Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, ensuring reliable performance in demanding environments.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out).
- Certifications: ROHS/REACH compliant.
Technical Specifications
| Category | Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | High voltage circuits | ||||
| Coupling | |||||
| Wave filtering | |||||
| Resonant | |||||
| Switch power supplier | |||||
| AC-DC power charger | |||||
| DC-DC power charger | |||||
| Networking/Communication interface | |||||
| LCD backlight unit power supplier | |||||
| Amperite of energy saving lamps | |||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 250 25V, 251 250V, 252 2500V | ||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Packing | T Tape/Reel, P Bag packing(PE) | ||||
| Dimensions (mm) | Part Number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Note: WB is the width of the solderable area. | |||||
| Specifications & Testing Methods | Item | Specification/Requirement | Testing Method | ||
| Temperature | -55~+125 | ||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||
| Static Capacity | Meet standard specification and tolerance | Refer to detailed specification for NPO and X7R/X7T/X7P characteristics | |||
| Dissipation Factor (DF) | Refer to detailed specification for NPO and X7R/X7T/X7P characteristics | Refer to detailed specification for NPO and X7R/X7T/X7P characteristics | |||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage varies based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Electrostatic Capacity Change Rate | NPO: C/C 0.5% or 0.5pF X7R: C/C 15% X7T: -33% C/C 22% X7P: C/C 10% | ||||
| Flexural Strength | No damage. Electro static capacity change rate C/C 10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal Shock | NPO: C/C 2.5% or 0.25pF X7R/X7P: C/C 0.5% X7T: C/C 10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |||
| Temperature Moisture Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C 2% or 1pF; X7R/X7T/X7P: C/C 10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature: 402, Humidity: 90~95%RH, Time: 50024 hours. Test it after place 242 hours normal temp & humidity. | |||
| High Temperature Exposure | Visual: No visual damage. Capacity Change Rate: NPO: C/C 2% or 1pF; X7R/X7T/X7P: C/C 20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. | |||
| PCB Flexural Strength | No crack and other defect. | IR Soldering the MLCC on the PCB, then pressing. | |||
| Taping Specifications | Embossed Plastic Taping Dimensions (mm) | 0805: A=1.550.20, B=2.350.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.50 Max 1206: A=1.950.20, B=3.600.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.1, J=1.50 -0/+0.10, T=1.85 Max 1210: A=2.700.10, B=3.420.10, C=8.000.10, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.05, H=4.000.10, J=1.55 -0/+0.10, T=3.2 Max 1808: A=2.200.10, B=4.950.10, C=12.000.10, D=5.500.05, E=1.750.10, F=4.000.10, G=2.000.05, H=4.000.10, J=1.50 -0/+0.10, T=3.0 Max 1812: A=3.660.10, B=4.950.10, C=12.000.10, D=5.500.05, E=1.750.10, F=8.000.10, G=2.000.05, H=4.000.10, J=1.55 -0/+0.10, T=4.0 Max | |||
| Paper Tape Reel Packing Dimensions (mm) | 1005: W1=0.240.02, L1=0.450.02, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.30 Below 0201: W1=0.370.10, L1=0.670.10, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.80 Below 0402: W1=0.650.10, L1=1.150.10, D=8.000.10, C=3.500.05, B=1.750.10, P1=2.000.05, P2=2.000.05, P0=4.000.10, d=1.50 -0/+0.10, t=0.80 Below 0603: A=1.100.10, B=1.900.10, C=8.000.10, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max 0805: A=1.450.15, B=2.300.15, C=8.00.15, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max 1206: A=1.800.20, B=3.400.20, C=8.000.20, D=3.500.05, E=1.750.10, F=4.000.10, G=2.000.10, H=4.000.10, J=1.50 -0/+0.10, T=1.10 Max | ||||
| Packing Quantity | Paper T/R (Pcs) | 0603: 4000, 0805: 4000, 1206: 4000 | |||
| Plastic T/R (Pcs) | 0805: 3000, 1206 (T1.35mm): 3000, 1210 (T>1.35mm): 2000, 1808 (T1.60mm): 3000, 1812 (T>1.60mm): 2000 | ||||
| Precautions for Use | MLCCs may fail short circuit mode under severe electrical or mechanical stress. Follow soldering profiles, use careful manual soldering, and ensure optimum solder amount for reflow soldering. | ||||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. Specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance. | ||||
2509251626_AIDE-CAPACITOR-0603X7R105K6R3NT_C49326608.pdf
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