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Specifications
Voltage Rating:
16V
Capacitance:
1uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R105K160NT
Model Number:
0805X7R105K160NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics (C0G, X7R, X5R) and a wide range of capacitance, tolerance, and voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) | - |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - |
| Part Number Description Example | 1812 X7R 684 M 251 N T | - |
| Dimension Codes (L*W) | 0201 (0.02*0.01 inch / 0.50*0.25 mm) 0402 (0.04*0.02 inch / 1.00*0.50 mm) 0603 (0.06*0.03 inch / 1.60*0.80 mm) 0805 (0.08*0.05 inch / 2.00*1.25 mm) 1206 (0.12*0.06 inch / 3.20*1.60 mm) 1210 (0.12*0.10 inch / 3.20*2.50 mm) 1808 (0.18*0.08 inch / 4.50*2.00 mm) 1812 (0.18*0.12 inch / 4.50*3.20 mm) 1825 (0.18*0.25 inch / 4.50*6.30 mm) 2211 (0.22*0.11 inch / 5.70*2.8 mm) 2225 (0.22*0.25 inch / 5.70*6.30 mm) | - |
| Temperature Characteristic Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Nominal Electrostatic Capacity | 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | - |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | - |
| Packing | T (Tape/Reel), P (Bag packing) | - |
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | - |
| Dimension (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10, T 0.600.10 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20, T 1.000.20, WB 0.800.20 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30, T 1.250.20, WB 1.600.30 1210 (3225): L 3.200.30, W 2.500.30 (2.70), T 0.800.30 1808 (4520): L 4.500.40, W 2.000.20 (2.70), T 0.800.30 1812 (4532): L 4.500.40, W 3.200.30 (3.50), T 0.800.30 1825 (4563): L 4.500.40, W 6.300.50 (3.50), T 0.800.30 2220 (5750): L 5.700.50, W 5.000.50 (3.50), T 1.000.40 2225 (5763): L 5.700.50, W 6.300.50 (6.20), T 1.000.40 | Digital calliper |
| Temperature Range | -55~+125 | - |
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | NPO: 1000pF @ 1MHz10%, 1.00.2Vrms; >1000pF @ 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF @ 1KHz10%, 1.00.2Vrms; >10uF @ 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms; Cr10uF, 120Hz24, 0.5V0.1rms | - |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | - |
| Flexural Strength | Electro static capacity change rate: C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF X7R/X7P: C/C0.5% X7T: C/C10% | 5 cycles. Test after 242 hours at normal temp & humidity. |
| Temperature Moisture Exposure | Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10% DF 2 times initial standard IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours at normal temp & humidity. |
| High Temperature Exposure | Capacity Change Rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20% DF 2 X initial standard IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours at normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing. |
| Embossed Plastic Taping Dimensions | 0805: Tapesize 1.550.20, A 2.350.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.50 Max 1206: Tapesize 1.950.20, A 3.600.20, B 8.000.20, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.10, G 4.000.10, H 1.50 -0/+0.10, J 1.85 Max 1210: Tapesize 2.700.10, A 3.420.10, B 8.000.10, C 3.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 3.2 Max 1808: Tapesize 2.200.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 4.000.10, F 2.000.05, G 4.000.10, H 1.50 -0/+0.10, J 3.0 Max 1812: Tapesize 3.660.10, A 4.950.10, B 12.000.10, C 5.500.05, D 1.750.10, E 8.000.10, F 2.000.05, G 4.000.10, H 1.55 -0/+0.10, J 4.0 Max | - |
| Paper Tape Reel Packing Dimensions | 1005: Papersize W1 0.240.02, L1 0.450.02, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.30 Below 0201: Papersize W1 0.370.10, L1 0.670.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.80 Below 0402: Papersize W1 0.650.10, L1 1.150.10, D 8.000.10, C 3.500.05, B 1.750.10, P1 2.000.05, P2 2.000.05, P0 4.000.10, d 1.50 -0/+0.10, t 0.80 Below 0603: Papersize A 1.100.10, B 1.900.10, C 8.000.10, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 0805: Papersize A 1.450.15, B 2.300.15, C 8.00.15, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max 1206: Papersize A 1.800.20, B 3.400.20, C 8.000.20, D 3.500.05, E 1.750.10, F 4.000.10, G 2.000.10, H 4.000.10, J 1.50 -0/+0.10, T 1.10 Max | - |
| Reel Dimensions | 7REEL: 1782.0, A 3.0, B 130.5, C 210.5, D 21 or Bigger, E 1010.5, F 12max 13REEL: 3302.0, A 3.0, B 130.5, C 210.5, D 21 or Bigger, E 1010.5, F 12max | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | - |
| Packing Quantity | 0603: Paper T/R (4000 Pcs) 0805: Paper T/R (4000 Pcs), Plastic T/R (3000 Pcs) 1206: Paper T/R (4000 Pcs), Plastic T/R (T1.35mm: 3000 Pcs, T1.35mm: 2000 Pcs) 1210: Plastic T/R (T1.60mm: 3000 Pcs, T1.60mm: 1000 Pcs) 1808: Plastic T/R (2000 Pcs) 1812: Plastic T/R (T1.85mm: 1000 Pcs, T1.85mm: 800 Pcs) 1812: Plastic T/R (500 Pcs) | - |
| Soldering Method | RReflow Soldering, WWave Soldering | - |
Precautions for Use: MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress. Follow safety precautions and application notes. Avoid sudden temperature changes during soldering. Manual soldering requires careful handling to prevent thermal cracks. Ensure optimum solder amount and recommended soldering methods for reflow and wave soldering. Maintain recommended temperature profiles during soldering.
2509251626_AIDE-CAPACITOR-0805X7R105K160NT_C49326705.pdf
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