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Specifications
Voltage Rating:
50V
Capacitance:
6.8pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G6R8C500NT
Model Number:
0603C0G6R8C500NT
Package:
0603
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonance in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They are suitable for medium and high voltage MLCC requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35 Humidity: 45~75%RH Atmosphere: 86~106kPa | N/A |
| Relative Condition | Temperature: 252 Humidity: 60~70%RH Atmosphere: 86~106kPa | N/A |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | Sizes (L*W): 0201: 0.02*0.01 inch (0.50*0.25 mm) 0402: 0.04*0.02 inch (1.00*0.50 mm) 0603: 0.06*0.03 inch (1.60*0.80 mm) 0805: 0.08*0.05 inch (2.00*1.25 mm) 1206: 0.12*0.06 inch (3.20*1.60 mm) 1210: 0.12*0.10 inch (3.20*2.50 mm) 1808: 0.18*0.08 inch (4.50*2.00 mm) 1812: 0.18*0.12 inch (4.50*3.20 mm) 1825: 0.18*0.25 inch (4.50*6.30 mm) 2211: 0.22*0.11 inch (5.70*2.8 mm) 2225: 0.22*0.25 inch (5.70*6.30 mm) | N/A |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | N/A |
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | N/A |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | N/A |
| 6. Terminal Composition | Au/Ag-Ni-Sn (from inside out) | N/A |
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | N/A |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | N/A |
| Dimension (mm) | Part Number | L L | W W | T T | WB WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 1.250.20 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 1.250.20 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1.600.30 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 1.600.30 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 1.600.30 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.600.30 | Digital Caliper |
| Specification and Testing Method | ||
| Temperature | -55~+125 | N/A |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital Caliper |
| Static Capacity | NPO Characteristic: 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P Characteristic: 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | N/A |
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, 110%MHz, 1V0.2rms Cr1000pF, 110%KHz, 1V0.2rms X7R/X7T/X7P Characteristic: Cr10uF, 110%KHz, 1V0.1rms Cr10uF, 12024Hz, 0.5V0.1rms (See Note 1 for specific DF exceptions) | N/A |
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF IR*Cr500S, C10nF (Test condition: Rated voltage, 605s, 75% Humidity, 255, 50mA Current) X7R/X7T/X7P Characteristic: IR10000M, C25nF IR*Cr100S, C25nF | N/A |
| Hi-pot (DC) | Ur=100V, 2.5 x rated voltage Ur=200V/250V, 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, 1.2 x rated voltage 2KVUr, 1.1 x rated voltage (Voltage Raising time: 110S, Voltage maintaining time: 2S) | N/A |
| Solderability | Soldering area90% | Pre-heating 80-120 (10-30s), Lead-free solder, Flux, Soldering temp 2455 (20.5s) |
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating 100-200 (102s), Soldering temp 2655 (51s), Cleaning with solvent, Room temp (242 hours) |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Refer to NO#3 (initial capacitance testing: Pre-heating 150 for 1 hour, then place 48 hours under normal pressure & temperature) |
| Flexural Strength | Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB (Thickness: 1.6mm, Length: 100mm, Width: 40mm), Flexural depth: 1mm, Bend speed: 0.5mm/sec |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | 5 cycles (Pre-condition: Upper limit temp 1 hour, 241 hours, Test after 242 hours normal temp & humidity) |
| Temperature Moisture Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, Time 50024 hours (Test after 242 hours normal temp & humidity) |
| High Temperature Exposure | Capacitance Change Rate: NPO: C/C2% or 1pF X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours, Voltage 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage) (Test after 48 hours under normal pressure & temperature) |
| PCB Flexural Strength | No crack and other defect | Soldering MLCC on PCB, then pressing as per diagrams (See Page 7 for dimensions A, B, C for different sizes) |
| Embossed Plastic Taping Dimensions (mm) | ||
| Code | Tape Size (A, B, C, D, E, F, G, H, J, T) | Max (mm) |
| 0805 | 1.550.20, 2.350.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10 | 1.50 |
| 1206 | 1.950.20, 3.600.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10 | 1.85 |
| 1210 | 2.700.10, 3.420.10, 8.000.10, 3.500.05, 1.750.10, 4.000.10, 2.000.05, 4.000.10, 1.55 -0/+0.10 | 3.2 |
| 1808 | 2.200.10, 4.950.10, 12.000.10, 5.500.05, 1.750.10, 4.000.10, 2.000.05, 4.000.10, 1.50 -0/+0.10 | 3.0 |
| 1812 | 3.660.10, 4.950.10, 12.000.10, 5.500.05, 1.750.10, 8.000.10, 2.000.05, 4.000.10, 1.55 -0/+0.10 | 4.0 |
| Paper Tape Reel Packing Dimensions (mm) | ||
| Code | Paper Size (W1, L1, D, C, B, P1, P2, P0, d, t) | Below (mm) |
| 1005 | 0.240.02, 0.450.02, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10 | 0.30 |
| 0201 | 0.370.10, 0.670.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10 | 0.80 |
| 0402 | 0.650.10, 1.150.10, 8.000.10, 3.500.05, 1.750.10, 2.000.05, 2.000.05, 4.000.10, 1.50 -0/+0.10 | 0.80 |
| Code | Paper Size (A, B, C, D, E, F, G, H, J, T) | Max (mm) |
| 0603 | 1.100.10, 1.900.10, 8.000.10, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10 | 1.10 |
| 0805 | 1.450.15, 2.300.15, 8.00.15, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10 | 1.10 |
| 1206 | 1.800.20, 3.400.20, 8.000.20, 3.500.05, 1.750.10, 4.000.10, 2.000.10, 4.000.10, 1.50 -0/+0.10 | 1.10 |
| Reel Dimensions (unit: mm) | ||
| Type | A, B, C, D, E, F, G | Max (mm) |
| 7' REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5 | 12 |
| 13' REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5 | 12 |
| Taping Specification | ||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. |
| Packing Quantity | ||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) |
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T1.60mm) / 2000 (T1.60mm) |
| 1210 | - | 3000 (T1.85mm) / 1000 (T1.85mm) |
| 1808 | - | 800 |
| 1812 | - | 500 |
| Recommended Soldering Method | ||
| Size | Temperature Characteristics | Soldering Method |
| 1005 | NPO / X7R/X5R/X7S/X6S | R |
| 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | R |
| 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | R |
| 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | R/W (C1uf for X7R etc.), R (C1uf for X7R etc.) |
| 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | R/W (C4.7uf for X7R etc.), R (C4.7uf for X7R etc.) / R (C1uf for Y5V), R (C1uf for Y5V) |
| 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | R/W (C10uf for X7R etc.), R (C10uf for X7R etc.) / R (C10uf for Y5V), R (C10uf for Y5V) |
| 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | R |
Soldering Method Key: RReflow Soldering, WWave Soldering
Note on Soldering Profile: Keep the temperature difference between soldering temperature and surface temperature of chips T150 during preheating.
Precautions for Use: MLCCs may fail short or open circuit under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes such as burn out, flaming, or glowing, adhere to safety precautions and application notes. Contact engineering for handling questions.
Soldering Profile: Follow the adjacent graph to avoid cracks from sudden temperature changes.
Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron, tip selection, and temperature contact.
Optimum Solder Amount for Reflow Soldering & Recommended Soldering amounts: Refer to adjacent graphs.
2509251626_AIDE-CAPACITOR-0603C0G6R8C500NT_C49326342.pdf
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