~+125 | - |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection) |
| Static Capacity | NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; 1000 pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms; 10uF: 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, 1MHz10%, 1V0.2rms. Cr1000pF, 1KHz10%, 1V0.2rms. X7R/X7T/X7P characteristic: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24Hz, 0.5V0.1rms. (See Note 1 for exceptions) | - |
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF. | - |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | - |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | - |
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P characteristic: C/C0.5% X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. |
| High Temperature Exposure | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Temperature 1253, Time 100048 hours. Voltage: 100VV250V: 2x Rated voltage; 250VV1KV: 1.5x rated voltage; 1KVV: 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6 |
| Embossed Plastic Taping | 0805: Tape size 1.550.20 A, 2.350.20 B, 8.000.20 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.50 Max T. 1206: Tape size 1.950.20 A, 3.600.20 B, 8.000.20 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.85 Max T. 1210: Tape size 2.700.10 A, 3.420.10 B, 8.000.10 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.05 G, 4.000.10 H, 1.55 -0/+0.10 J, 3.2 Max T. 1808: Tape size 2.200.10 A, 4.950.10 B, 12.000.10 C, 5.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.05 G, 4.000.10 H, 1.50 -0/+0.10 J, 3.0 Max T. 1812: Tape size 3.660.10 A, 4.950.10 B, 12.000.10 C, 5.500.05 D, 1.750.10 E, 8.000.10 F, 2.000.05 G, 4.000.10 H, 1.55 -0/+0.10 J, 4.0 Max T. | - |
| Paper Tape Reel Packing | 1005: Papersize 0.240.02 W1, 0.450.02 L1, 8.000.10 D, 3.500.05 C, 1.750.10 B, 2.000.05 P1, 2.000.05 P2, 4.000.10 P0, 1.50 -0/+0.10 d, 0.30 Below t. 0201: Papersize 0.370.10 W1, 0.670.10 L1, 8.000.10 D, 3.500.05 C, 1.750.10 B, 2.000.05 P1, 2.000.05 P2, 4.000.10 P0, 1.50 -0/+0.10 d, 0.80 Below t. 0402: Papersize 0.650.10 W1, 1.150.10 L1, 8.000.10 D, 3.500.05 C, 1.750.10 B, 2.000.05 P1, 2.000.05 P2, 4.000.10 P0, 1.50 -0/+0.10 d, 0.80 Below t. 0603: Papersize 1.100.10 A, 1.900.10 B, 8.000.10 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.10 Max T. 0805: Papersize 1.450.15 A, 2.300.15 B, 8.00.15 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.10 Max T. 1206: Papersize 1.800.20 A, 3.400.20 B, 8.000.20 C, 3.500.05 D, 1.750.10 E, 4.000.10 F, 2.000.10 G, 4.000.10 H, 1.50 -0/+0.10 J, 1.10 Max T. | - |
| Reel Dimensions | 7REEL: 1782.0 A, 3.0 B, 130.5 C, 210.5 D, 21 or Bigger E, 1010.5 F, 12max G. 13REEL: 3302.0 A, 3.0 B, 130.5 C, 210.5 D, 21 or Bigger E, 1010.5 F, 12max G. | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | - |
| Packing Quantity | Paper T/R (Pcs): 0805: 4000, 1206: 4000. Plastic T/R (Pcs): 0805: 3000, 1206 (T1.35mm): 3000, 1206 (T1.35mm): 2000, 1210 (T1.60mm): 3000, 1210 (T1.60mm): 2000, 1808: 1000, 1812 (T1.85mm): 1000, 1812 (T1.85mm): 800, 1812: 500. | - |
| Soldering Method Recommendation | Size | Characteristic | Soldering Method 1005 | NPO / R/W 1005 | X7R/X5R/X7S/X6S / R 0201 | NPO / R/W 0201 | X7R/X5R/X7S/X6S / R 0201 | Y5V / R/W 0402 | NPO / R/W 0402 | X7R/X5R/X7S/X6S / R 0402 | Y5V / R/W 0603 | NPO / R/W 0603 | X7R/X5R/X7S/X6S / C1uf R, C1uf R/W 0603 | Y5V / C1uf R, C1uf R/W 0805 | NPO / R/W 0805 | X7R/X5R/X7S/X6S / C4.7uf R, C4.7uf R/W 0805 | Y5V / C1uf R, C1uf R/W 1206 | NPO / R/W 1206 | X7R/X5R/X7S/X6S / C10uf R, C10uf R/W 1206 | Y5V / C10uf R, C10uf R/W 1210 | NPO / R 1210 | X7R/X5R/X7S/X6S / R 1210 | Y5V / R | RReflow Soldering, WWave Soldering |
| Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as T150. | - |
2509251626_AIDE-CAPACITOR-0603C0G2R0C500NT_C49326317.pdf
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