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quality Multi Layer Ceramic Capacitor for Coupling and Wave Filtering AIDE CAPACITOR 0603C0G561J500NT High Voltage factory
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quality Multi Layer Ceramic Capacitor for Coupling and Wave Filtering AIDE CAPACITOR 0603C0G561J500NT High Voltage factory
>
Specifications
Voltage Rating:
50V
Capacitance:
560pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G561J500NT
Model Number:
0603C0G561J500NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.

Product Attributes

  • Material: Ceramic dielectric, inner and outer electrodes with Nickel and Tin layers.
  • Terminal Composition: Au/Ag-Ni-Sn (from inside out).
  • Certifications: RoHS/REACH compliant.

Technical Specifications

Item Description/Specification Testing Method
Application Field Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps. (Medium and High voltage MLCC).
Testing Conditions Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
N/A
Part Number Description Example: 1812 X7R 684 M 251 N T
Dimension Code
Temperature Characteristic (C0G, X7R, X5R)
Nominal Electrostatic Capacity (pF)
Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z)
Rated Voltage (DC)
Terminal Composition
Packing (T: Tape/Reel, P: Bag)
Construction 1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickel layer
5. Tin layer
Dimensions (mm) Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%) N/A N/A
Temperature Range -55~+125 Naked eye (Visual inspection), Digital calliper N/A
Static Capacity Meets standard specification and tolerance.
NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms.
X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms.
N/A N/A
Dissipation Factor (DF) NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr).
X7R/X7T/X7P: See Note 1.
N/A N/A
Insulation Resistance (IR) NPO: IR50000M, C10nF; IR*Cr500S, C10nF.
X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF.
Testing Condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA.
N/A N/A
Hi-pot (DC) No dielectric breakdown or damage.
Ur=100V: 2.5 x rated voltage
Ur=200V/250V: 2.0 x rated voltage
Ur=450/500/630V: 1.5 x rated voltage
1KVUr2KV: 1.2 x rated voltage
2KVUr: 1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time: 2S.
N/A N/A
Solderability Soldering area90%. No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. N/A
Resistance to the heat of soldering No damage, soldering area90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. N/A
Flexural Strength No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electrostatic capacity change rate: C/C10%. N/A N/A
Terminal Bonding Strength No visual damage. Applied Force: 5N, Duration: 101S. N/A
Thermal Shock NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. N/A
Temperature Moisture Exposure Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. N/A
High Temperature Exposure Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. N/A
PCB Flexural Strength No crack and other defect. IR. Soldering the MLCC on the PCB, then pressing direction based on the photo. N/A
Packing Quantity Paper T/R (Pcs): 0805: 4000, 1206: 4000
Plastic T/R (Pcs): 0805: 3000, 1206: 3000, 1210: 2000, 1808: 1000, 1812: 800
N/A N/A
Soldering Method Recommendation RReflow Soldering, WWave Soldering (Details in provided table) N/A N/A

Note 1: X7R/X5R/X6S/X7S/Y5V DF exceptions are detailed in the provided specification document.

Note: For detailed soldering profiles and precautions, please refer to the full specification document.


2509251626_AIDE-CAPACITOR-0603C0G561J500NT_C49326335.pdf

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