Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant circuits. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric, inner and outer electrodes, Nickel layer, Tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- Certifications: RoHS/REACH compliant.
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Dimension Code & Size (mm) | 0201 (0.50*0.25) | L*W: 0.600.10 * 0.300.05, T: 0.300.05, WB: 0.100.05 |
| 0402 (1.00*0.50) | L*W: 1.000.15 * 0.500.15, T: 0.500.10, WB: 0.200.10 | |
| 0603 (1.60*0.80) | L*W: 1.600.20 * 0.800.15, T: 0.800.15, WB: 0.300.10 / 0.600.10 | |
| 0805 (2.00*1.25) | L*W: 2.000.20 * 1.250.20, T: 0.800.20, WB: 0.500.20 / 1.000.20 / 1.250.20 | |
| 1206 (3.20*1.60) | L*W: 3.200.30 * 1.600.30, T: 1.000.20, WB: 0.600.30 / 1.250.20 / 1.600.30 | |
| 1210 (3.20*2.50) | L*W: 3.200.30 * 2.500.30, T: 2.70, WB: 0.800.30 | |
| 1808 (4.50*2.00) | L*W: 4.500.40 * 2.000.20, T: 2.70, WB: 0.800.30 | |
| 1812 (4.50*3.20) | L*W: 4.500.40 * 3.200.30, T: 3.50, WB: 0.800.30 | |
| 1825 (4.50*6.30) | L*W: 4.500.40 * 6.300.50, T: 3.50, WB: 0.800.30 | |
| 2211 (5.70*2.8) | L*W: 5.700.50 * 2.8, T: 3.50, WB: 1.000.40 | |
| 2225 (5.70*6.30) | L*W: 5.700.50 * 6.300.50, T: 6.20, WB: 1.000.40 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| Rated Voltage (DC) | 25025, 251250, 2522500 (V) | |
| Operating Temperature Range | -55~+125 | |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Insulation Resistance (IR) | NPO: 50000M (C10nF) or IR*Cr500S (C>10nF); X7R/X7T/X7P: 10000M (C25nF) or IR*Cr100S (C>25nF) | |
| Hi-pot (DC) | 1.1x to 2.5x rated voltage depending on Ur | |
| Solderability | Soldering area 90%, No damage. Pre-heating: 80-120 (10-30s), Soldering: 2455 (20.5s) | |
| Resistance to Heat of Soldering | No damage, soldering area 90%. Pre-heating: 100-200 (102s), Soldering: 2655 (51s) | |
| Flexural Strength | No damage. Electrostatic capacity change rate: 10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N (101S) | |
| Thermal Shock | Capacity change rate: NPO 2.5% or 0.25pF, X7R/X7P 0.5%, X7T 10%. | |
| Temperature Moisture Exposure | Capacity change rate: NPO 2% or 1pF, X7R/X7T/X7P 10%. DF 2x initial standard. IR: NPO 2500M or IR*Cr25S, X7R/X7T/X7P 1000M or IR*Cr25S. | |
| High Temperature Exposure | Capacity change rate: NPO 2% or 1pF, X7R/X7T/X7P 20%. DF 2x initial standard. IR: NPO 4000M or IR*Cr40S, X7R/X7T/X7P 2000M or IR*Cr50S. | |
| PCB Flexural Strength | No crack and other defect. | |
| Packing (Tape/Reel) | T (Tape/Reel), P (Bag packing). Details on embossed and paper tape dimensions available. | |
2509251626_AIDE-CAPACITOR-0603X7R473J500NT_C49326646.pdf
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