Product Overview
This Multi-Layer Ceramic Capacitor (MLCC) is designed for high-voltage applications, serving as a coupling, wave filtering, and resonant component. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, including C0G, X7R, and X5R, with a wide range of capacitance, tolerance, and voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | ||||||||||
| Switch power supplier | |||||||||||
| AC-DC power charger, DC-DC power charger | |||||||||||
| Networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |||||||||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | |||||||||||
| Dimension Codes | 0201 | 0.02*0.01 inch (0.50*0.25 mm) | |||||||||
| 0402 | 0.04*0.02 inch (1.00*0.50 mm) | ||||||||||
| 0603 | 0.06*0.03 inch (1.60*0.80 mm) | ||||||||||
| 0805 | 0.08*0.05 inch (2.00*1.25 mm) | ||||||||||
| 1206 | 0.12*0.06 inch (3.20*1.60 mm) | ||||||||||
| 1210 | 0.12*0.10 inch (3.20*2.50 mm) | ||||||||||
| 1808 | 0.18*0.08 inch (4.50*2.00 mm) | ||||||||||
| 1812 | 0.18*0.12 inch (4.50*3.20 mm) | ||||||||||
| 1825 | 0.18*0.25 inch (4.50*6.30 mm) | ||||||||||
| 2211 | 0.22*0.11 inch (5.70*2.8 mm) | ||||||||||
| 2225 | 0.22*0.25 inch (5.70*6.30 mm) | ||||||||||
| Temperature Characteristic | C0G | 0 30 PPM/ | |||||||||
| X7R | 15% | ||||||||||
| X5R | 15% | ||||||||||
| Nominal Electrostatic Capacity | e.g., 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | ||||||||||
| Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | ||||||||||
| Rated Voltage (DC) | e.g., 250 = 25V, 251 = 250V, 252 = 2500V | ||||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||||||||
| Packing | T: Tape/Reel, P: Bag packing (PE) | ||||||||||
| Construction | 1. Ceramic dielectric | - | |||||||||
| 2. Inner electrode | - | ||||||||||
| 3. Outer electrode | - | ||||||||||
| 4. Nickel layer | - | ||||||||||
| 5. Tin layer | - | ||||||||||
| Dimension (mm) | Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |||||||
| Specifications and Testing Methods | Temperature Range | -55~+125 | |||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | ||||||||||
| Static Capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | ||||||||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). X7R/X7T/X7P characteristic: see Note 1. | ||||||||||
| Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF. | ||||||||||
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage depends on rated voltage (Ur). | ||||||||||
| Solderability | Soldering area 90%, Visual-No damage. | ||||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. | ||||||||||
| Electrostatic Capacity Change Rate | NPO Characteristic: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10%. | ||||||||||
| Flexural Strength | No damage. Electro static capacity change rate C/C10%. | ||||||||||
| Terminal Bonding Strength | No visual damage. Applied Force: 5N. | ||||||||||
| Thermal Shock | NPO Characteristic: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10%. | ||||||||||
| Temperature Moisture Exposure | Visual No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | ||||||||||
| High Temperature Exposure | Visual No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | ||||||||||
| PCB Flexural Strength | No crack and other defect. | ||||||||||
| Embossed Plastic Taping Dimensions (mm) | Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below | |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below | |
| Paper Tape Reel Packing Dimensions (mm) | Code | Paper size A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions (unit: mm) | Type | A | B | C | D | E | F | G | - | - | - |
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | - | - | - | |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | - | - | - | |
| Taping Specification | Top tape peeling strength | 0.1N < peeling strength < 0.7N | |||||||||
| Packing Quantity | Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | - | - | - | - | - | - | - | - |
| 0603 | 4000 | - | - | - | - | - | - | - | - | - | |
| 0805 | 4000 | 3000 (T1.35mm) | - | - | - | - | - | - | - | - | |
| 1206 | - | 3000 (T>1.35mm) | - | - | - | - | - | - | - | - | |
| 1210 | - | 2000 (T1.60mm) | - | - | - | - | - | - | - | - | |
| 1808 | - | 3000 (T>1.60mm) | - | - | - | - | - | - | - | - | |
| 1812 | - | 2000 | - | - | - | - | - | - | - | - | |
| 1812 | - | 1000 (T1.85mm) | - | - | - | - | - | - | - | - | |
| - | - | 800 (T>1.85mm) | - | - | - | - | - | - | - | - | |
| - | - | 500 | - | - | - | - | - | - | - | - | |
| Precautions for Use | MLCCs may fail short circuit under severe conditions. Follow soldering profiles and handling precautions. | ||||||||||
| Soldering Profile | Refer to adjacent graph to avoid cracks due to sudden temperature change. | ||||||||||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully. | ||||||||||
| Recommended Soldering Method | R - Reflow Soldering, W - Wave Soldering. Specific methods depend on size, temperature characteristics, rated voltage, and capacitance. | ||||||||||
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips T 150. | ||||||||||
2509251626_AIDE-CAPACITOR-0603X5R475M100NT_C49326380.pdf
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