Product Overview
This specification sheet details the 0603(X6S) chip ceramic capacitor (MLCC) designed for high-voltage electronic circuits. It is suitable for applications such as coupling, filtering, and resonance in devices including switching power supplies, AC-DC and DC-DC converters, network/communication interfaces, LCD module backlight power supplies, and energy-saving lamp ballasts. The capacitors are manufactured with a layered ceramic dielectric and internal electrodes, protected by outer electrodes, a nickel layer, and a tin layer.
Product Attributes
- Temperature Characteristics: X6S (22%)
- Terminal Material: Copper/Silver-Nickel-Tin (from inside to outside)
- Environmental Compliance: RoHS Directive, REACH Regulation (SVHC)
Technical Specifications
| Item | Specification | Test Method |
|---|---|---|
| Product Size Code | 0603 | L*W (inch): 0.06*0.03; L*W (mm): 1.60*0.80 |
| Nominal Capacitance (Example) | 105 | 1 (three-digit method, unit: F) |
| Capacitance Tolerance (Example) | K | 10% |
| Rated Voltage (DC) (Example) | 160 | 160V (160 - 16, 101-100V, 102-1000V using three-digit method) |
| Packaging Method (Example) | T | Tape packaging |
| Product Structure | 1. Ceramic Dielectric 2. Internal Electrode 3. Outer Electrode 4. Nickel Layer 5. Tin Layer | Visual inspection |
| Product Dimensions (0603) | L: 1.600.15 mm, W: 0.800.15 mm, T: 0.800.15 mm, WB: 0.300.10 mm | Vernier caliper measurement |
| Operating Temperature Range | -55~+105 | Visual inspection, Vernier caliper measurement |
| Capacitance Measurement (X6S) | 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24Hz, 0.50.1Vrms | Refer to specification |
| Dissipation Factor (DF) (X6S) | See Note 1 | Refer to specification |
| Insulation Resistance (X6S) | IR 10000M, C 25nF IR*Cr 100S, C > 25nF | Test voltage: 500V or rated voltage (whichever is lower), 605 sec test time, 75% humidity, 255 test temperature |
| Dielectric Withstanding Voltage (DC) | 2.0 times rated voltage (for Ur=200V/250V) | 1-10S voltage rise time, 2S holding time |
| Solderability | Tinning rate > 90%, no visible damage | Preheat 80-120 for 10-30 sec, lead-free solder, flux. Solder temp: 2455, solder time: 20.5 sec. |
| Solder Heat Resistance | No visible damage, tinning rate 90% | Preheat 100-200 for 102 sec, dip solder temp: 2605, dip time: 51 sec. Clean with solvent. Store at room temp for 242 hours. |
| Capacitance Change Rate (Solder Heat Resistance) (X6S) | |C/C| 22% | Refer to specification |
| Bending Strength | No visible damage | Test substrate: Al2O3 or PCB. Bending depth: 1mm. Pressing speed: 0.5mm/sec. Measurement during bending. |
| Capacitance Change Rate (Bending Strength) | |C/C| 10% | Refer to specification |
| Terminal Pull Strength | No visible damage | Refer to specification |
| Temperature Cycling (X6S) | |C/C| 10% | 5 cycles of temperature change. Pre-condition: upper temp 1 hour, rest 241 hour. Test after 242 hours at room temp/humidity. |
| Damp Heat Resistance (X6S) | |C/C| 10% | Test at 402, 90-95%RH for 50024 hours. Test after 24 hours at room temp/humidity. |
| High Temperature Load Test (X6S) | |C/C| 20% | Test at 853 for 100048 hours. Applied voltage based on rated voltage. |
| Tape Packaging (0603) | 4000 Pcs | Refer to packaging diagrams |
| Tape Packaging (0805) | 3000 Pcs (T1.35mm) | Refer to packaging diagrams |
| Tape Packaging (1206) | 3000 Pcs (T>1.35mm) | Refer to packaging diagrams |
Note 1: DF specifications for X7R/X5R/X6S/X7S/Y5V characteristics vary by rated voltage and capacitance. Refer to the detailed table in the original document for specific values.
Note 2: Initial measurement for capacitance in items 3, 11, 12, and 13 requires preheating at 150 for 1 hour, followed by 48 hours at room temperature and pressure.
2507091655_AIDE-CAPACITOR-0603X6S106M6R3NT_C49326391.pdf
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