quality RoHS Compliant Multi Layer Ceramic Capacitor AIDE CAPACITOR 0805C0G150J500NT for Energy Saving Lamps factory

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Specifications

Voltage Rating:

50V

Capacitance:

15pF

Temperature Coefficient:

C0G

Tolerance:

±5%

Mfr. Part #:

0805C0G150J500NT

Model Number:

0805C0G150J500NT

Package:

0805

Key Attributes

Product Description

Product Overview

This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. These MLCCs are designed for medium and high voltage applications and are compliant with RoHS and REACH standards.

Product Attributes

Material: Ceramic dielectric
Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item

Specification/Requirement

Testing Method

General Conditions

Normal Condition

Temperature: 15~35
Humidity: 45~75%RH
Atmosphere: 86~106kPa

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Relative Condition

Temperature: 252
Humidity: 60~70%RH
Atmosphere: 86~106kPa

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Part Number Description Example: 1812 X7R 684 M 251 N T

1. Dimension Code

0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225

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2. Temperature Characteristic

C0G (030 PPM/), X7R (15%), X5R (15%)

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3. Nominal Electrostatic Capacity

8R0=8.0pF, 100=10pF, 101=100pF

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4. Tolerance of Electrostatic Capacity

B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%

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5. Rated Voltage (DC)

250=25V, 251=250V, 252=2500V

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6. Terminal Composition

Au/Ag-Ni-Sn

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7. Packing

T: Tape/Reel, P: Bag packing (PE)

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Construction and Dimension

Construction

1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickel layer
5. Tin layer

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Dimension (mm)

Part Number	L	W	T	WB
0201 (0603)	0.600.10	0.300.05	0.300.05	0.100.05
0402 (1005)	1.000.15	0.500.15	0.500.10	0.200.10
0603 (1608)	1.600.20	0.800.15	0.800.15	0.300.10
0805 (2012)	2.000.20	1.250.20	0.800.20	0.500.20
1206 (3216)	3.200.30	1.600.30	1.000.20	0.600.30
1210 (3225)	3.200.30	2.500.30 (2.70)	0.800.30	-
1808 (4520)	4.500.40	2.000.20 (2.70)	0.800.30	-
1812 (4532)	4.500.40	3.200.30 (3.50)	0.800.30	-
1825 (4563)	4.500.40	6.300.50 (3.50)	0.800.30	-
2220 (5750)	5.700.50	5.000.50 (3.50)	1.000.40	-
2225 (5763)	5.700.50	6.300.50 (6.20)	1.000.40	-

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Specification and Testing Method

Temperature

-55~+125

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Visual/Dimension

1. No Damage
2. Dimension meet Spec

Naked eye (Visual inspection), Digital calliper

Static Capacity

Meet standard specification and tolerance

NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF)
X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF)

Dissipation Factor (DF)

NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr)
X7R/X7T/X7P: See Note 1

NPO: 110%MHz, 1V0.2rms (Cr1000pF); 110%KHz, 1V0.2rms (Cr>1000pF)
X7R/X7T/X7P: 110%KHz, 1V0.1rms (Cr10uF); 12024Hz, 0.5V0.1rms (Cr10uF)

IR Insulation Resistance

NPO: IR50000M (C10nF), IR*Cr500S (C10nF)
X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF)

Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA

Hi-pot (DC)

No dielectric breakdown or damage

Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S

Solderability

Soldering area90%

Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s.

Resistance to the heat of soldering

No damage, soldering area90%

Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.

Electrostatic capacity change rate

NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10%

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Flexural strength

No damage

Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. Electro static capacity change rate: C/C10%. Flexural deepth 452

Terminal bonding strength

No visual damage

Applied Force: 5N, Duration: 101S

Thermal shock

NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10%

Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity.

Temperature moisture exposure

Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S.

Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity.

High temperature exposure

Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S.

Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature.

PCB flexural strength

No crack and other defect

Soldering the MLCC on the PCB, then pressing direction based on the photo. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6

Embossed Plastic Taping

Taping Specification

Code	Tape size	A	B	C	D	E	F	G	H	J
0805	1.55 0.20	2.35 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.50 Max
1206	1.95 0.20	3.60 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.1	1.50 -0/+0.10	1.85 Max
1210	2.70 0.10	3.42 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	3.2 Max
1808	2.20 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	4.00 0.10	2.00 0.05	4.00 0.10	1.50 -0/+0.10	3.0 Max
1812	3.66 0.10	4.95 0.10	12.00 0.10	5.50 0.05	1.75 0.10	8.00 0.10	2.00 0.05	4.00 0.10	1.55 -0/+0.10	4.0 Max

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Paper Tape Reel Packing

Taping Specification (1005, 0201, 0402)

Code	Papersize	W1	L1	D	C	B	P1	P2	P0	d	t
1005	0.240.02	0.450.02	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.30 Below	-
0201	0.370.10	0.670.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below	-
0402	0.650.10	1.150.10	8.000.10	3.500.05	1.750.10	2.000.05	2.000.05	4.000.10	1.50 -0/+0.10	0.80 Below	-

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Taping Specification (0603, 0805, 1206)

Code	Papersize	A	B	C	D	E	F	G	H	J
0603	1.10 0.10	1.90 0.10	8.00 0.10	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
0805	1.45 0.15	2.30 0.15	8.0 0.15	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max
1206	1.80 0.20	3.40 0.20	8.00 0.20	3.50 0.05	1.75 0.10	4.00 0.10	2.00 0.10	4.00 0.10	1.50 -0/+0.10	1.10 Max

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Reel Dimensions

7' Reel

1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max

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13' Reel

3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max

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Top tape peeling strength

0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.

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Packing Quantity

Dimension	Paper T/R (Pcs)	Plastic T/R (Pcs)
0603	4000	-
0805	4000	3000 (T1.35mm)
1206	-	3000 (T1.60mm), 2000 (T>1.60mm)
1210	-	1000 (T1.85mm), 800 (T>1.85mm)
1808	-	500
1812	-	-

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Precautions For Use

Soldering Profile

Refer to the graph in the enclosure page.

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Manual Soldering

Handle carefully, pay attention to soldering iron tip selection and temperature contact.

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Recommended Soldering Method

Size	Temperature Characteristics	Rated Voltage	Capacitance	Soldering Method
1005	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
0201	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0402	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R
0603	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C1uf	R
		/	C1uf	R/W
	Y5V	/	C1uf	R
		/	C1uf	R/W
0805	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C4.7uf	R
		/	C4.7uf	R/W
	Y5V	/	C1uf	R
		/	C1uf	R/W
1206	NPO	/	/	R/W
	X7R/X5R/X7S/X6S	/	C10uf	R
		/	C10uf	R/W
	Y5V	/	C10uf	R
		/	C10uf	R/W
1210	NPO	/	/	R
	X7R/X5R/X7S/X6S	/	/	R
	Y5V	/	/	R

Soldering method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

Keep the temperature difference between soldering temperature and surface temperature of chips as T150.

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2509251626_AIDE-CAPACITOR-0805C0G150J500NT_C49326668.pdf

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