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Specifications
Voltage Rating:
50V
Capacitance:
5.6pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G5R6C500NT
Model Number:
0603C0G5R6C500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | e.g., 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | |
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |
| 5. Rated Voltage (DC) | e.g., 250 = 25V, 251 = 250V, 252 = 2500V | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimension (mm) | See detailed table below | Digital Caliper |
| Part Number | Dimension (mm) L x W x T | WB |
| 0201 (0603) | 0.600.10 x 0.300.05 x 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 x 0.500.15 x 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 x 0.800.15 x 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 x 1.250.20 x 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 x 1.600.30 x 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 x 2.500.30 x 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 x 2.000.20 x 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 x 3.200.30 x 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 x 6.300.50 x 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 x 5.000.50 x 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 x 6.300.50 x 6.20 | 1.000.40 |
| Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper |
| Static Capacity | Meet standard specification and tolerance | See detailed specifications in source |
| Dissipation Factor (DF) | See detailed specifications in source | See detailed specifications in source |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead-free solder, flux. Soldering temperature 2455, Solder time 20.5s |
| Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic capacity change rate | NPO: 0.5% or 0.5pF. X7R: 15%. X7T: -33% to 22%. X7P: 10%. | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Flexural strength | No damage. Electro static capacity change rate: 10%. | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal shock | NPO: 2.5% or 0.25pF. X7R/X7P: 0.5%. X7T: 10%. | 5 cycles. Test after 242 hours normal temp & humidity. |
| Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: 2% or 1pF. X7R/X7T/X7P: 10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. |
| High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: 2% or 1pF. X7R/X7T/X7P: 20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours under normal pressure & temperature. |
| PCB flexural strength | No crack and other defect. | IR Soldering the MLCC on the PCB, then pressing. See diagram for dimensions A, B, C for different sizes. |
| Embossed Plastic Taping | ||
| Embossed tape reel packing for 0805(2012)~1812(4532) type | See detailed dimensions in source | |
| Paper Tape Reel Packing | ||
| Paper tape reel packing for 10050402~12063216 | See detailed dimensions in source | |
| Structure of leader part and end part of the carrier paper | ||
| Reel Dimensions | 7REEL: 1782.0, 13REEL: 3302.0 | |
| Taping specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | |
| Packing quantity | See detailed table in source for Paper T/R and Plastic T/R quantities per size. | |
| Soldering Method | RReflow Soldering, WWave Soldering | |
| Recommended Soldering Method | See detailed table in source for recommended methods by size, temperature characteristic, rated voltage, and capacitance. | |
| Soldering Profile | Avoid cracks by sudden temperature change. Follow temperature profile in adjacent graph (refer to graph in enclosure page). | |
Precautions for Use
Multi-layer Ceramic Capacitors (MLCC) may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. This can lead to burnout, flaming, or glowing. Adhere to safety precautions and application notes. Contact engineering or factory for handling precautions.
- Soldering Profile: Follow the temperature profile to avoid cracks from sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature contact.
- Optimum Solder Amount for Reflow Soldering.
- Recommended Soldering amounts.
2509251626_AIDE-CAPACITOR-0603C0G5R6C500NT_C49326337.pdf
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