Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, inner electrode, outer electrode (Au/Ag-Ni-Sn composition)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | ||
|---|---|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||
| 2. Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing | ||||
| 3. Dimension Codes | Code | L*W (inch) | L*W (mm) | ||
| Dimensions | 0201 | 0.02*0.01 | 0.50*0.25 | ||
| 0402 | 0.04*0.02 | 1.00*0.50 | |||
| 0603 | 0.06*0.03 | 1.60*0.80 | |||
| 0805 | 0.08*0.05 | 2.00*1.25 | |||
| 1206 | 0.12*0.06 | 3.20*1.60 | |||
| 1210 | 0.12*0.10 | 3.20*2.50 | |||
| 1808 | 0.18*0.08 | 4.50*2.00 | |||
| 1812 | 0.18*0.12 | 4.50*3.20 | |||
| 1825 | 0.18*0.25 | 4.50*6.30 | |||
| 2211 | 0.22*0.11 | 5.70*2.8 | |||
| 2225 | 0.22*0.25 | 5.70*6.30 | |||
| Temperature Characteristic | C0G | (030 PPM/) | - | ||
| X7R | (15%) | - | |||
| X5R | (15%) | - | |||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100(pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Packing | T: Tape/Reel, P: Bag packing(PE) | ||||
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | ||||
| Dimensions (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | Temperature | -55~+125 | - | ||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) Digital calliper | |||
| Static Capacity | Meet standard specification and tolerance | - | |||
| Dissipation Factor (DF) | See Note 1 | - | |||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux Soldering temperature 2455, Solder time 20.5s | |||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | - | |||
| DF | Refer to NO#4 | - | |||
| IR | Refer to NO#5 | - | |||
| Flexural Strength | No damage | Base board: Al2O3 /PCB PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate: C/C10% | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | |||
| Temperature Moisture Exposure | Visual: No visual damage Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity | |||
| High Temperature Exposure | Visual: No visual damage Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on diagrams. SIZE A B C 0805(2012) 1.2 4 1.65 1206(3216) 2.2 5 2 1210(3225) 2.2 5 2.9 1812(4532) 3.5 7 3.7 2220(5750) 4.5 8 5.6 | |||
| Embossed Plastic Taping | Details for 0805 to 1812 types | See Page 8 | - | ||
| Paper Tape Reel Packing | Details for 1005, 0201, 0402, 0603, 0805, 1206 types | See Page 9 | - | ||
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | - | - | ||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N | - | - | ||
| Packing Quantity | See Page 11 | - | - | ||
| Soldering Profile | To avoid crack problem by sudden temperature change. | Refer to graph in enclosure page. | - | ||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering | See Page 13 | - | ||
| Soldering Temperature Profile | Preheating temperature difference T150. | See Page 14 | - | ||
Precautions for Use: MLCCs may fail short circuit or open circuit under severe electrical or mechanical stress. Follow safety precautions and application notes. Contact engineering for handling questions.
2509251626_AIDE-CAPACITOR-0603C0G681J500NT_C49326340.pdf
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