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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R154K500NT suitable for AC DC DC DC power chargers and networking devices factory
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quality Multi Layer Ceramic Capacitor AIDE CAPACITOR 0603X7R154K500NT suitable for AC DC DC DC power chargers and networking devices factory
>
Specifications
Voltage Rating:
50V
Capacitance:
150nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R154K500NT
Model Number:
0603X7R154K500NT
Package:
0603
Key Attributes
Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
  • Certifications: ROHS/REACH compliant

Technical Specifications

Part Number Description Example: 1812 X7R 684 M 251 N T

Item Description
1. Dimension Code
  • 0201 (0.02"x0.01" / 0.50x0.25mm)
  • 0402 (0.04"x0.02" / 1.00x0.50mm)
  • 0603 (0.06"x0.03" / 1.60x0.80mm)
  • 0805 (0.08"x0.05" / 2.00x1.25mm)
  • 1206 (0.12"x0.06" / 3.20x1.60mm)
  • 1210 (0.12"x0.10" / 3.20x2.50mm)
  • 1808 (0.18"x0.08" / 4.50x2.00mm)
  • 1812 (0.18"x0.12" / 4.50x3.20mm)
  • 1825 (0.18"x0.25" / 4.50x6.30mm)
  • 2211 (0.22"x0.11" / 5.70x2.8mm)
  • 2225 (0.22"x0.25" / 5.70x6.30mm)
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity e.g., 8R0=8.0pF, 100=10pF, 101=100pF
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) e.g., 250=25V, 251=250V, 252=2500V
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7. Packing T Tape/Reel, P Bag packing (PE)

Construction and Dimension

Item Description
Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer
Dimension (mm)
Part number British system Metric system L W T WB
020106030.600.100.300.050.300.050.100.05
040210051.000.150.500.150.500.100.200.10
060316081.600.200.800.150.800.150.300.10
080520122.000.201.250.200.800.201.000.20
120632163.200.301.600.301.000.201.250.20
121032253.200.302.500.302.700.800.30
180845204.500.402.000.202.700.800.30
181245324.500.403.200.303.500.800.30
182545634.500.406.300.503.500.800.30
222057505.700.505.000.503.501.000.40
222557635.700.506.300.506.201.000.40

Specification and Testing Method

No. Item Specification/Requirement Testing method
1 Temperature -55~+125
2 Visual/ Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital caliper
3 Static Capacity Meet standard specification and tolerance
  • NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; 1000pF: 1KHz10%, 1.00.2Vrms
  • X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms; 10uF: 120Hz24, 0.50.1Vrms
4 Dissipation Factor (DF)
  • NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
  • Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms. Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms.
  • X7R/X7T/X7P characteristic: see Note 1
  • Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms.
5 IR Insulation Resistance
  • NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF
  • X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF
Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA
6 Hi-pot (DC)
  • Ur=100V, 2.5 x rated voltage
  • Ur=200V/250V, 2.0 x rated voltage
  • Ur=450/500/630V, 1.5 x rated voltage
  • 1KVUr2KV, 1.2 x rated voltage
  • 2KVUr, 1.1 x rated voltage
Voltage Raising time: 110S, Voltage maintaining time: 2S
7 Solderability Soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s
8 Resistance to the heat of soldering Visual-No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
9 Flexural strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural depth 452.
10 Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
11 Thermal shock
  • NPO Characteristic: C/C2.5% or 0.25pF (larger reading)
  • X7R/X7P characteristic: C/C0.5%
  • X7T characteristic: C/C10%
Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity.
12 Temperature moisture exposure
  • Visual: No visual damage
  • Electrost atic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%
  • DF: 2 times initial standard
  • IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
Test it after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 500+24 hours.
13 High temperature exposure
  • Visual: No visual damage
  • Electrost atic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
  • DF: 2 X initial standard
  • IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
Charging and discharging current 50mA Max. Test it after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage).
14 PCB flexural strength No crack and other defect IR Soldering the MLCC on the PCB. Then pressing direction base on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6

Embossed Plastic Taping

Code Tape size A B C D E F G H J T
08051.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.50 Max
12061.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.11.50 -0/+0.101.85 Max
12102.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.103.2 Max
18082.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.103.0 Max
18123.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.104.0 Max

Paper Tape Reel Packing

Code Paper size W1 L1 D C B P1 P2 P0 d t
10050.240.020.450.028.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.30 Below
02010.370.100.670.108.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.80 Below
04020.650.101.150.108.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.80 Below
Code Paper size A B C D E F G H J T
06031.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
08051.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
12061.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max

Reel Dimensions

Unit: mm A B C D E F G
7REEL1782.03.0130.5210.521 or Bigger1010.512max
13REEL3302.03.0130.5210.521 or Bigger1010.512max

Packing Quantity

Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
06034000
080540003000 (T1.35mm)
12063000 (T>1.35mm)
12102000 (T1.60mm)
18083000 (T>1.60mm)
18122000
18121000 (T1.85mm)
1000 (T>1.85mm)
800
500

Precautions For Use

Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. This can result in burn out, flaming, or glowing. Adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.

  1. Soldering Profile: Follow the temperature profile to avoid cracks from sudden temperature changes.
  2. Manual Soldering: Manual soldering carries a risk of creating thermal cracks. Handle soldering irons carefully, paying attention to tip selection and temperature contact.
  3. Optimum Solder Amount for Reflow Soldering
  4. Recommended Soldering amounts

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005NPO//R
X7R/X5R/X7S/X6S//R
0201NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0402NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0603NPO//R/W
X7R/X5R/X7S/X6S/C1ufR
/C1ufR/W
Y5V/C1ufR
/C1ufR/W
0805NPO//R/W
X7R/X5R/X7S/X6S/C4.7ufR
/C4.7ufR/W
Y5V/C1ufR
/C1ufR/W
1206NPO//R/W
X7R/X5R/X7S/X6S/C10ufR
/C10ufR/W
Y5V/C10ufR
/C10ufR/W
1210NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

While preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.


2509251626_AIDE-CAPACITOR-0603X7R154K500NT_C49326619.pdf

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