<
>
Specifications
Voltage Rating:
50V
Capacitance:
510pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G511J500NT
Model Number:
0603C0G511J500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of sizes and temperature characteristics, offering reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | ||||
|---|---|---|---|---|---|---|
| 1. Application Field | ||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||
| 2. Testing Conditions | ||||||
| 2.1 Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||
| 2.2 Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| 3. Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||
| Item | Description | |||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||
| 7. Packing | T Tape/Reel, P Bag packing(PE) | |||||
| 4. Construction and Dimension | ||||||
| Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickle layer, 5 Tin layer | |||||
| Dimension (mm) | Code | British system | Metric system | L | W | T | WB | |||||
| 0201 | 0603 | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 | 1005 | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 | 1608 | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 | 2012 | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 | 3216 | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 | 3225 | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 | 4520 | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 | 4532 | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 | 4563 | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 | 5750 | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 | 5763 | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| 5. Specification and Testing Method | ||||||
| Item | Specification/Requirement | Testing method | ||||
| Temperature | -55~+125 | |||||
| Visual/Dimension | 1, No Damage; 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||
| Static Capacity | Meet standard specification and tolerance | |||||
| NPO characteristic: 1000pF 1MHz10% 1.00.2Vrms; 1000 pF 1KHz10% 1.00.2Vrms | ||||||
| X7R/X7T/X7P characteristic: 10uF 1KHz10% 1.00.2Vrms; 10uF 120Hz24 0.50.1Vrms | ||||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms | ||||
| X7R/X7T/X7P characteristic: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms | See Note 1 | |||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | ||||
| X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | ||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||
| Note 1: X7R/X5R/X6S/X7S Y5V Rated vol. DF Exception | ||||||
| Refer to detailed table for DF exceptions based on rated voltage and capacitance. | ||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | DF Refer to NO#4, IR Refer to NO#5 | ||||
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth 452. | ||||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||
| Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading); X7R/X7P- characteristic: C/C0.5%; X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours normal temp & humidity. | ||||
| Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%. DF 2 times initial standard. IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading). | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours normal temp & humidity. | ||||
| High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading). | Charging and discharging current 50mA Max. Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test after placing 48 hours under normal pressure & temperature. | ||||
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. IR test. | ||||
| 6. EMBOSSED PLASTIC TAPING | ||||||
| Embossed tape reel packing for 0805(2012)~1812(4532) type | Refer to detailed table for dimensions (A, B, C, D, E, F, G, H, J, T) for codes 0805, 1206, 1210, 1808, 1812. | |||||
| 7. Paper tape reel packing | ||||||
| Paper tape reel packing for 10050402~12063216 | Refer to detailed table for dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for codes 1005, 0201, 0402. | |||||
| Paper tape reel packing for 0603, 0805, 1206 types | Refer to detailed table for dimensions (A, B, C, D, E, F, G, H, J, T) for codes 0603, 0805, 1206. | |||||
| 8. Taping specification | ||||||
| Top tape peeling strength | (a) Paper Taping Reel type: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||
| 9. Packing quantity | ||||||
| Refer to table for Paper T/R (Pcs) and Plastic T/R (Pcs) quantities based on size and thickness. | ||||||
| 10. Precautions For Use | ||||||
| Soldering Profile | Follow the temperature profile in the adjacent graph to avoid cracks due to sudden temperature change. | |||||
| Manual Soldering | Handle soldering iron carefully to avoid thermal cracks. Pay attention to soldering iron tip selection and temperature. | |||||
| Optimum Solder Amount for Reflow Soldering | ||||||
| Recommended Soldering Method | Refer to table for recommended soldering methods (R-Reflow, W-Wave) based on size, temperature characteristics, rated voltage, and capacitance. | |||||
| Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | |||||
2509251626_AIDE-CAPACITOR-0603C0G511J500NT_C49326333.pdf
Request A Quote
Please Use Our Online Inquiry Contact Form Below If You Have Any Questions, Our Team Will Get Back To You As Soon As Possible
