Product Overview
High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer robust performance and are available in various temperature characteristics and precise specifications to meet diverse industrial needs.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS compliant, REACH compliant
Technical Specifications
| Item | Description / Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | See Page 1 for L*W dimensions in inches and mm |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | |
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |
| 7. Packing | T (Tape/Reel), P (Bag packing) | |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | |
| Dimension (mm) | See Page 2 for L, W, T, WB values for various codes (e.g., 0201, 0402, etc.) | Digital Calliper |
| Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | See Page 3 for frequency and voltage details |
| Dissipation Factor (DF) | See Page 3 for NPO and X7R/X7T/X7P characteristics and conditions | |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage levels vary based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic capacity change rate | NPO: C/C 0.5% or 0.5pF. X7R: C/C 15%. X7T: -33% C/C22%. X7P: C/C 10%. | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Flexural strength | No damage. Electro static capacity change rate C/C 10%. | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal bonding strength | No visual damage. | Applied Force: 5N, Duration: 101S |
| Thermal shock | NPO: C/C 2.5% or 0.25pF. X7R/X7P: C/C 0.5%. X7T: C/C 10%. | Run 5 cycles. Test after place 242 hours normal temp & humidity. |
| Temperature moisture exposure | Visual No visual damage. Electro static capacitance change rate: NPO: C/C 2% or 1pF. X7R/X7T/X7P: C/C 10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. |
| High temperature exposure | Visual No visual damage. Electro static capacitance change rate: NPO: C/C 2% or 1pF. X7R/X7T/X7P: C/C 20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage levels vary based on rated voltage. Test after place 48 hours under normal pressure & temperature. |
| PCB flexural strength | No crack and other defect. | See Page 7 for dimensions A, B, C for various sizes (0805 to 2220). |
| Embossed Plastic Taping | ||
| Embossed tape reel packing | Dimensions A, B, C, D, E, F, G, H, J, T for codes 0805 to 1812. | See Page 8 |
| Paper Tape Reel Packing | ||
| Paper tape reel packing | Dimensions W1, L1, D, C, B, P1, P2, P0, d, t for codes 1005, 0201, 0402, 0603, 0805, 1206. | See Page 9 |
| Reel Dimensions | ||
| 7' REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| 13' REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | Standard |
| Packing Quantity | ||
| Paper T/R (Pcs) | 4000 (0603, 0805, 1206) | |
| Plastic T/R (Pcs) | 3000 (T1.35mm for 1206, T1.60mm for 1210), 2000 (T>1.60mm for 1210, T1.85mm for 1812), 1000 (T>1.85mm for 1812), 800 (1812), 500 (1812 above) | |
| Soldering Method Recommendations | ||
| Size | Soldering Method | |
| 1005, 0201, 0402 | R | |
| 0603 | R/W (C1uf for X7R/X5R/X7S/X6S), R (C1uf for X7R/X5R/X7S/X6S) | |
| 0805 | R/W (C4.7uf for X7R/X5R/X7S/X6S), R (C4.7uf for X7R/X5R/X7S/X6S) | |
| 1206 | R/W (C10uf for X7R/X5R/X7S/X6S), R (C10uf for X7R/X5R/X7S/X6S) | |
| 1210 | R | |
| Soldering method key | RReflow Soldering, WWave Soldering | |
2509251626_AIDE-CAPACITOR-0603X7R154K250NT_C49326618.pdf
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