<
>
Specifications
Voltage Rating:
50V
Capacitance:
4.3pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G4R3C500NT
Model Number:
0603C0G4R3C500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions within various high-voltage circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||
| Part Number Description | Item 1: Dimension Code | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) |
| Item 2: Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Item 3: Nominal Electrostatic Capacity | 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF) | |
| Item 4: Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | |
| Item 5: Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| Item 6: Terminal Composition | Au/Ag-Ni-Sn | |
| Item 7: Packing | T (Tape/Reel), P (Bag packing) | |
| Construction and Dimension | Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer |
| Dimension (mm) | Part Number | L | W | T | WB 0603 | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 1005 | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 1608 | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 3216 | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 3225 | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 4520 | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 4532 | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 4563 | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 5750 | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 5763 | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec. Tested by naked eye and digital caliper. | |
| Static Capacity | Meets standard specification and tolerance. NPO: 1MHz10% @ 1.00.2Vrms (1000pF); 1KHz10% @ 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10% @ 1.00.2Vrms (10uF); 120Hz24 @ 0.50.1Vrms (>10uF). | |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Testing frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); 110%KHz, Voltage 1V0.2rms (Cr>1000pF). X7R/X7T/X7P: See Note 1. | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF. Testing condition: Rated voltage, 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | |
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | |
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading). X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | |
| Flexural Strength | No damage. Electro static capacity change rate C/C10%. Flexural depth 452. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading). X7R/X7P: C/C0.5%. X7T: C/C10%. Run 5 cycles. | |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | |
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading). X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | |
| PCB Flexural Strength | No crack and other defect. | Size | A | B | C 0805(2012) | 1.2 | 4 | 1.65 1206(3216) | 2.2 | 5 | 2 1210(3225) | 2.2 | 5 | 2.9 1812(4532) | 3.5 | 7 | 3.7 2220(5750) | 4.5 | 8 | 5.6 |
| Embossed Plastic Taping | Dimensions (mm) | Code | Tape size A | B | C | D | E | F | G | H | J | T 0805 | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.50 Max 1206 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.1 | 1.50 -0/+0.10 | 1.85 Max 1210 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 3.2 Max 1808 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 3.0 Max 1812 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 4.0 Max |
| Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |
| Paper Tape Reel Packing | Dimensions (mm) | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (mm) | Unit | A | B | C | D | E | F | G 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |
| Packing Quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) 0603 | 4000 | 0805 | 4000 | 3000 (T1.35mm) 1206 | | 3000 (T>1.35mm) 1210 | | 2000 (T1.60mm) 1808 | | 3000 (T>1.60mm) 1812 | | 2000 1812 | | 1000 (T1.85mm) | |
| Soldering Method Recommendation | Size | Capacitance | Soldering Method 1005 | / | R 0201 | / | R 0402 | / | R 0603 | C1uf | R 0603 | C1uf | R/W 0805 | C4.7uf | R 0805 | C4.7uf | R/W 1206 | C10uf | R 1206 | C10uf | R/W 1210 | / | R *RReflow Soldering, WWave Soldering | |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing. Adhere to the following precautions for safety and application notes. For handling questions, contact the engineering section or factory.
- Soldering Profile: Follow the provided temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is handled carefully, and pay attention to tip selection and temperature contact.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
- Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.
2509251626_AIDE-CAPACITOR-0603C0G4R3C500NT_C49326331.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
