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quality High Voltage Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603C0G681J500NT Suitable for Power Supplies factory
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quality High Voltage Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603C0G681J500NT Suitable for Power Supplies factory
>
Specifications
Voltage Rating:
50V
Capacitance:
680pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0603C0G681J500NT
Model Number:
0603C0G681J500NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.

Product Attributes

  • Material: Ceramic dielectric, inner electrode, outer electrode (Au/Ag-Ni-Sn composition)
  • RoHS/REACH Compliance: Meets standards

Technical Specifications

Item Description Specification/Requirement Testing Method
1. Application Field Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions:
Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
2. Part Number Description Example: 1812 X7R 684 M 251 N T
Dimension Code, Temperature Characteristic, Nominal Electrostatic Capacity, Tolerance, Rated Voltage, Terminal Composition, Packing
3. Dimension Codes Code L*W (inch) L*W (mm)
Dimensions 0201 0.02*0.01 0.50*0.25
0402 0.04*0.02 1.00*0.50
0603 0.06*0.03 1.60*0.80
0805 0.08*0.05 2.00*1.25
1206 0.12*0.06 3.20*1.60
1210 0.12*0.10 3.20*2.50
1808 0.18*0.08 4.50*2.00
1812 0.18*0.12 4.50*3.20
1825 0.18*0.25 4.50*6.30
2211 0.22*0.11 5.70*2.8
2225 0.22*0.25 5.70*6.30
Temperature Characteristic C0G (030 PPM/) -
X7R (15%) -
X5R (15%) -
Nominal Electrostatic Capacity 8R08.0, 10010, 101100(pF)
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) 250 25V, 251 250V, 252 2500V
Terminal Composition Au/Ag-Ni-Sn (From the inside out)
Packing T: Tape/Reel, P: Bag packing(PE)
Construction 1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickel layer
5. Tin layer
Dimensions (mm) Part number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method Temperature -55~+125 -
Visual/Dimension 1. No Damage
2. Dimension meet Spec
Naked eye (Visual inspection)
Digital calliper
Static Capacity Meet standard specification and tolerance -
Dissipation Factor (DF) See Note 1 -
IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C>10nF
X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF
Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage Ur=100V, 2.5 x rated voltage;
Ur=200V/250V, 2.0 x rated voltage;
Ur=450/500/630V, 1.5 x rated voltage;
1KVUr2KV, 1.2 x rated voltage;
2KVUr, 1.1 x rated voltage.
Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux
Soldering temperature 2455, Solder time 20.5s
Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic capacity change rate NPO: C/C0.5% or 0.5pF
X7R: C/C15%
X7T: -33% C/C22%
X7P: C/C10%
-
DF Refer to NO#4 -
IR Refer to NO#5 -
Flexural Strength No damage Base board: Al2O3 /PCB
PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm
Flexural depth: 1mm, Bend speed: 0.5mm/sec.
Test it under the flexural status.
Electro static capacity change rate: C/C10%
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO: C/C2.5% or 0.25pF
X7R/X7P: C/C0.5%
X7T: C/C10%
Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity
Temperature Moisture Exposure Visual: No visual damage
Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%
DF: 2 times initial standard
IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S
Temperature 402, Humidity 90~95%RH, time 50024 hours.
Test it after place 242 hours normal temp & humidity
High Temperature Exposure Visual: No visual damage
Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%
DF: 2 X initial standard
IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S
Temperature 1253, Time 100048 hours.
Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage).
Test it after place 48 hours under normal pressure & temperature.
PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB. Pressing direction based on diagrams.
SIZE A B C
0805(2012) 1.2 4 1.65
1206(3216) 2.2 5 2
1210(3225) 2.2 5 2.9
1812(4532) 3.5 7 3.7
2220(5750) 4.5 8 5.6
Embossed Plastic Taping Details for 0805 to 1812 types See Page 8 -
Paper Tape Reel Packing Details for 1005, 0201, 0402, 0603, 0805, 1206 types See Page 9 -
Reel Dimensions 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
- -
Taping Specification Top tape peeling strength: 0.1N < peeling strength < 0.7N - -
Packing Quantity See Page 11 - -
Soldering Profile To avoid crack problem by sudden temperature change. Refer to graph in enclosure page. -
Recommended Soldering Method RReflow Soldering, WWave Soldering See Page 13 -
Soldering Temperature Profile Preheating temperature difference T150. See Page 14 -

Precautions for Use: MLCCs may fail short circuit or open circuit under severe electrical or mechanical stress. Follow safety precautions and application notes. Contact engineering for handling questions.


2509251626_AIDE-CAPACITOR-0603C0G681J500NT_C49326340.pdf

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