Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonant functions in various power supply and electronic circuits. Key application areas include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight units, and energy-saving lamps. These MLCCs are suitable for medium and high voltage requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperite of energy saving lamps. (Medium and High voltage MLCC) | - |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - |
| Part Number Description Example | 1812 X7R 684 M 251 N T | - |
| Dimension Codes & Sizes | 0201: 0.02*0.01 inch (0.50*0.25 mm) 0402: 0.04*0.02 inch (1.00*0.50 mm) 0603: 0.06*0.03 inch (1.60*0.80 mm) 0805: 0.08*0.05 inch (2.00*1.25 mm) 1206: 0.12*0.06 inch (3.20*1.60 mm) 1210: 0.12*0.10 inch (3.20*2.50 mm) 1808: 0.18*0.08 inch (4.50*2.00 mm) 1812: 0.18*0.12 inch (4.50*3.20 mm) 1825: 0.18*0.25 inch (4.50*6.30 mm) 2211: 0.22*0.11 inch (5.70*2.8 mm) 2225: 0.22*0.25 inch (5.70*6.30 mm) | - |
| Temperature Characteristic Codes | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Nominal Electrostatic Capacity | 8R0=8.0pF, 100=10pF, 101=100pF | - |
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - |
| Rated Voltage (DC) | 250=25V, 251=250V, 252=2500V | - |
| Packing Codes | T: Tape/Reel, P: Bag packing (PE) | - |
| Construction Components | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer | - |
| Dimensions (mm) | 0201 (0603): L: 0.600.10, W: 0.300.05, T: 0.300.05, WB: 0.100.05 0402 (1005): L: 1.000.15, W: 0.500.15, T: 0.500.10, WB: 0.200.10 0603 (1608): L: 1.600.20, W: 0.800.15, T: 0.800.15, WB: 0.300.10, T2: 0.600.10 0805 (2012): L: 2.000.20, W: 1.250.20, T: 0.800.20, WB: 1.000.20, T2: 0.500.20, T3: 1.250.20, T4: 0.800.20 1206 (3216): L: 3.200.30, W: 1.600.30, T: 1.000.20, WB: 1.250.20, T2: 0.600.30, T3: 1.600.30 1210 (3225): L: 3.200.30, W: 2.500.30, T: 2.70, WB: 0.800.30 1808 (4520): L: 4.500.40, W: 2.000.20, T: 2.70, WB: 0.800.30 1812 (4532): L: 4.500.40, W: 3.200.30, T: 3.50, WB: 0.800.30 1825 (4563): L: 4.500.40, W: 6.300.50, T: 3.50, WB: 0.800.30 2220 (5750): L: 5.700.50, W: 5.000.50, T: 3.50, WB: 1.000.40 2225 (5763): L: 5.700.50, W: 6.300.50, T: 6.20, WB: 1.000.40 | Digital Caliper |
| Temperature Range | -55~+125 | - |
| Visual Inspection | No Damage | Naked eye |
| Static Capacity Specification | NPO: 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P: 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | - |
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr). Testing frequency 110%MHz, voltage 1V0.2rms (Cr1000pF); Testing frequency 110%KHz, voltage 1V0.2rms (Cr>1000pF). X7R/X7T/X7P: 10uF: 1KHz10%, 1V0.1rms; >10uF: 120Hz24, 0.5V0.1rms. | - |
| Insulation Resistance (IR) | NPO: IR50000M (C10nF); IR*Cr500S (C>10nF). Testing condition: Rated voltage, 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P: IR10000M (C25nF); IR*Cr100S (C>25nF). | - |
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S. | - |
| Solderability | Soldering area 90%. Pre-heating: 80-120, 10-30s. Solder: lead-free, flux. Soldering temperature: 2455, Solder time: 20.5s. | Visual |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200, 102s. Soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | - |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%. Flexural depth: 452mm. | Visual |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | - |
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10%. Run 5 cycles. Test after 242 hours at normal temp & humidity. | - |
| Temperature Moisture Exposure | Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S (lower reading); X7R/X7T/X7P: IR1000M or IR*Cr25S (lower reading). Test condition: 402, 90~95%RH, 50024 hours. Test after 242 hours at normal temp & humidity. | Visual |
| High Temperature Exposure | Capacity Change Rate: NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S (lower reading); X7R/X7T/X7P: IR2000M or IR*Cr50S (lower reading). Test condition: 1253, 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours at normal pressure & temperature. | Visual |
| PCB Flexural Strength | No crack and other defect. IR. SIZE A B C: 0805(2012): 1.2 4 1.65; 1206(3216): 2.2 5 2; 1210(3225): 2.2 5 2.9; 1812(4532): 3.5 7 3.7; 2220(5750): 4.5 8 5.6. | - |
| Embossed Plastic Taping Dimensions | 0805: Tape size: 1.550.20, A: 2.350.20, B: 8.000.20, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.10, G: 4.000.10, H: 1.50 -0/+0.10, J: 1.50 Max. 1206: Tape size: 1.950.20, A: 3.600.20, B: 8.000.20, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.10, G: 4.000.10, H: 1.50 -0/+0.10, J: 1.85 Max. 1210: Tape size: 2.700.10, A: 3.420.10, B: 8.000.10, C: 3.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.05, G: 4.000.10, H: 1.55 -0/+0.10, J: 3.2 Max. 1808: Tape size: 2.200.10, A: 4.950.10, B: 12.000.10, C: 5.500.05, D: 1.750.10, E: 4.000.10, F: 2.000.05, G: 4.000.10, H: 1.50 -0/+0.10, J: 3.0 Max. 1812: Tape size: 3.660.10, A: 4.950.10, B: 12.000.10, C: 5.500.05, D: 1.750.10, E: 8.000.10, F: 2.000.05, G: 4.000.10, H: 1.55 -0/+0.10, J: 4.0 Max. | - |
| Paper Tape Reel Packing Dimensions | 1005: W1: 0.240.02, L1: 0.450.02, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.30 Below. 0201: W1: 0.370.10, L1: 0.670.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below. 0402: W1: 0.650.10, L1: 1.150.10, D: 8.000.10, C: 3.500.05, B: 1.750.10, P1: 2.000.05, P2: 2.000.05, P0: 4.000.10, d: 1.50 -0/+0.10, t: 0.80 Below. 0603: A: 1.100.10, B: 1.900.10, C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max. 0805: A: 1.450.15, B: 2.300.15, C: 8.00.15, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max. 1206: A: 1.800.20, B: 3.400.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max. | - |
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | - |
| Packing Quantity | Paper T/R (Pcs): 0603: 4000, 0805: 4000, 1206: 4000. Plastic T/R (Pcs): 0805: 3000 (T1.35mm), 1206: 3000 (T1.60mm), 1210: 2000 (T1.85mm), 1812: 1000 (T1.85mm), 1812 above: 800, 2220: 500. | - |
| Soldering Method Recommendation | 1005: NPO/X7R/X5R/X7S/X6S: R; Y5V: R. 0201: NPO/X7R/X5R/X7S/X6S: R; Y5V: R. 0402: NPO/X7R/X5R/X7S/X6S: R; Y5V: R. 0603: NPO: R/W; X7R/X5R/X7S/X6S: C1uf R, C1uf R/W; Y5V: C1uf R, C1uf R/W. 0805: NPO: R/W; X7R/X5R/X7S/X6S: C4.7uf R, C4.7uf R/W; Y5V: C1uf R, C1uf R/W. 1206: NPO: R/W; X7R/X5R/X7S/X6S: C10uf R, C10uf R/W; Y5V: C10uf R, C10uf R/W. 1210: NPO: R; X7R/X5R/X7S/X6S: R; Y5V: R. (RReflow Soldering, WWave Soldering) | - |
| Soldering Temperature Profile | Preheating: Temperature difference between soldering temperature and surface temperature of chips T150. | - |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can result in burn out, flaming, or glowing. Adhere to the following precautions and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the temperature profile to avoid cracks from sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure careful handling of the soldering iron tip and select appropriate tip temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
2509251626_AIDE-CAPACITOR-1206X5R106K500NT_C49326740.pdf
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