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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X5R105K350NT for High Voltage Power Supply Circuits factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X5R105K350NT for High Voltage Power Supply Circuits factory
>
Specifications
Voltage Rating:
35V
Capacitance:
1uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
0603X5R105K350NT
Model Number:
0603X5R105K350NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These capacitors are available in medium and high voltage ratings.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • Compliance: RoHS/REACH compliant

Technical Specifications

Item Description Specification/Requirement Testing Method
1. Application Field Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC).
Testing Conditions:
Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
3. Part Number Description Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 L*W (inch/mm)
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) 250 25, 251 250, 252 2500 (V)
Terminal Composition Au/Ag-Ni-Sn (From the inside out)
Packing T Tape/Reel, P Bag packing (PE)
4. Construction and Dimension Construction 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer
Dimension (mm) See table below British system / Metric system
Part number Dimension (mm) L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10 0.600.10
0805 (2012) 2.000.20 1.250.20 0.800.20 1.000.20 0.500.20 1.250.20 0.800.20
1206 (3216) 3.200.30 1.600.30 1.000.20 1.250.20 0.600.30 1.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
5. Specification and Testing Method Temperature -55~+125
Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital caliper
Static Capacity Meet standard specification and tolerance See table below
Characteristic Capacity Frequency Voltage
NPO 1000pF 1MHz10% 1.0 0.2Vrms
NPO 1000 pF 1KHz10% 1.0 0.2Vrms
X7R/X7T/X7P 10uF 1KHz10% 1.0 0.2Vrms
X7R/X7T/X7P 10uF 120Hz24 0.5 0.1Vrms
Dissipation Factor (DF) NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms.
X7R/X7T/X7P characteristic: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. See Note 1
IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S
Solderability soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.
Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours.
Electrostatic capacity change rate NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% Pre-heating 150 1hour, then place 48hours under normal pressure & temperature.
Flexural strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural depth 452.
Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
Thermal shock NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
Temperature moisture exposure Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity.
High temperature exposure Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature.
PCB flexural strength No crack and other defect IR. Soldering the MLCC on the PCB, then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6
Packing Quantity See table below
Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T>1.35mm)
1210 - 2000 (T1.60mm)
1808 - 3000 (T>1.60mm)
1812 - 2000
1812 - 1000 (T1.85mm)
1000 (T>1.85mm)
800
500

Precautions for Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.

  • Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
  • Manual Soldering: Be cautious to prevent thermal cracks. Ensure careful handling of the soldering iron and select appropriate tips and temperatures.
  • Optimum Solder Amount for Reflow Soldering
  • Recommended Soldering Method: See table below.

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.


2509251626_AIDE-CAPACITOR-0603X5R105K350NT_C49326359.pdf

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