Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving crucial roles in coupling, wave filtering, and resonance within power supplies and electronic circuits. They are ideal for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various standard sizes and dielectric characteristics, these MLCCs offer reliable performance and durability for demanding industrial and consumer electronics.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier | ||
| AC-DC power charger | ||
| DC-DC power charger | ||
| Networking/Communication interface | ||
| LCD backlight unit power supplier | ||
| Amperite of energy saving lamps | ||
| Medium and High voltage MLCC | ||
| Part Number Description Example | 1812 X7R 684 M 251 N T | |
| Terminal Composition (Inside out) | Au/Ag-Ni-Sn | |
| Dimensions (Code) | 0201 | L*W (inch): 0.02*0.01, L*W (mm): 0.50*0.25 |
| 0402 | L*W (inch): 0.04*0.02, L*W (mm): 1.00*0.50 | |
| 0603 | L*W (inch): 0.06*0.03, L*W (mm): 1.60*0.80 | |
| 0805 | L*W (inch): 0.08*0.05, L*W (mm): 2.00*1.25 | |
| 1206 | L*W (inch): 0.12*0.06, L*W (mm): 3.20*1.60 | |
| 1210 | L*W (inch): 0.12*0.10, L*W (mm): 3.20*2.50 | |
| 1808 | L*W (inch): 0.18*0.08, L*W (mm): 4.50*2.00 | |
| 1812 | L*W (inch): 0.18*0.12, L*W (mm): 4.50*3.20 | |
| 1825 | L*W (inch): 0.18*0.25, L*W (mm): 4.50*6.30 | |
| 2211 | L*W (inch): 0.22*0.11, L*W (mm): 5.70*2.8 | |
| 2220 | L*W (inch): 0.22*0.20, L*W (mm): 5.70*5.00 | |
| 2225 | L*W (inch): 0.22*0.25, L*W (mm): 5.70*6.30 | |
| Dimension (mm) - Specific examples | 0603 (1608) | L: 1.600.20, W: 0.800.15, T: 0.800.15 |
| Temperature Characteristic | C0G | (030 PPM/) |
| X7R | (15%) | |
| X5R | (15%) | |
| X7T | (-33% to +22%) | |
| X7P | (10%) | |
| Nominal Electrostatic Capacity | 8R0 | 8.0 pF |
| 100 | 10 pF | |
| 101 | 100 pF | |
| (Examples for larger values) | e.g., 0.1F, 1F, 10F, 100F | |
| Tolerance of Electrostatic Capacity | B | 0.1pF |
| C | 0.25pF | |
| D | 0.5pF | |
| F | 1% | |
| G | 2% | |
| J | 5% | |
| K | 10% | |
| M | 20% | |
| Z | +80%/-20% | |
| Rated Voltage (DC) | 250 | 25V |
| 251 | 250V | |
| 252 | 2500V | |
| (Examples for other voltages) | 16V, 35V, 50V, 63V, 100V, 200V, 250V, 500V, 630V, 1KV, 2KV | |
| Hi-pot (DC) | 1.1x to 2.5x rated voltage (depending on Ur) | |
| Packing | T | Tape/Reel |
| P | Bag packing (PE) | |
| Operating Temperature Range | -55 to +125 | (Based on Specification Item 3) |
| Insulation Resistance (IR) | NPO: 50000M (C10nF) or IR*Cr500S (C>10nF) | X7R/X7T/X7P: 10000M (C25nF) or IR*Cr100S (C>25nF) |
| Dissipation Factor (DF) | Refer to Specification Item 4 and Note 1 | Varies by dielectric type and capacitance |
| Solderability | Soldering area 90% | (Testing Method: Pre-heating 80-120, Solder 2455 for 20.5s) |
| Resistance to the Heat of Soldering | No damage, soldering area 90% | (Testing Method: Pre-heating 100-200, Solder 2655 for 51s) |
| Flexural Strength | MLCC Electrostatic capacity change rate: C/C10% | (Testing Method: Flexural depth 1mm on 1.6mm thick PCB) |
| Terminal Bonding Strength | No visual damage | (Applied Force: 5N for 101S) |
| Thermal Shock | Capacity change rate: NPO: 2.5% or 0.25pF; X7R/X7P: 0.5%; X7T: 10% | (5 cycles, tested after 242 hours at normal temp & humidity) |
| Temperature Moisture Exposure | Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 10% | (402, 90-95%RH for 50024 hours) |
| High Temperature Exposure | Capacity change rate: NPO: 2% or 1pF; X7R/X7T/X7P: 20% | (1253 for 100048 hours, various voltages) |
| PCB Flexural Strength | No crack and other defect | (IR tested after soldering MLCC on PCB) |
| Embossed Plastic Taping Dimensions | 0805 | Tape size: 1.550.20, A: 2.350.20, B: 8.000.20, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.10, G: 4.000.10, H: 1.50 -0/+0.10, J: 1.50 Max |
| Paper Tape Reel Packing Dimensions | 1005 | W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.30 Below |
| Reel Dimensions | 7REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | (Standard for Embossed Taping) |
| Packing Quantity (Example) | 0805 Plastic T/R | 3000 Pcs |
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering | (Varies by size, dielectric, and capacitance) |
2509251626_AIDE-CAPACITOR-0603X7R473K250NT_C49326647.pdf
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