Product Overview
These Medium and High Voltage Multilayer Ceramic Capacitors (MLCCs) are designed for applications such as coupling, wave filtering, and resonance in high-voltage circuits. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics, including C0G, X7R, and X5R, with different tolerances and rated voltages.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code (e.g., 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225) Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (e.g., 8R0, 100, 101 in pF) Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) Rated Voltage (DC) (e.g., 250, 251, 252 in V) Terminal Composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag packing) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimensions (mm) |
| Digital caliper | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Range | -55~+125 | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Static Capacity Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Rated Voltage (DC) | Examples: 250 (25V), 251 (250V), 252 (2500V) | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) | Refer to Note 1 for specific values based on characteristic and capacitance. | Refer to Specification section 4. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, 605s, Humidity:75%, Temperature:255, Current:50mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | 1.2 to 2.5 x rated voltage depending on rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area 90%, No Damage | Pre-heating: 80-120 (10-30s), Solder: 2455 (20.5s) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating: 100-200 (102s), Soldering: 2655 (51s), Cleaning, Room temp (242 hours) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: 0.5% or 0.5pF X7R: 15% X7T: -33% C/C22% X7P: 10% | Refer to Specification section 9. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage, Electro static capacity change rate 10% | Base board: Al2O3 /PCB, Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: 2.5% or 0.25pF X7R/X7P: 0.5% X7T: 10% | 5 cycles, tested after 242hours at normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | NPO: 2% or 1pF X7R/X7T/X7P: 10% DF: 2x initial standard IR: NPO 2500M or IR*Cr25S; X7R/X7T/X7P 1000M or IR*Cr25S | 402, 90~95%RH, 50024 hours, tested after 242hours at normal temp & humidity. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | NPO: 2% or 1pF X7R/X7T/X7P: 20% DF: 2x initial standard IR: NPO 4000M or IR*Cr40S; X7R/X7T/X7P 2000M or IR*Cr50S | 1253, 100048 hours, Voltage dependent on rating (100V-1KV+). Tested after 48 hours at normal pressure & temperature. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect | Soldering MLCC on PCB, pressing direction based on diagram. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Quantity | Refer to Page 11 for details based on size and taping type. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Method Recommendation | RReflow Soldering, WWave Soldering. Refer to Page 13 for specific recommendations by size, characteristic, voltage, and capacitance. | N/A | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Temperature Profile | T150 temperature difference between soldering temperature and surface temperature of chips during preheating. | Refer to Page 14. | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
2509251626_AIDE-CAPACITOR-0805X7R153K251NT_C49326708.pdf
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