Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: ROHS/REACH compliant
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| Dimension Codes | 0201 (0.02*0.01 inch / 0.50*0.25 mm) 0402 (0.04*0.02 inch / 1.00*0.50 mm) 0603 (0.06*0.03 inch / 1.60*0.80 mm) 0805 (0.08*0.05 inch / 2.00*1.25 mm) 1206 (0.12*0.06 inch / 3.20*1.60 mm) 1210 (0.12*0.10 inch / 3.20*2.50 mm) 1808 (0.18*0.08 inch / 4.50*2.00 mm) 1812 (0.18*0.12 inch / 4.50*3.20 mm) 1825 (0.18*0.25 inch / 4.50*6.30 mm) 2211 (0.22*0.11 inch / 5.70*2.8 mm) 2225 (0.22*0.25 inch / 5.70*6.30 mm) | |
| Temperature Characteristic | C0G (030 PPM/) X7R (15%) X5R (15%) | |
| Nominal Electrostatic Capacity | e.g., 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | |
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |
| Rated Voltage (DC) | e.g., 250 = 25V, 251 = 250V, 252 = 2500V | |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Construction | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer | |
| Dimensions (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10, (0.600.10) 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20, (1.000.20, 0.800.20, 1.250.20) 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30, (1.250.20, 1.600.30) 1210 (3225): L 3.200.30, W 2.500.30 (2.70), T 0.800.30 1808 (4520): L 4.500.40, W 2.000.20 (2.70), T 0.800.30 1812 (4532): L 4.500.40, W 3.200.30 (3.50), T 0.800.30 1825 (4563): L 4.500.40, W 6.300.50 (3.50), T 0.800.30 2220 (5750): L 5.700.50, W 5.000.50 (3.50), T 1.000.40 2225 (5763): L 5.700.50, W 6.300.50 (6.20), T 1.000.40 | |
| Operating Temperature Range | -55~+125 | |
| Dissipation Factor (DF) | Refer to Note 1 for specific values based on characteristic and capacitance. | |
| Insulation Resistance (IR) | NPO: 50000M or IR*Cr500S (C10nF); IR*Cr500S (C>10nF). X7R/X7T/X7P: 10000M (C25nF); IR*Cr100S (C>25nF). Testing condition: Rated voltage, 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KV Ur 2KV: 1.2 x rated voltage 2KV < Ur: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area 90%. Pre-heating temperature 80-120 (10-30s), Lead free solder, flux. Soldering temperature 2455 (20.5s). | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating 100-200 (102s), Soldering temperature 2655 (51s). Cleaning with solvent. Room temperature, 242 hours. | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10% | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S | |
| Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. Test after 5 cycles, 242 hours at normal temp & humidity. | |
| Temperature Moisture Exposure | Visual: No visual damage. Temperature 402, Humidity 90~95%RH, Time 50024 hours. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: 2500M or IR*Cr25S. X7R/X7T/X7P: 1000M or IR*Cr25S. | |
| High Temperature Exposure | Visual: No visual damage. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: 4000M or IR*Cr40S. X7R/X7T/X7P: 2000M or IR*Cr50S. | |
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering MLCC on PCB. | |
| Embossed Plastic Taping Dimensions (mm) | 0805: Tapesize 1.550.20, A 2.350.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.50 Max 1206: Tapesize 1.950.20, A 3.600.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.1, H 1.50 -0/+0.10, J 1.85 Max 1210: Tapesize 2.700.10, A 3.420.10, B 8.000.10, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 3.2 Max 1808: Tapesize 2.200.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.50 -0/+0.10, J 3.0 Max 1812: Tapesize 3.660.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 8.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | 1005: W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.30 0201: W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80 0402: W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t Below 0.80 0603: A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 0805: A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 1206: A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max | |
| Reel Dimensions (mm) | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N | |
| Packing Quantity | Paper T/R (Pcs): 0603 (4000), 0805 (4000), 1206 (4000) Plastic T/R (Pcs): 0805 (3000), 1206 (3000 T1.60mm, 2000 T>1.60mm), 1812 (1000 T1.85mm, 800 T>1.85mm) | |
| Recommended Soldering Method | R - Reflow Soldering, W - Wave Soldering. Specific recommendations vary by size, characteristic, rated voltage, and capacitance. | |
2509251626_AIDE-CAPACITOR-0603C0G4R7C500NT_C49326332.pdf
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