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quality Multi layer Ceramic Capacitor AIDE CAPACITOR 1206X5R106M500NT for High Voltage Circuits and Power Supplies factory
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quality Multi layer Ceramic Capacitor AIDE CAPACITOR 1206X5R106M500NT for High Voltage Circuits and Power Supplies factory
>
Specifications
Voltage Rating:
50V
Capacitance:
10uF
Temperature Coefficient:
X5R
Tolerance:
±20%
Mfr. Part #:
1206X5R106M500NT
Model Number:
1206X5R106M500NT
Package:
1206
Key Attributes
Product Description

Product Overview

This Multi-layer Ceramic Capacitor (MLCC) is designed for high-voltage applications, including coupling, wave filtering, and resonant functions. It is suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
  • RoHS/REACH Compliance: Meets RoHS and REACH standards.

Technical Specifications

Item Description/Specification Details
Application Field High voltage circuits including coupling, wave filtering, and resonant applications.
Suitable for switch power suppliers, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power suppliers, amperite of energy saving lamps.
Testing Conditions Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Example: 1812 X7R 684 M 251 N T
Item Description
1. Dimension Code 0201 (0.02*0.01 in / 0.50*0.25 mm), 0402 (0.04*0.02 in / 1.00*0.50 mm), 0603 (0.06*0.03 in / 1.60*0.80 mm), 0805 (0.08*0.05 in / 2.00*1.25 mm), 1206 (0.12*0.06 in / 3.20*1.60 mm), 1210 (0.12*0.10 in / 3.20*2.50 mm), 1808 (0.18*0.08 in / 4.50*2.00 mm), 1812 (0.18*0.12 in / 4.50*3.20 mm), 1825 (0.18*0.25 in / 4.50*6.30 mm), 2211 (0.22*0.11 in / 5.70*2.8 mm), 2225 (0.22*0.25 in / 5.70*6.30 mm)
2. Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
3. Nominal Electrostatic Capacity 8R0 (8.0 pF), 100 (10 pF), 101 (100 pF)
4. Tolerance of Electrostatic Capacity B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20%
5. Rated Voltage (DC) 250 (25V), 251 (250V), 252 (2500V)
6. Terminal Composition Au/Ag-Ni-Sn (From the inside out)
7. Packing T (Tape/Reel), P (Bag packing)
Construction 1. Ceramic dielectric
2. Inner electrode
3. Outer electrode
4. Nickle layer
5. Tin layer
Dimensions (mm) Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specifications and Testing Methods Temperature Range -55~+125
Visual/Dimension 1. No Damage, 2. Dimension meet Spec. Tested by Naked eye (Visual inspection) and Digital calliper.
Static Capacity Meets standard specification and tolerance. NPO characteristic: 1000pF at 1MHz10%, 1.00.2Vrms; >1000pF at 1KHz10%, 1.00.2Vrms. X7R/X7T/X7P characteristic: 10uF at 1KHz10%, 1.00.2Vrms; >10uF at 120Hz24, 0.50.1Vrms.
Dissipation Factor (DF) NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr). Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms. Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. X7R/X7T/X7P characteristic: see Note 1. Cr10uF, Test frequency 110%KHz, Voltage 1V0.1rms. Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms.
IR Insulation Resistance NPO Characteristic: IR50000M, C10nF; IR*Cr500S, C10nF. Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA. X7R/X7T/X7P Characteristic: IR10000M, C25nF; IR*Cr100S, C25nF.
Hi-pot (DC) No dielectric breakdown or damage. Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S.
Solderability Soldering area 90%. Visual-No damage. Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455. Solder time 20.5s.
Resistance to the heat of soldering Visual-No damage, soldering area 90%. Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours.
Electrostatic Capacity Change Rate NPO Characteristic: |C/C| 0.5% or 0.5pF (larger reading). X7R: |C/C| 15%. X7T: -33% C/C 22%. X7P: |C/C| 10%.
Flexural Strength No damage. Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Electro static capacity change rate: |C/C| 10%. Flexural depth 452.
Terminal Bonding Strength No visual damage. Applied Force: 5N, Duration: 101S.
Thermal Shock NPO Characteristic: |C/C| 2.5% or 0.25pF (larger reading). X7R/X7P characteristic: |C/C| 0.5%. X7T characteristic: |C/C| 10%. Run 5 cycles. Test after place 242 hours normal temp & humidity.
Temperature Moisture Exposure Visual No visual damage. Test after place 242 hours normal temp & humidity. Temperature 402, Humidity 90~95%RH, time 50024 hours. Electrostatic capacitance change rate: NPO characteristic: |C/C| 2% or 1pF (larger reading). X7R/X7T/X7P characteristic: |C/C| 10%. DF 2 times initial standard. IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading). X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading).
High Temperature Exposure Visual No visual damage. Test after place 48hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Electrostatic capacitance change rate: NPO: |C/C| 2% or 1pF (larger reading). X7R/X7T/X7P: |C/C| 20%. DF 2 X initial standard. IR NPO: IR4000M or IR*Cr40S (Lower reading). X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading).
PCB Flexural Strength No crack and other defect. IR. Tested by pressing direction. SIZE A B C: 0805(2012) 1.2 4 1.65; 1206(3216) 2.2 5 2; 1210(3225) 2.2 5 2.9; 1812(4532) 3.5 7 3.7; 2220(5750) 4.5 8 5.6.
Embossed Plastic Taping Embossed Tape Reel Packing (0805(2012)~1812(4532) type) Tape Size (mm): A: 1.550.20, B: 2.350.20, C: 8.000.20, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.50 Max (for 0805); T: 1.85 Max (for 1206); T: 3.2 Max (for 1210); T: 3.0 Max (for 1808); T: 4.0 Max (for 1812).
Top tape peeling strength Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Paper Tape Reel Packing (1005, 0201, 0402 type) Paper Size (mm): W1: 0.240.02, L1: 0.450.02 (for 1005); W1: 0.370.10, L1: 0.670.10 (for 0201); W1: 0.650.10, L1: 1.150.10 (for 0402). Other dimensions: C: 8.000.10, B: 3.500.05, P1: 1.750.10, P2: 2.000.05, P0: 2.000.05, d: 4.000.10, t: 1.50 -0/+0.10.
(0603, 0805, 1206 types) Paper Size (mm): A: 1.100.10, B: 1.900.10 (for 0603); A: 1.450.15, B: 2.300.15 (for 0805); A: 1.800.20, B: 3.400.20 (for 1206). Other dimensions: C: 8.000.10, D: 3.500.05, E: 1.750.10, F: 4.000.10, G: 2.000.10, H: 4.000.10, J: 1.50 -0/+0.10, T: 1.10 Max.
Reel Dimensions 7' REEL 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
13' REEL 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
Packing Quantity Paper T/R (Pcs) 0603: 4000, 0805: 4000, 1005: 4000, 1206: 4000
Plastic T/R (Pcs) 0805: 3000, 1206: 3000 (T1.35mm), 2000 (T>1.35mm), 1210: 2000 (T1.60mm), 3000 (T>1.60mm), 1808: 2000, 1812: 1000 (T1.85mm), 1000 (T>1.85mm), 1812: 800, 2220: 500.
Recommended Soldering Method Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering method: RReflow Soldering, WWave Soldering

Precautions for Use: MLCCs may fail in short or open circuit modes under severe electrical/mechanical stress beyond specified ratings. Follow safety precautions and application notes. Contact engineering for handling questions.

Soldering Profile: To avoid cracks from sudden temperature changes, follow the provided temperature profile graph.

Manual Soldering: Risk of thermal cracks exists. Handle soldering iron carefully, paying attention to tip selection and temperature contact.

Optimum Solder Amount for Reflow Soldering: Recommended soldering amounts are provided.

Soldering Temperature Profile: Keep the temperature difference between soldering temperature and surface temperature of chips 150 during preheating.


2509251626_AIDE-CAPACITOR-1206X5R106M500NT_C49326742.pdf

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