Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These capacitors are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Compliance: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |
|---|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||
| Testing Conditions: Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| 3. Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | L*W (inch/mm) | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||
| Packing | T Tape/Reel, P Bag packing (PE) | |||
| 4. Construction and Dimension | Construction | 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer | ||
| Dimension (mm) | See table below | British system / Metric system | ||
| Part number | Dimension (mm) L W T WB | |||
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | |||
| 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | |||
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 0.600.10 | |||
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 0.500.20 1.250.20 0.800.20 | |||
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 0.600.30 1.600.30 | |||
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | |||
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | |||
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | |||
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | |||
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | |||
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | |||
| 5. Specification and Testing Method | Temperature | -55~+125 | ||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | ||
| Static Capacity | Meet standard specification and tolerance | See table below | ||
| Characteristic | Capacity | Frequency | Voltage | |
| NPO | 1000pF | 1MHz10% | 1.0 0.2Vrms | |
| NPO | 1000 pF | 1KHz10% | 1.0 0.2Vrms | |
| X7R/X7T/X7P | 10uF | 1KHz10% | 1.0 0.2Vrms | |
| X7R/X7T/X7P | 10uF | 120Hz24 | 0.5 0.1Vrms | |
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) | Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms. | ||
| X7R/X7T/X7P characteristic: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. | See Note 1 | |||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S | ||
| Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | ||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then place 48hours under normal pressure & temperature. | ||
| Flexural strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural depth 452. | ||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||
| Thermal shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | ||
| Temperature moisture exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | ||
| High temperature exposure | Visual: No visual damage. Electrostatic capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature. | ||
| PCB flexural strength | No crack and other defect | IR. Soldering the MLCC on the PCB, then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6 | ||
| Packing Quantity | See table below | |||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||
| 0603 | 4000 | - | ||
| 0805 | 4000 | 3000 (T1.35mm) | ||
| 1206 | - | 3000 (T>1.35mm) | ||
| 1210 | - | 2000 (T1.60mm) | ||
| 1808 | - | 3000 (T>1.60mm) | ||
| 1812 | - | 2000 | ||
| 1812 | - | 1000 (T1.85mm) | ||
| 1000 (T>1.85mm) | ||||
| 800 | ||||
| 500 | ||||
Precautions for Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Be cautious to prevent thermal cracks. Ensure careful handling of the soldering iron and select appropriate tips and temperatures.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering Method: See table below.
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Soldering Temperature Profile
During preheating, keep the temperature difference between soldering temperature and surface temperature of chips as T150.
2509251626_AIDE-CAPACITOR-0603X5R105K350NT_C49326359.pdf
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