Product Overview
This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage circuits. It is suitable for applications such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCC offers various temperature characteristics, including C0G, X7R, and X5R, with precise capacitance tolerances and rated voltages. It is constructed with ceramic dielectric, inner and outer electrodes, and nickel and tin plating, ensuring reliable performance and durability.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Compliance: ROHS/REACH compliant
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |||||||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |||||||||
| Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |||||||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | |||||||||
| Packing | T Tape/Reel, P Bag packing (PE) | |||||||||
| Construction | ||||||||||
| 1 | Ceramic dielectric | |||||||||
| 2 | Inner electrode | |||||||||
| 3 | Outer electrode | |||||||||
| 4 | Nickle layer | |||||||||
| 5 | Tin layer | |||||||||
| Dimension (mm) | ||||||||||
| Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| Specification and Testing Method | ||||||||||
| Temperature | -55~+125 | |||||||||
| Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | ||||||||
| Static Capacity | Meet standard specification and tolerance | NPO characteristic: Capacity Frequency Voltage 1000pF 1MHz10 % 1.0 0.2Vrms 1000 pF 1KHz10% 1.0 0.2Vrms X7R/X7T/X7P characteristic: Capacity Frequency Voltage 10uF 1KHz10% 1.0 0.2Vrms 10uF 120Hz24 0.5 0.1Vrms | ||||||||
| Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF, Testing frequency 110%MHz, Testing voltage 1V0.2rms Cr1000pF, Testing frequency 110%KHz, Testing voltage 1V0.2rms. X7R/X7T/X7P characteristic: see Note 1 Cr10uF, Test frequency 110%KHz,Voltage 1V0.1rms . Cr10uF, Frequency 12024Hz, Voltage 0.5V0.1rms | |||||||||
| IR Insulation Resistance | NPO Characteristic: IR50000M,C10nF IR*Cr500S,C10nF Testing condition : Rated voltage Time:605s Humidity:75% Temperature:255 Current :50mA X7R/X7T/X7P Characteristic : IR10000M,C25nF IR*Cr100S,C25nF | |||||||||
| Hi-pot (DC) | No dielectric breakdown or damage Ur=100V,...............2.5 x rated voltage Ur=200V/250V,.... 2.0 x rated voltage Ur=450/500/630V,1.5 x rated voltage 1KVUr2KV,.......1.2 x rated voltage 2KVUr,...............1.1 x rated voltage Voltage Raising time:110S, Voltage maintaining time2S | |||||||||
| Solderability | soldering area90% | Visual-No damage Pre-heating temperature 80-120,time10-30s, lead free solder, flux Soldering temperature 2455 Solder time 20.5s | ||||||||
| Resistance to the heat of soldering | Visual Visual-No damage, soldering area90% | Pre-heating temperature 100-200,time102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature , time :242 hours. | ||||||||
| Electrostatic capacity change rate | NPO Characteristic: C/C0.5% or 0.5pF larger reading X7R :C/C15% X7T -33% C/C22% X7PC/C10% | |||||||||
| DF | Refer to NO#4 | |||||||||
| IR | Refer to NO#5 | |||||||||
| Flexural strength | No damage | Base boardAl2O3 /PCB PCB dimension Thickness: 1.6mm Length: 100mm Width: 40mm Flexural depth: 1mm Bend speed: 0.5mm/sec. Unit: mm Test it under the flexural status Electro static capacity change rate C/C10% Flexural deepth 452 452 | ||||||||
| Terminal bonding strength | No visual damage | Applied Force: 5N Duration: 101S | ||||||||
| Thermal shock | NPO Characteristic; C/C2.5% or 0.25pF ( larger reading) X7R/X7P- characteristic: C/C0.5% X7T characteristic C/C10% | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours,start to testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | ||||||||
| Temperature moisture exposure | Visual No visual damage Temperature 402 Humidity 90~95%RH time 500+24 hours electrostatic capacitance change rate NPO characteristic: C/C2% or 1pF (larger reading ) X7R/X7T/X7P characteristic: C/C10% DF 2 times initial standard IR NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P : IR1000M or IR*Cr25S (Lower reading) | Test it after place 242 hours normal temp & humidity | ||||||||
| High temperature exposure | Visual No visual damage Charging and discharging current 50mA Max. Temperature 1253 Time 100048 hours Voltage 100VV250V 2x Rated voltage 250VV1KV 1.5x rated voltage 1KVV 1.2x rated voltage electrostatic capacitance change rate NPO : C/C2% or 1pF (larger reading ) X7R/X7T/X7P: C/C20% DF 2 X initial standard IR NPO : IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P : IR2000M or IR*Cr50S (Lower reading) | Test it after place 48 hours under normal pressure & temperature | ||||||||
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB (Photo1), Then pressing direction base on the photo 2. | ||||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
| Code | A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| Code | W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Type | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping Specification | ||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||
| Packing Quantity | ||||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | |||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | 3000 (T1.35mm) | |||||||||
| 1210 | 2000 (T1.60mm) | |||||||||
| 1808 | 3000 (T1.60mm) | |||||||||
| 1812 | 2000 | |||||||||
| 1812 | 1000 (T1.85mm) | |||||||||
| 1000 (T1.85mm) | ||||||||||
| 800 | ||||||||||
| 500 | ||||||||||
| Precautions For Use | ||||||||||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | |||||||||
| Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | |||||||||
| Optimum Solder Amount for Reflow Soldering | ||||||||||
| Recommended Soldering amounts | ||||||||||
| Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method | ||||||
| 1005 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| 0201 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0402 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| 0603 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 0805 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |||||||
| C4.7uf | R/W | |||||||||
| Y5V | / | C1uf | R | |||||||
| C1uf | R/W | |||||||||
| 1206 | NPO | / | / | R/W | ||||||
| X7R/X5R/X7S/X6S | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| Y5V | / | C10uf | R | |||||||
| C10uf | R/W | |||||||||
| 1210 | NPO | / | / | R | ||||||
| X7R/X5R/X7S/X6S | / | / | R | |||||||
| Y5V | / | / | R | |||||||
| Soldering methodRReflow Soldering WWave Soldering | ||||||||||
| The temperature profile for soldering | ||||||||||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||||||||
2509251626_AIDE-CAPACITOR-0603X7R221K500NT_C48579290.pdf
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