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quality Multi layer ceramic capacitor AIDE CAPACITOR 0603C0G8R2C500NT used in LCD backlight units and energy saving lamp power supplies factory
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quality Multi layer ceramic capacitor AIDE CAPACITOR 0603C0G8R2C500NT used in LCD backlight units and energy saving lamp power supplies factory
>
Specifications
Voltage Rating:
50V
Capacitance:
8.2pF
Temperature Coefficient:
C0G
Mfr. Part #:
0603C0G8R2C500NT
Model Number:
0603C0G8R2C500NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Compliance: ROHS/REACH compliant

Technical Specifications

Item Description/Specification Testing Method
Application Field Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) -
Testing Conditions (Normal) Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa -
Testing Conditions (Relative) Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa -
Part Number Description Example 1812 X7R 684 M 251 N T -
Dimension Codes & Sizes (L*W)
  • 0201: 0.02*0.01 inch (0.50*0.25 mm)
  • 0402: 0.04*0.02 inch (1.00*0.50 mm)
  • 0603: 0.06*0.03 inch (1.60*0.80 mm)
  • 0805: 0.08*0.05 inch (2.00*1.25 mm)
  • 1206: 0.12*0.06 inch (3.20*1.60 mm)
  • 1210: 0.12*0.10 inch (3.20*2.50 mm)
  • 1808: 0.18*0.08 inch (4.50*2.00 mm)
  • 1812: 0.18*0.12 inch (4.50*3.20 mm)
  • 1825: 0.18*0.25 inch (4.50*6.30 mm)
  • 2211: 0.22*0.11 inch (5.70*2.8 mm)
  • 2225: 0.22*0.25 inch (5.70*6.30 mm)
 -
Temperature Characteristic Codes C0G (030 PPM/), X7R (15%), X5R (15%) -
Tolerance of Electrostatic Capacity Codes B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% -
Rated Voltage (DC) Codes 250 (25V), 251 (250V), 252 (2500V) -
Packing Codes T (Tape/Reel), P (Bag packing) -
Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer -
Dimensions (mm)
Part NumberDimension (mm) LWTWB
0201 (0603)0.600.100.300.050.300.050.100.05
0402 (1005)1.000.150.500.150.500.100.200.10
0603 (1608)1.600.200.800.150.800.150.300.10
0805 (2012)2.000.201.250.200.800.200.500.20
1206 (3216)3.200.301.600.301.000.200.600.30
1210 (3225)3.200.302.500.302.700.800.30
1808 (4520)4.500.402.000.202.700.800.30
1812 (4532)4.500.403.200.303.500.800.30
1825 (4563)4.500.406.300.503.500.800.30
2220 (5750)5.700.505.000.503.501.000.40
2225 (5763)5.700.506.300.506.201.000.40
 Digital Caliper
Temperature Range -55~+125 -
Static Capacity Test
  • NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms
  • X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms
 -
Dissipation Factor (DF)
  • NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
  • X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24Hz, 0.5V0.1rms
 -
Insulation Resistance (IR)
  • NPO: IR50000M, C10nF; IR*Cr500S, C10nF
  • X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF
 Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC)
  • Ur=100V: 2.5 x rated voltage
  • Ur=200V/250V: 2.0 x rated voltage
  • Ur=450/500/630V: 1.5 x rated voltage
  • 1KVUr2KV: 1.2 x rated voltage
  • 2KVUr: 1.1 x rated voltage
 Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area 90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
Resistance to the heat of soldering No visual damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours.
Electrostatic Capacity Change Rate
  • NPO: C/C0.5% or 0.5pF (larger reading)
  • X7R: C/C15%
  • X7T: -33% C/C22%
  • X7P: C/C10%
 Pre-heating 150 1hour, then place 48hours under normal pressure & temperature.
Flexural Strength No damage. Electro static capacity change rate: C/C10% Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock
  • NPO: C/C2.5% or 0.25pF (larger reading)
  • X7R/X7P: C/C0.5%
  • X7T: C/C10%
 Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity.
Temperature Moisture Exposure
  • Visual: No visual damage
  • Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%
  • DF: 2 times initial standard
  • IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
 Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity.
High Temperature Exposure
  • Visual: No visual damage
  • Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
  • DF: 2 X initial standard
  • IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
 Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature.
PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB. Pressing direction based on provided diagrams.
Embossed Plastic Taping Dimensions (mm)
CodeTape size ABCDEFGHJT
08051.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.50 Max
12061.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.85 Max
12102.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.103.2 Max
18082.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.103.0 Max
18123.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.104.0 Max
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Paper Tape Reel Packing Dimensions (mm)
CodePaper size W1L1DCBP1P2P0dt
10050.24 0.020.45 0.028.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.30 Below
02010.37 0.100.67 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below
04020.65 0.101.15 0.108.00 0.103.50 0.051.75 0.102.00 0.052.00 0.054.00 0.101.50 -0/+0.100.80 Below
06031.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
08051.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
12061.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
 -
Reel Dimensions (mm) 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. -
Top Tape Peeling Strength 0.1N < peeling strength < 0.7N Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity
DimensionPaper T/R (Pcs)Plastic T/R (Pcs)
06034000-
080540003000 (T1.35mm)
1206-3000 (T1.60mm) / 2000 (T1.60mm)
1210-1000 (T1.85mm) / 800 (T1.85mm)
1808-500
1812-500
1812-500
 -
Soldering Method Recommendation RReflow Soldering, WWave Soldering See detailed table in original document for specific size/characteristic combinations.

Precautions for Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing in the worst case. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling questions.

  • Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control.
  • Optimum Solder Amount for Reflow Soldering
  • Recommended Soldering amounts

Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and chip surface temperature T 150.


2509251626_AIDE-CAPACITOR-0603C0G8R2C500NT_C49326349.pdf

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