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quality AIDE CAPACITOR 0603X7R334K250NT High Voltage Multi Layer Ceramic Capacitors for in Switch Power Supplies factory
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quality AIDE CAPACITOR 0603X7R334K250NT High Voltage Multi Layer Ceramic Capacitors for in Switch Power Supplies factory
>
Specifications
Voltage Rating:
25V
Capacitance:
330nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R334K250NT
Model Number:
0603X7R334K250NT
Package:
0603
Key Attributes
Product Description

Product Overview

These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for various power supply and communication interfaces such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in a range of sizes and temperature characteristics, these capacitors offer reliable performance in demanding electrical environments.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode
  • Terminal Composition: Au/Ag-Ni-Sn (from inside out)
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item Description/Specification Testing Method
Application Field
Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps (Medium and High voltage MLCC).
Testing Conditions
Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
1. Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
4. Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5. Rated Voltage (DC) 250 25V, 251 250V, 252 2500V
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7. Packing T Tape/Reel, P Bag packing (PE)
Construction and Dimension
Construction 1 Ceramic dielectric, 2 Inner electrode, 3 Outer electrode, 4 Nickel layer, 5 Tin layer
Dimension (mm)
Part numberDimension (mm) L W T WB
0201 (0603)0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005)1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608)1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012)2.000.20 1.250.20 0.800.20 1.000.20
1206 (3216)3.200.30 1.600.30 1.000.20 1.250.20
1210 (3225)3.200.30 2.500.30 2.70 0.800.30
1808 (4520)4.500.40 2.000.20 2.70 0.800.30
1812 (4532)4.500.40 3.200.30 3.50 0.800.30
1825 (4563)4.500.40 6.300.50 3.50 0.800.30
2220 (5750)5.700.50 5.000.50 3.50 1.000.40
2225 (5763)5.700.50 6.300.50 6.20 1.000.40
 Digital caliper
Specification and Testing Method
Temperature -55~+125
Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static Capacity Meet standard specification and tolerance
  • NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms; >1000 pF: 1KHz10%, 1.00.2Vrms
  • X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms
Dissipation Factor (DF)
  • NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
  • X7R/X7T/X7P Characteristic: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms
  • NPO: Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms
  • X7R/X7T/X7P: See Note 1
IR Insulation Resistance
  • NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF
  • X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF
 Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area 90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s
Resistance to the heat of soldering No visual damage, soldering area 90% Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic capacity change rate
  • NPO Characteristic: C/C0.5% or 0.5pF (larger reading)
  • X7R: C/C15%
  • X7T: -33% C/C22%
  • X7P: C/C10%
 Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature.
Flexural Strength No damage Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate C/C10%
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock
  • NPO Characteristic: C/C2.5% or 0.25pF (larger reading)
  • X7R/X7P characteristic: C/C0.5%
  • X7T characteristic: C/C10%
 Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity.
Temperature Moisture Exposure
  • Visual: No visual damage
  • Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%
  • DF: 2 times initial standard
  • IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading)
 Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity.
High Temperature Exposure
  • Visual: No visual damage
  • Capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%
  • DF: 2 X initial standard
  • IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading)
 Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Charging and discharging current 50mA Max. Test after placing 48 hours under normal pressure & temperature.
PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB. Pressing direction based on diagram. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6
Embossed Plastic Taping
Embossed tape reel packing for 0805(2012)~1812(4532) type
CodeTape size ABCDEFGHJT
08051.55 0.202.35 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.50 Max
12061.95 0.203.60 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.11.50 -0/+0.101.85 Max
12102.70 0.103.42 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.55 -0/+0.103.2 Max
18082.20 0.104.95 0.1012.00 0.105.50 0.051.75 0.104.00 0.102.00 0.054.00 0.101.50 -0/+0.103.0 Max
18123.66 0.104.95 0.1012.00 0.105.50 0.051.75 0.108.00 0.102.00 0.054.00 0.101.55 -0/+0.104.0 Max
Paper Tape Reel Packing
Paper tape reel packing for 10050402~12063216
CodePapersize W1L1DCBP1P2P0dt
10050.240.020.450.028.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.30 Below
02010.370.100.670.108.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.80 Below
04020.650.101.150.108.000.103.500.051.750.102.000.052.000.054.000.101.50 -0/+0.100.80 Below
Paper tape reel packing for 0603, 0805, 1206 types
CodePapersize ABCDEFGHJT
06031.10 0.101.90 0.108.00 0.103.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
08051.45 0.152.30 0.158.0 0.153.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
12061.80 0.203.40 0.208.00 0.203.50 0.051.75 0.104.00 0.102.00 0.104.00 0.101.50 -0/+0.101.10 Max
Reel Dimensions (unit: mm)
A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping Specification
Top tape peeling strength Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. (a) Paper Taping, (b) Embossed Taping
Packing Quantity
Size Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T>1.35mm), 2000 (T1.60mm)
1210 - 3000 (T>1.60mm), 2000
1808 - 1000 (T1.85mm)
1812 - 1000 (T>1.85mm), 800
1812 - 500
Precautions For Use
Soldering Profile To avoid crack problems due to sudden temperature change, follow the temperature profile in the adjacent graph.
Manual Soldering Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature.
Optimum Solder Amount for Reflow Soldering
Recommended Soldering Method
SizeTemperature CharacteristicsRated VoltageCapacitanceSoldering Method
1005NPO//R
X7R/X5R/X7S/X6S//R
0201NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0402NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
0603NPO//R/W
X7R/X5R/X7S/X6S/C1ufR
/C1ufR/W
Y5V/C1ufR
/C1ufR/W
0805NPO//R/W
X7R/X5R/X7S/X6S/C4.7ufR
/C4.7ufR/W
Y5V/C1ufR
/C1ufR/W
1206NPO//R/W
X7R/X5R/X7S/X6S/C10ufR
/C10ufR/W
Y5V/C10ufR
/C10ufR/W
1210NPO//R
X7R/X5R/X7S/X6S//R
Y5V//R
Soldering method: RReflow Soldering, WWave Soldering
The temperature profile for soldering While preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.

2509251626_AIDE-CAPACITOR-0603X7R334K250NT_C49326640.pdf

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