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Specifications
Voltage Rating:
50V
Capacitance:
1uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
1206X5R105K500NT
Model Number:
1206X5R105K500NT
Package:
1206
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCC) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. They are suitable for medium and high voltage MLCC applications.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Testing Conditions | ||||||||||||||
| Normal Condition | Temperature: 15~35 Humidity: 45~75%RH Atmosphere: 86~106kPa | N/A | ||||||||||||
| Relative Condition | Temperature: 252 Humidity: 60~70%RH Atmosphere: 86~106kPa | N/A | ||||||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||||||
| 1. Dimension Code | Codes & Sizes (inch/mm): 0201 (0.02*0.01 / 0.50*0.25) 0402 (0.04*0.02 / 1.00*0.50) 0603 (0.06*0.03 / 1.60*0.80) 0805 (0.08*0.05 / 2.00*1.25) 1206 (0.12*0.06 / 3.20*1.60) 1210 (0.12*0.10 / 3.20*2.50) 1808 (0.18*0.08 / 4.50*2.00) 1812 (0.18*0.12 / 4.50*3.20) 1825 (0.18*0.25 / 4.50*6.30) 2211 (0.22*0.11 / 5.70*2.8) 2225 (0.22*0.25 / 5.70*6.30) | N/A | ||||||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | ||||||||||||
| 3. Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | N/A | ||||||||||||
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | ||||||||||||
| 5. Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | N/A | ||||||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn | N/A | ||||||||||||
| 7. Packing | T: Tape/Reel, P: Bag packing (PE) | N/A | ||||||||||||
| Construction and Dimension | ||||||||||||||
| Construction | 1. Ceramic dielectric 2. Inner electrode 3. Outer electrode 4. Nickel layer 5. Tin layer | N/A | ||||||||||||
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | | Digital Calliper | ||||||||||||
| Specification and Testing Method | ||||||||||||||
| Temperature | -55~+125 | Naked eye (Visual inspection) | ||||||||||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Digital Calliper | ||||||||||||
| Static Capacity | NPO Characteristic: 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P Characteristic: 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | N/A | ||||||||||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF: 110%MHz, 1V0.2rms Cr1000pF: 110%KHz, 1V0.2rms X7R/X7T/X7P Characteristic: Cr10uF: 110%KHz, 1V0.1rms Cr10uF: 12024Hz, 0.5V0.1rms (See Note 1 for DF exceptions) | N/A | ||||||||||||
| IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF Testing Condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | N/A | ||||||||||||
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | N/A | ||||||||||||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | ||||||||||||
| Flexural Strength | Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | ||||||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after placing 242 hours at normal temp & humidity. | ||||||||||||
| Temperature Moisture Exposure | Capacity Change Rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C10% DF 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after placing 242 hours at normal temp & humidity. | ||||||||||||
| High Temperature Exposure | Capacity Change Rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after placing 48 hours under normal pressure & temperature. | ||||||||||||
| PCB Flexural Strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. Sizes: 0805(2012), 1206(3216), 1210(3225), 1812(4532), 2220(5750) with corresponding A, B, C dimensions. | ||||||||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||||||
| Code | A | B | C | D | E | F | G | H | J | T | ||||
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max | ||||
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max | ||||
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max | ||||
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max | ||||
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max | ||||
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||||||
| Code | Papersize W1 | L1 | D | C | B | P1 | P2 | P0 | d | t | ||||
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below | ||||
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | ||||
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below | ||||
| Code | A | B | C | D | E | F | G | H | J | T | ||||
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||||
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||||
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max | ||||
| Reel Dimensions (unit: mm) | ||||||||||||||
| Type | A | B | C | D | E | F | G | |||||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||||||
| Taping Specification | ||||||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||||||
| Packing Quantity | ||||||||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||||||
| 0603 | 4000 | - | ||||||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T1.60mm) | ||||||||||||
| 1210 | - | 3000 (T1.85mm), 1000 (T1.85mm) | ||||||||||||
| 1808 | - | 800 | ||||||||||||
| 1812 | - | 500 | ||||||||||||
| Precautions For Use | ||||||||||||||
| Soldering Profile | Refer to the graph in the enclosure page. Avoid sudden temperature change to prevent cracks. | |||||||||||||
| Manual Soldering | Risk of thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature. | |||||||||||||
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | |||||||||
| 1005 | NPO | / | / | R | X7R/X5R/X7S/X6S | / | / | R | ||||||
| 0201 | NPO | / | / | R | X7R/X5R/X7S/X6S | / | / | R | Y5V | / | / | R | ||
| 0402 | NPO | / | / | R | X7R/X5R/X7S/X6S | / | / | R | Y5V | / | / | R | ||
| 0603 | NPO | / | / | R/W | X7R/X5R/X7S/X6S | C1uf | R | C1uf | R/W | Y5V | C1uf | R | C1uf | R/W |
| 0805 | NPO | / | / | R/W | X7R/X5R/X7S/X6S | C4.7uf | R | C4.7uf | R/W | Y5V | C1uf | R | C1uf | R/W |
| 1206 | NPO | / | / | R/W | X7R/X5R/X7S/X6S | C10uf | R | C10uf | R/W | Y5V | C10uf | R | C10uf | R/W |
| 1210 | NPO | / | / | R | X7R/X5R/X7S/X6S | / | / | R | Y5V | / | / | R | ||
| Soldering method: | RReflow Soldering, WWave Soldering | |||||||||||||
| Soldering Temperature Profile | Preheating: Keep temperature difference between soldering temperature and surface temperature of chips as T150. | |||||||||||||
2509251626_AIDE-CAPACITOR-1206X5R105K500NT_C49326735.pdf
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