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Specifications
Voltage Rating:
10V
Capacitance:
220nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R224K100NT
Model Number:
0603X7R224K100NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) | - |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - |
| Part Number Description Example | 1812 X7R 684 M 251 N T | - |
| Dimension Codes (L*W) | 0201 (0.02*0.01 inch / 0.50*0.25 mm) 0402 (0.04*0.02 inch / 1.00*0.50 mm) 0603 (0.06*0.03 inch / 1.60*0.80 mm) 0805 (0.08*0.05 inch / 2.00*1.25 mm) 1206 (0.12*0.06 inch / 3.20*1.60 mm) 1210 (0.12*0.10 inch / 3.20*2.50 mm) 1808 (0.18*0.08 inch / 4.50*2.00 mm) 1812 (0.18*0.12 inch / 4.50*3.20 mm) 1825 (0.18*0.25 inch / 4.50*6.30 mm) 2211 (0.22*0.11 inch / 5.70*2.8 mm) 2225 (0.22*0.25 inch / 5.70*6.30 mm) | - |
| Temperature Characteristic Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Nominal Capacitance (pF) | 8R0 (8.0), 100 (10), 101 (100) | - |
| Capacitance Tolerance Codes | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | - |
| Rated Voltage (DC) Codes | 250 (25V), 251 (250V), 252 (2500V) | - |
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | - |
| Packing Codes | T (Tape/Reel), P (Bag packing) | - |
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | - |
| Dimensions (mm) | See Page 2 for detailed dimensions (L, W, T, WB) for each size code (0201 to 2225). | Digital calliper |
| Operating Temperature Range | -55~+125 | - |
| Visual/Dimension Check | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) |
| Static Capacity | Meet standard specification and tolerance (NPO, X7R/X7T/X7P characteristics) | See Page 3 for detailed frequency and voltage testing conditions. |
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P characteristic: See Note 1 on Page 4. | See Page 3 for detailed frequency and voltage testing conditions. |
| Insulation Resistance (IR) | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage varies by rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Run 5 cycles. Test after placing 242 hours at normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage varies by rated voltage. Test after placing 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect. IR. | Pressing direction based on diagrams on Page 7. Sizes A, B, C specified for different MLCC sizes. |
| Embossed Plastic Taping Dimensions | See Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for tape sizes 0805 to 1812. | - |
| Paper Tape Reel Packing Dimensions | See Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for tape sizes 1005, 0201, 0402, 0603, 0805, 1206. | - |
| Reel Dimensions | 7' REEL (1782.0), 13' REEL (3302.0) | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | Standard |
| Packing Quantity | See Page 11 for quantities (Pcs) for Paper T/R and Plastic T/R for various sizes. | - |
| Soldering Profile | Follow temperature profile graph (adjacent graph). | - |
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. See Page 13 for details by size, characteristics, rated voltage, and capacitance. | - |
| Soldering Temperature Profile | Keep temperature difference between soldering temperature and surface temperature of chips 150. | - |
2509251626_AIDE-CAPACITOR-0603X7R224K100NT_C49326629.pdf
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