Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Material: Ceramic dielectric, inner and outer electrodes (Au/Ag-Ni-Sn terminal composition).
- Certifications: ROHS/REACH compliant.
- Packing Options: Tape/Reel (T), Bag packing (P).
Technical Specifications
| Item | Description | Details | ||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |||||||||||
| Switch power supplier | ||||||||||||
| AC-DC power charger | ||||||||||||
| DC-DC power charger | ||||||||||||
| Networking/Communication interface | ||||||||||||
| LCD backlight unit power supplier | ||||||||||||
| Amperite of energy saving lamps | ||||||||||||
| Medium and High voltage MLCC | ||||||||||||
| Part Number Description | Item | Description | ||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||||
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||||
| 5. Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||||
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |||||||||||
| Construction | Item | Description | ||||||||||
| 1 | Ceramic dielectric | |||||||||||
| 2 | Inner electrode | |||||||||||
| 3 | Outer electrode | |||||||||||
| 4 | Nickle layer | |||||||||||
| 5 | Tin layer | |||||||||||
| Dimensions (mm) | Part Number | L | W | T | WB | |||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||||
| Specifications and Testing Methods | Item | Specification/Requirement | Testing Method | |||||||||
| 1. Temperature | -55~+125 | |||||||||||
| 2. Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) Digital caliper | ||||||||||
| 3. Static Capacity | Meet standard specification and tolerance | |||||||||||
| 4. Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) X7R/X7T/X7P characteristic: see Note 1 | |||||||||||
| 5. IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF / IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF / IR*Cr100S, C25nF | Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA | ||||||||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage Ur=200V/250V, 2.0 x rated voltage Ur=450/500/630V, 1.5 x rated voltage 1KVUr2KV, 1.2 x rated voltage 2KVUr, 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time2S | ||||||||||
| 7. Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux Soldering temperature 2455, Solder time 20.5s | ||||||||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. | ||||||||||
| 9. Flexural strength | No damage | Base boardAl2O3 /PCB PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test it under the flexural status. | ||||||||||
| Environmental Testing | Item | Specification | Testing Method | |||||||||
| 11. Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P- characteristic: C/C0.5% X7T characteristic: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | ||||||||||
| 12. Temperature moisture exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading), X7R/X7T/X7P characteristic: C/C10% DF: 2 times initial standard IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading), X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 500+24 hours | ||||||||||
| 13. High temperature exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading), X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading), X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours, Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage) | ||||||||||
| 14. PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, Then pressing direction base on the photo. | ||||||||||
| Taping Specifications | Type | Reel Size | A | B | C | D | E | F | G | H | J | T |
| Embossed Plastic Taping (0805-1812) | 7REEL 1782.0 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | |
| Paper Tape Reel Packing (0402-1206) | 7REEL 1782.0 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | |
| 13REEL 3302.0 | ||||||||||||
| Top tape peeling strength | Standard: 0.1N < peeling strength < 0.7N | |||||||||||
| Packing Quantity | Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | |||||||||
| 0603 | 4000 | - | ||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||||
| 1206 | - | 3000 (T1.60mm) / 2000 (T1.60mm) | ||||||||||
| 1210 | - | 1000 (T1.85mm) / 800 (T1.85mm) | ||||||||||
| 1812 | - | 500 | ||||||||||
Precautions for Use
To avoid potential failure modes such as short circuit, open circuit, burn out, flaming, or glowing, it is crucial to adhere to the specified ratings and conditions. Always consider the following:
- Soldering Profile: Follow the recommended temperature profile to prevent cracks caused by sudden temperature changes.
- Manual Soldering: Exercise caution to avoid thermal cracks. Ensure the soldering iron tip is carefully handled and select appropriate tip size and temperature for contact.
- Optimum Solder Amount: Use the recommended solder amount for reflow soldering.
- Recommended Soldering Method: Refer to the guidelines for recommended soldering methods based on size, characteristics, voltage, and capacitance.
2509251626_AIDE-CAPACITOR-0603X7R221K251NT_C49326624.pdf
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