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Specifications
Voltage Rating:
50V
Capacitance:
27pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G270J500NT
Model Number:
0805C0G270J500NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Category | Specification | Details |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits | |
| Switch power supplier | ||
| AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Initial Testing (for Notes 3, 11, 12, 13) | Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature. | |
| Part Number Description | Dimension Code | Examples: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | |
| Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| Construction | Items | Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer |
| Dimensions (mm) | See detailed table in source document for specific codes (e.g., 0201, 0402, 0603, etc.) with L, W, T, WB values and tolerances. | |
| Specification and Testing Method | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meets Spec. Tested by naked eye and digital caliper. | |
| Static Capacity | Meets standard specification and tolerance. Testing frequency and voltage vary based on characteristic (NPO, X7R/X7T/X7P) and capacity value. | |
| Dissipation Factor (DF) | Specifications vary based on characteristic (NPO, X7R/X7T/X7P) and capacity value. Refer to Note 1 for detailed exceptions. | |
| Insulation Resistance (IR) | Specifications vary based on characteristic (NPO, X7R/X7T/X7P) and capacity value. Testing conditions: Rated voltage, 605s, Humidity 75%, Temperature 255, Current 50mA. | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (Ur) depending on the voltage level. Voltage raising time: 1-10s, maintaining time: 2s. | |
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating: 80-120 (10-30s), Soldering: 2455 (20.5s) using lead-free solder and flux. | |
| Resistance to the Heat of Soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200 (102s), Soldering: 2655 (51s). Cleaning with solvent. Room temperature, 242 hours. | |
| Electrostatic Capacity Change Rate | Varies by characteristic (NPO, X7R, X7T, X7P). See source for details. | |
| Flexural Strength | No damage. Tested on Al2O3/PCB baseboard. Electrostatic capacity change rate 10%. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Thermal Shock | Varies by characteristic (NPO, X7R/X7P, X7T). Tested over 5 cycles. | |
| Temperature Moisture Exposure | Visual-No damage. Capacitance change rate and DF specifications vary by characteristic. IR specifications vary by characteristic. Tested at 402, 90~95%RH for 50024 hours. | |
| High Temperature Exposure | Visual-No damage. Capacitance change rate and DF specifications vary by characteristic. IR specifications vary by characteristic. Tested at 1253 for 100048 hours with specified voltages. | |
| PCB Flexural Strength | No crack and other defect. Tested by soldering MLCC on PCB and applying force. Dimensions A, B, C provided for various sizes. | |
| Embossed Plastic Taping | Taping Dimensions | Details provided for 0805, 1206, 1210, 1808, 1812 sizes (Tape size, A, B, C, D, E, F, G, H, J, T). |
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains. | |
| Paper Tape Reel Packing | Dimensions for 1005, 0201, 0402 | Details provided for Paper size (W1, L1), D, C, B, P1, P2, P0, d, t. |
| Dimensions for 0603, 0805, 1206 | Details provided for Paper size (A, B), C, D, E, F, G, H, J, T. | |
| Reel Dimensions | Sizes | 7REEL (1782.0), 13REEL (3302.0). Includes dimensions for A, B, C, D, E, F, G. |
| Packing Quantity | Paper T/R (Pcs) | 4000 for 0603, 0805; Not specified for others. |
| Plastic T/R (Pcs) | 3000 for 0805 (T1.35mm), 2000 for 1210 (T1.60mm), 1000 for 1812 (T1.85mm), 800 for 1812 (T>1.85mm). Other sizes vary. | |
| Recommended Soldering Method | Methods | RReflow Soldering, WWave Soldering. Specific recommendations based on size, characteristic, rated voltage, and capacitance. |
| Soldering Temperature Profile | Preheating | Temperature difference between soldering temperature and surface temperature of chips T150. |
2509251626_AIDE-CAPACITOR-0805C0G270J500NT_C49326673.pdf
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