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Specifications
Voltage Rating:
10V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
1206X5R106K100NT
Model Number:
1206X5R106K100NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and lighting circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics (C0G, X7R, X5R) with precise capacitance, tolerance, and voltage ratings. They are manufactured with a ceramic dielectric, inner and outer electrodes, and nickel/tin plating for reliable performance.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| 1. Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| 2. Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature characteristic (C0G, X7R, X5R) Nominal electrostatic capacity (pF) Tolerance of electrostatic capacity (B, C, D, F, G, J, K, M, Z) Rated voltage (DC) (V) Terminal composition (Au/Ag-Ni-Sn) Packing (T: Tape/Reel, P: Bag packing) | ||
| 3. Construction | Ceramic dielectric | N/A | |
| Inner electrode | N/A | ||
| 4. Dimensions | Code | L*W (inch) | L*W (mm) |
| 0201 | 0.02*0.01 | 0.50*0.25 | |
| 0402 | 0.04*0.02 | 1.00*0.50 | |
| 0603 | 0.06*0.03 | 1.60*0.80 | |
| 0805 | 0.08*0.05 | 2.00*1.25 | |
| 1206 | 0.12*0.06 | 3.20*1.60 | |
| 1210 | 0.12*0.10 | 3.20*2.50 | |
| 1808 | 0.18*0.08 | 4.50*2.00 | |
| 1812 | 0.18*0.12 | 4.50*3.20 | |
| 1825 | 0.18*0.25 | 4.50*6.30 | |
| 2211 | 0.22*0.11 | 5.70*2.8 | |
| 2225 | 0.22*0.25 | 5.70*6.30 | |
| 5. Temperature Characteristic | C0G | 0 30 PPM/ | N/A |
| X7R | 15% | N/A | |
| X5R | 15% | N/A | |
| 6. Specification and Testing Method | Temperature Range | -55~+125 | N/A |
| Static Capacity | Meet standard specification and tolerance | NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: Cr1000pF, 110%MHz, 1V0.2rms; Cr1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 110%KHz, 1V0.1rms; Cr10uF, 12024Hz, 0.5V0.1rms. | |
| Insulation Resistance (IR) | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5x rated voltage; Ur=200V/250V, 2.0x rated voltage; Ur=450/500/630V, 1.5x rated voltage; 1KVUr2KV, 1.2x rated voltage; 2KVUr, 1.1x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| Solderability | Soldering area90%, No Damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| Resistance to the heat of soldering | No Damage, Soldering area90% | Pre-heating temperature 100-200, time 102s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF (larger reading); X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | N/A | |
| Flexural strength | No damage; Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB; PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm; Flexural depth: 1mm; Bend speed: 0.5mm/sec. | |
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| Thermal shock | NPO: C/C2.5% or 0.25pF (larger reading); X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. | |
| Temperature moisture exposure | Visual No visual damage; Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%; DF 2 times initial standard; IR: NPO: IR2500M or IR*Cr25S (Lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. | |
| High temperature exposure | Visual No visual damage; Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%; DF 2 X initial standard; IR: NPO: IR4000M or IR*Cr40S (Lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. | |
| PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, then pressing direction based on the photo. | |
| 7. Packing Quantity | Paper T/R (Pcs) | 0201: 5000, 0402: 10000, 0603: 4000, 0805: 4000, 1206: 4000 | N/A |
| Plastic T/R (Pcs) | 0805: 3000, 1206: 3000 (T1.35mm), 2000 (T>1.35mm), 1210: 2000 (T1.60mm), 3000 (T>1.60mm), 1808: 2000, 1812: 1000 (T1.85mm), 800 (T>1.85mm), 1812: 500 | N/A | |
| 8. Precautions For Use | MLCCs may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Follow "precautions for safety" and Application Notes. Soldering profile, manual soldering, and optimum solder amount are critical. Refer to adjacent graphs for soldering profiles. | ||
| 9. Recommended Soldering Method | RReflow Soldering, WWave Soldering. Specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance. | ||
| 10. Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as T150 during preheating. | ||
2509251626_AIDE-CAPACITOR-1206X5R106K100NT_C49326736.pdf
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