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quality High Voltage MLCC Components Including AIDE CAPACITOR 0805X5R106K100NT for Switch Power Supplies and Networking Equipment factory
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quality High Voltage MLCC Components Including AIDE CAPACITOR 0805X5R106K100NT for Switch Power Supplies and Networking Equipment factory
>
Specifications
Voltage Rating:
10V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
0805X5R106K100NT
Model Number:
0805X5R106K100NT
Package:
0805
Key Attributes
Product Description

Product Overview

These are high-quality Multi-Layer Ceramic Capacitors (MLCCs) designed for a wide range of high-voltage applications. They are ideal for coupling, wave filtering, and resonant functions in power supplies, chargers, networking interfaces, and lighting systems. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance and durability.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn
  • Certifications: RoHS compliant, REACH compliant

Technical Specifications

Item Description Specification
Application Field
Primary Applications Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperites of energy saving lamps. (Medium and High voltage MLCC)
Testing Conditions
Normal Condition Temperature 15~35
Humidity 45~75%RH
Atmosphere 86~106kPa
Relative Condition Temperature 252
Humidity 60~70%RH
Atmosphere 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
1 Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
2 Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3 Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
4 Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
5 Rated Voltage (DC) 250 25V, 251 250V, 252 2500V
6 Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7 Packing T Tape/Reel, P Bag packing (PE)
Construction
1 Ceramic dielectric
2 Inner electrode
3 Outer electrode
4 Nickle layer
5 Tin layer
Dimension (mm)
Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method
Temperature -55~+125
Visual/Dimension 1. No Damage
2. Dimension meet Spec
Naked eye (Visual inspection), Digital calliper
Static Capacity Meet standard specification and tolerance
Dissipation Factor (DF) NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr)
X7R/X7T/X7P characteristic: see Note 1
IR Insulation Resistance NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF
X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF
Testing condition: Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA
Hi-pot (DC) No dielectric breakdown or damage Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time:110S, Voltage maintaining time2S
Solderability soldering area90% Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s
Resistance to the heat of soldering No damage, soldering area90% Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours.
Electrostatic capacity change rate NPO Characteristic: C/C0.5% or 0.5pF larger reading; X7R :C/C15%; X7T -33% C/C22%; X7PC/C10%
Flexural strength No damage Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test it under the flexural status. Electro static capacity change rate C/C10%. Flexural deepth 452.
Terminal bonding strength No visual damage Applied Force: 5N, Duration: 101S
Thermal shock NPO Characteristic; C/C2.5% or 0.25pF ( larger reading); X7R/X7P- characteristic: C/C0.5%; X7T characteristicC/C10% Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity
Temperature moisture exposure Visual No visual damage; Electrostatic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading); X7R/X7T/X7P characteristic: C/C10%; DF 2 times initial standard; IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P : IR1000M or IR*Cr25S (Lower reading) Temperature 402, Humidity 90~95%RH, time 500+24 hours. Test it after place 242 hours normal temp & humidity
High temperature exposure Visual No visual damage; Electrostatic capacitance change rate NPO : C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR NPO : IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P : IR2000M or IR*Cr50S (Lower reading) Temperature 1253, Time 100048 hours. Voltage 100VV250V 2x Rated voltage; 250VV1KV 1.5x rated voltage; 1KVV 1.2x rated voltage. Test it after place 48 hours under normal pressure & temperature.
PCB flexural strength No crack and other defect IR Soldering the MLCC on the PCB. Then pressing direction base on the photo.
Embossed Plastic Taping Dimensions (mm)
Code Tape size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1808 2.20 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.50 -0/+0.10 3.0 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing Dimensions (mm)
Code Paper size W1 L1 D C B P1 P2 P0 d t
1005 0.24 0.02 0.45 0.02 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.30 Below
0201 0.37 0.10 0.67 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
0402 0.65 0.10 1.15 0.10 8.00 0.10 3.50 0.05 1.75 0.10 2.00 0.05 2.00 0.05 4.00 0.10 1.50 -0/+0.10 0.80 Below
Code Paper size A B C D E F G H J T
0603 1.10 0.10 1.90 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
0805 1.45 0.15 2.30 0.15 8.0 0.15 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
1206 1.80 0.20 3.40 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.10 Max
Reel Dimensions (unit: mm)
Type A B C D E F G
7REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Taping Specification
Top tape peeling strength 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity
Dimension Paper T/R (Pcs) Plastic T/R (Pcs)
0603 4000 -
0805 4000 3000 (T1.35mm)
1206 - 3000 (T1.60mm), 2000 (T1.60mm)
1210 - 3000 (T1.60mm), 2000 (T1.60mm)
1808 - 1000 (T1.85mm)
1812 - 1000 (T1.85mm)
1812 800 500
Precautions For Use
Soldering Profile To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph.
Manual Soldering Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip.
Recommended Soldering Method
Size Temperature Characteristics Capacitance Soldering Method
1005 NPO / R
X7R/X5R/X7S/X6S / R
0201 NPO / R
X7R/X5R/X7S/X6S / R
Y5V / R
0402 NPO / R
X7R/X5R/X7S/X6S / R
Y5V / R
0603 NPO / R/W
X7R/X5R/X7S/X6S C1uf R
C1uf R/W
Y5V C1uf R
C1uf R/W
0805 NPO / R/W
X7R/X5R/X7S/X6S C4.7uf R
C4.7uf R/W
Y5V C1uf R
C1uf R/W
1206 NPO / R/W
X7R/X5R/X7S/X6S C10uf R
C10uf R/W
Y5V C10uf R
C10uf R/W
1210 NPO / R
X7R/X5R/X7S/X6S / R
Y5V / R

2509251626_AIDE-CAPACITOR-0805X5R106K100NT_C49326679.pdf

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