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Specifications
Voltage Rating:
50V
Capacitance:
2.2nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0603X7R222K500NT
Model Number:
0603X7R222K500NT
Package:
0603
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, offering reliable performance under specified conditions.
Product Attributes
- Temperature Characteristics: C0G (030 PPM/), X7R (15%), X5R (15%)
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method |
|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||
| Testing Conditions: Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |||
| Part Number Description | Example | 1812 X7R 684 M 251 N T | See detailed breakdown below |
| Dimension Codes (L*W) | Inch | 0.02*0.01 (0201), 0.04*0.02 (0402), 0.06*0.03 (0603), 0.08*0.05 (0805), 0.12*0.06 (1206), 0.12*0.10 (1210), 0.18*0.08 (1808), 0.18*0.12 (1812), 0.18*0.25 (1825), 0.22*0.11 (2211), 0.22*0.25 (2225) | - |
| Dimension Codes (L*W) | mm | 0.50*0.25 (0201), 1.00*0.50 (0402), 1.60*0.80 (0603), 2.00*1.25 (0805), 3.20*1.60 (1206), 3.20*2.50 (1210), 4.50*2.00 (1808), 4.50*3.20 (1812), 4.50*6.30 (1825), 5.70*2.8 (2211), 5.70*6.30 (2225) | - |
| Temperature Characteristic | Code | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Nominal Electrostatic Capacity | Example | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | - |
| Tolerance of Electrostatic Capacity | Code | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | - |
| Rated Voltage (DC) | Example | 250 (25V), 251 (250V), 252 (2500V) | - |
| Packing | Code | T (Tape/Reel), P (Bag packing) | - |
| Construction | Item | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | - |
| Dimension (mm) | Part Number | L W T WB | British System Metric System |
| 0201 (0603) | 0.600.10 0.300.05 0.300.05 0.100.05 | - | |
| Dimension (mm) | 0402 (1005) | 1.000.15 0.500.15 0.500.10 0.200.10 | - |
| 0603 (1608) | 1.600.20 0.800.15 0.800.15 0.300.10 0.600.10 | - | |
| 0805 (2012) | 2.000.20 1.250.20 0.800.20 1.000.20 0.500.20 1.250.20 0.800.20 | - | |
| 1206 (3216) | 3.200.30 1.600.30 1.000.20 1.250.20 0.600.30 1.600.30 | - | |
| 1210 (3225) | 3.200.30 2.500.30 2.70 0.800.30 | - | |
| 1808 (4520) | 4.500.40 2.000.20 2.70 0.800.30 | - | |
| 1812 (4532) | 4.500.40 3.200.30 3.50 0.800.30 | - | |
| 1825 (4563) | 4.500.40 6.300.50 3.50 0.800.30 | - | |
| 2220 (5750) | 5.700.50 5.000.50 3.50 1.000.40 | - | |
| 2225 (5763) | 5.700.50 6.300.50 6.20 1.000.40 | - | |
| Temperature Range | - | -55~+125 | - |
| Visual/Dimension | Specification | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper |
| Static Capacity | NPO Characteristic | 1000pF: 1MHz10%, 1.00.2Vrms 1000pF: 1KHz10%, 1.00.2Vrms | - |
| X7R/X7T/X7P Characteristic | 10uF: 1KHz10%, 1.00.2Vrms 10uF: 120Hz24, 0.50.1Vrms | - | |
| Dissipation Factor (DF) | NPO Characteristic | DF0.56, Cr5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr50pF) DF0.15%, (50pFCr) Cr1000pF: 110%MHz, 1V0.2rms Cr1000pF: 110%KHz, 1V0.2rms | - |
| X7R/X7T/X7P Characteristic | Cr10uF: 110%KHz, 1V0.1rms Cr10uF: 12024Hz, 0.5V0.1rms | See Note 1 | |
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF IR*Cr500S, C10nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF IR*Cr100S, C25nF | ||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | - |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | Visual-No damage |
| Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | Visual |
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. |
| X7R | C/C15% | - | |
| X7T | -33% C/C22% | - | |
| X7P | C/C10% | - | |
| Flexural Strength | No damage | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | Visual |
| Electro Static Capacity Change Rate (Flexural) | C/C10% | Flexural depth: 452 | - |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | - |
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | Pre-condition(X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. |
| X7R/X7P characteristic | C/C0.5% | ||
| X7T characteristic | C/C10% | ||
| Temperature Moisture Exposure | Visual | No visual damage | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. |
| Electrostatic Capacitance Change Rate | NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% | ||
| High Temperature Exposure | Visual | No visual damage | Temperature 1253, Time 100048 hours. Test after place 48 hours under normal pressure & temperature. |
| Electrostatic Capacitance Change Rate (High Temp) | NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% | Voltage: 100VV250V: 2x Rated voltage 250VV1KV: 1.5x rated voltage 1KVV: 1.2x rated voltage | - |
| PCB Flexural Strength | No crack and other defect | See dimensions A, B, C for different sizes (0805 to 2220) | IR Soldering the MLCC on the PCB, then pressing direction based on photo. |
| Embossed Plastic Taping (Reel Packing) | Dimensions | Tape size A, B, C, D, E, F, G, H, J, T for 0805 to 1812 types | - |
| Paper Tape Reel Packing | Dimensions | Paper size W1, L1, D, C, B, P1, P2, P0, d, t for 1005, 0201, 0402 types Paper size A, B, C, D, E, F, G, H, J, T for 0603, 0805, 1206 types | - |
| Reel Dimensions | - | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | - |
| Top Tape Peeling Strength | (a) Paper Taping, (b) Embossed Taping | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | - |
| Packing Quantity | Paper T/R (Pcs) | 0201: 10000, 0402: 10000, 0603: 4000, 0805: 4000, 1206: 4000 | - |
| Packing Quantity | Plastic T/R (Pcs) | 0805: 3000, 1206: 3000 (T1.35mm), 2000 (T>1.35mm), 1210: 2000 (T1.60mm), 3000 (T>1.60mm), 1808: 2000, 1812: 1000 (T1.85mm), 800 (T>1.85mm), 1812: 500 | - |
| Soldering Method | - | RReflow Soldering, WWave Soldering | See Recommended Soldering Method table |
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress beyond specified ratings. To prevent failure modes like burnout, flaming, or glowing, adhere to the following precautions and application notes. Consult the engineering section or factory for handling questions.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure proper soldering iron tip selection and temperature control. Avoid direct contact of the tip with the ceramic body.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
- Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and chip surface temperature T150.
2509251626_AIDE-CAPACITOR-0603X7R222K500NT_C48579292.pdf
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