Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, inner and outer electrodes with Nickel and Tin layers.
- Terminal Composition: Au/Ag-Ni-Sn (from inside out).
- Certifications: RoHS/REACH compliant.
Technical Specifications
| Item | Description/Specification | Testing Method | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps. (Medium and High voltage MLCC). | ||||
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) Terminal Composition Packing (T: Tape/Reel, P: Bag) | ||||
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | N/A | ||
| Temperature Range | -55~+125 | Naked eye (Visual inspection), Digital calliper | N/A | ||
| Static Capacity | Meets standard specification and tolerance. NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms. X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms. | N/A | N/A | ||
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). X7R/X7T/X7P: See Note 1. | N/A | N/A | ||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Testing Condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. | N/A | N/A | ||
| Hi-pot (DC) | No dielectric breakdown or damage. Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S. | N/A | N/A | ||
| Solderability | Soldering area90%. No damage. | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | N/A | ||
| Resistance to the heat of soldering | No damage, soldering area90%. | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | N/A | ||
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electrostatic capacity change rate: C/C10%. | N/A | N/A | ||
| Terminal Bonding Strength | No visual damage. | Applied Force: 5N, Duration: 101S. | N/A | ||
| Thermal Shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | N/A | ||
| Temperature Moisture Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | N/A | ||
| High Temperature Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | N/A | ||
| PCB Flexural Strength | No crack and other defect. IR. | Soldering the MLCC on the PCB, then pressing direction based on the photo. | N/A | ||
| Packing Quantity | Paper T/R (Pcs): 0805: 4000, 1206: 4000 Plastic T/R (Pcs): 0805: 3000, 1206: 3000, 1210: 2000, 1808: 1000, 1812: 800 | N/A | N/A | ||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering (Details in provided table) | N/A | N/A | ||
Note 1: X7R/X5R/X6S/X7S/Y5V DF exceptions are detailed in the provided specification document.
Note: For detailed soldering profiles and precautions, please refer to the full specification document.
2509251626_AIDE-CAPACITOR-0603C0G561J500NT_C49326335.pdf
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