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quality ceramic capacitor for LCD backlight power supplies AIDE CAPACITOR 0402X7R104K250NT energy saving lamp applications factory
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quality ceramic capacitor for LCD backlight power supplies AIDE CAPACITOR 0402X7R104K250NT energy saving lamp applications factory
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Specifications
Voltage Rating:
25V
Capacitance:
100nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0402X7R104K250NT
Model Number:
0402X7R104K250NT
Package:
0402
Key Attributes
Product Description

Product Overview

High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are suitable for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer robust performance and are available in various sizes and dielectric characteristics to meet specific circuit requirements.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminals)
  • Certifications: RoHS/REACH compliant

Technical Specifications

Item Description Specification
Application Field Coupling, wave filtering, resonant in high voltage circuits
Switch power supplier
AC-DC power charger
DC-DC power charger
Networking/Communication interface
LCD backlight unit power supplier
Amperite of energy saving lamps
(Medium and High voltage MLCC)
Testing Conditions Normal Condition Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity 8R08.0, 10010, 101100 (pF)
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) 250 25V, 251 250V, 252 2500V
Terminal Composition Au/Ag-Ni-Sn (From the inside out)
Packing T Tape/Reel, P Bag packing (PE)
Construction and Dimension Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickel layer, 5. Tin layer
Dimension (mm) Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method Temperature -55~+125 N/A
Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital caliper
Static Capacity Meet standard specification and tolerance Refer to specification for NPO and X7R/X7T/X7P characteristics
Dissipation Factor (DF) Refer to specification for NPO and X7R/X7T/X7P characteristics Refer to specification for testing frequencies and voltages
IR Insulation Resistance NPO: IR50000M, C10nF; IR*Cr500S, C10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage Based on rated voltage (Ur): 1.1x to 2.5x Ur. Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area 90% Pre-heating: 80-120 (10-30s), Solder: Lead-free, Flux. Temp: 2455, Time: 20.5s
Resistance to the heat of soldering No visual damage, soldering area 90% Pre-heating: 100-200 (102s), Soldering Temp: 2655 (51s). Cleaning, Room temp. (242 hours)
Electrostatic Capacity Change Rate NPO: 0.5% or 0.5pF. X7R: 15%. X7T: -33% to 22%. X7P: 10%. Refer to specification for testing conditions.
Flexural Strength No damage. Electrostatic capacity change rate 10% Base board: Al2O3/PCB. Flexural depth: 1mm. Bend speed: 0.5mm/sec.
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO: 2.5% or 0.25pF. X7R/X7P: 0.5%. X7T: 10%. 5 cycles. Test after 242 hours at normal temp & humidity.
Temperature Moisture Exposure Visual: No visual damage. Capacity change rate: NPO 2% or 1pF. X7R/X7T/X7P 10%. DF 2 times initial standard. IR: NPO 2500M or IR*Cr 25S. X7R/X7T/X7P 1000M or IR*Cr 25S. Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours at normal temp & humidity.
High Temperature Exposure Visual: No visual damage. Capacity change rate: NPO 2% or 1pF. X7R/X7T/X7P 20%. DF 2 X initial standard. IR: NPO 4000M or IR*Cr 40S. X7R/X7T/X7P 2000M or IR*Cr 50S. Temp: 1253, Time: 100048 hours. Voltage: 100V-1KV (1.2x to 2x Rated voltage). Test after 48 hours at normal pressure & temperature.
PCB Flexural Strength No crack and other defect Soldering MLCC on PCB, then pressing. Specific dimensions (A, B, C) provided for different sizes (0805 to 2220).
Embossed Plastic Taping Taping Specification Dimensions (A, B, C, D, E, F, G, H, J, T) provided for sizes 0805 to 1812. Refer to table for detailed dimensions.
Reel Dimensions 7' REEL (1782.0), 13' REEL (3302.0) Specific dimensions for A, B, C, D, E, F, G.
Top Tape Peeling Strength 0.1N < peeling strength < 0.7N No paper dirty remains on the scotch when peeling.
Paper Tape Reel Packing Paper Tape Reel Packing for 1005, 0201, 0402 types Dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) provided. Refer to table for detailed dimensions.
Paper Tape Reel Packing for 0603, 0805, 1206 types Dimensions (A, B, C, D, E, F, G, H, J, T) provided. Refer to table for detailed dimensions.
Packing Quantity Paper T/R (Pcs) 4000 (0603, 0805), 3000 (1206) Specific quantities for different sizes and tape types.
Plastic T/R (Pcs) 3000 (0805, 1210), 2000 (1808, 1812), 1000 (1812+), 800 (2220), 500 (2225) Specific quantities for different sizes and tape types.
Recommended Soldering Method RReflow Soldering, WWave Soldering Details provided for each size and capacitance range. Refer to table for specific recommendations.
Soldering Temperature Profile T150 temperature difference between soldering temperature and surface temperature of chips during preheating. Refer to adjacent graph (enclosure page).

2509251626_AIDE-CAPACITOR-0402X7R104K250NT_C48579248.pdf

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