Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in various sizes and dielectric characteristics (C0G, X7R, X5R), these MLCCs offer reliable performance in demanding electronic circuits.
Product Attributes
- Material: Ceramic dielectric, inner and outer electrodes with Nickel and Tin layers.
- Terminal Composition: Au/Ag-Ni-Sn (from inside out).
- Certifications: RoHS compliant, REACH compliant.
Technical Specifications
| Item | Description | Specification | |||
|---|---|---|---|---|---|
| Dimension Code | 0201 (0501) | L*W (inch): 0.02*0.01, L*W (mm): 0.50*0.25 | |||
| 0402 (1005) | L*W (inch): 0.04*0.02, L*W (mm): 1.00*0.50 | ||||
| 0603 (1608) | L*W (inch): 0.06*0.03, L*W (mm): 1.60*0.80 | ||||
| 0805 (2012) | L*W (inch): 0.08*0.05, L*W (mm): 2.00*1.25 | ||||
| 1206 (3216) | L*W (inch): 0.12*0.06, L*W (mm): 3.20*1.60 | ||||
| 1210 (3225) | L*W (inch): 0.12*0.10, L*W (mm): 3.20*2.50 | ||||
| 1808 (4520) | L*W (inch): 0.18*0.08, L*W (mm): 4.50*2.00 | ||||
| 1812 (4532) | L*W (inch): 0.18*0.12, L*W (mm): 4.50*3.20 | ||||
| 1825 (4563) | L*W (inch): 0.18*0.25, L*W (mm): 4.50*6.30 | ||||
| 2211 (5728) | L*W (inch): 0.22*0.11, L*W (mm): 5.70*2.8 | ||||
| 2220 (5750) | L*W (inch): 0.22*0.20, L*W (mm): 5.70*5.00 | ||||
| 2225 (5763) | L*W (inch): 0.22*0.25, L*W (mm): 5.70*6.30 | ||||
| Temperature Characteristic | C0G | (0 30 PPM/) | |||
| X7R | (15%) | ||||
| X5R | (15%) | ||||
| Nominal Electrostatic Capacity | 8R0 | 8.0 pF | |||
| 101 | 100 pF | ||||
| Tolerance of Electrostatic Capacity | M | 20% | |||
| Z | +80%/-20% | ||||
| Rated Voltage (DC) | 251 | 250 V | |||
| 252 | 2500 V | ||||
| Packing | T | Tape/Reel | |||
| Construction | Item 1 | Ceramic dielectric | |||
| Item 2 | Inner electrode | ||||
| Item 3 | Outer electrode | ||||
| Item 4 | Nickel layer | ||||
| Item 5 | Tin layer | ||||
| Dimensions (mm) | Part Number | L L | W W | T T | WB WB |
| 0201 (0603) | 0.60 0.10 | 0.30 0.05 | 0.30 0.05 | 0.10 0.05 | |
| 0402 (1005) | 1.00 0.15 | 0.50 0.15 | 0.50 0.10 | 0.20 0.10 | |
| 0603 (1608) | 1.60 0.20 | 0.80 0.15 | 0.80 0.15 | 0.30 0.10 | |
| 0805 (2012) | 2.00 0.20 | 1.25 0.20 | 0.80 0.20 | 0.50 0.20 | |
| 1206 (3216) | 3.20 0.30 | 1.60 0.30 | 1.00 0.20 | 0.60 0.30 | |
| 1210 (3225) | 3.20 0.30 | 2.50 0.30 | 2.70 | 0.80 0.30 | |
| 1808 (4520) | 4.50 0.40 | 2.00 0.20 | 2.70 | 0.80 0.30 | |
| 1812 (4532) | 4.50 0.40 | 3.20 0.30 | 3.50 | 0.80 0.30 | |
| 1825 (4563) | 4.50 0.40 | 6.30 0.50 | 3.50 | 0.80 0.30 | |
| 2220 (5750) | 5.70 0.50 | 5.00 0.50 | 3.50 | 1.00 0.40 | |
| 2225 (5763) | 5.70 0.50 | 6.30 0.50 | 6.20 | 1.00 0.40 | |
| WB | Width of back electrode | ||||
| T | Thickness | ||||
| Temperature Range | -55 ~ +125 | ||||
| Static Capacity | NPO | 1000pF: 1MHz10%, 1.00.2Vrms; >1000pF: 1KHz10%, 1.00.2Vrms | |||
| X7R/X7T/X7P | 10uF: 1KHz10%, 1.00.2Vrms; >10uF: 120Hz24, 0.50.1Vrms | ||||
| Dissipation Factor (DF) | NPO | Cr5pF: 0.56; 5pFCr50pF: 1.5[(150/Cr)+7]10-4; Cr50pF: 0.15% | |||
| X7R/X7T/X7P | Cr10uF: 1KHz10%, 1V0.1rms; Cr10uF: 12024Hz, 0.5V0.1rms | ||||
| Insulation Resistance (IR) | NPO | IR50000M (C10nF); IR*Cr500S (C10nF) | |||
| X7R/X7T/X7P | IR10000M (C25nF); IR*Cr100S (C25nF) | ||||
| Hi-pot (DC) | 1.1x to 2.5x Rated Voltage (depending on rated voltage) | ||||
| Solderability | Soldering area 90% | ||||
| Resistance to the heat of soldering | Visual-No damage, soldering area 90% | ||||
| Electrostatic Capacity Change Rate | NPO | 0.5% or 0.5pF | |||
| X7R | 15% | ||||
| X7T | -33% C/C 22% | ||||
| X7P | 10% | ||||
| Flexural Strength | Electro static capacity change rate 10% | ||||
| Terminal Bonding Strength | No visual damage, Applied Force: 5N | ||||
| Thermal Shock | NPO | 2.5% or 0.25pF | |||
| X7R/X7P | 0.5% | ||||
| X7T | 10% | ||||
| Temperature Moisture Exposure | Capacitance Change Rate (NPO) | 2% or 1pF | |||
| Capacitance Change Rate (X7R/X7T/X7P) | 10% | ||||
| DF | 2 times initial standard | ||||
| IR (NPO) | 2500M or IR*Cr25S | ||||
| IR (X7R/X7T/X7P) | 1000M or IR*Cr25S | ||||
| High Temperature Exposure | Capacitance Change Rate (NPO) | 2% or 1pF | |||
| Capacitance Change Rate (X7R/X7T/X7P) | 20% | ||||
| DF | 2 X initial standard | ||||
| IR (NPO) | 4000M or IR*Cr40S | ||||
| IR (X7R/X7T/X7P) | 2000M or IR*Cr50S | ||||
| PCB Flexural Strength | No crack and other defect | ||||
| Embossed Plastic Taping (mm) | 0805 | Tape Size: 1.55 0.20, A: 2.35 0.20, B: 8.00 0.20, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 1.50 Max | |||
| 1206 | Tape Size: 1.95 0.20, A: 3.60 0.20, B: 8.00 0.20, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 1.85 Max | ||||
| 1210 | Tape Size: 2.70 0.10, A: 3.42 0.10, B: 8.00 0.10, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.55 -0/+0.10, J: 3.2 Max | ||||
| 1808 | Tape Size: 2.20 0.10, A: 4.95 0.10, B: 12.00 0.10, C: 5.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 3.0 Max | ||||
| 1812 | Tape Size: 3.66 0.10, A: 4.95 0.10, B: 12.00 0.10, C: 5.50 0.05, D: 1.75 0.10, E: 8.00 0.10, F: 2.00 0.05, G: 4.00 0.10, H: 1.55 -0/+0.10, J: 4.0 Max | ||||
| Paper Tape Reel Packing (mm) | 1005 | Paper Size: 0.240.02, W1: 0.450.02, L1: 8.000.10, D: 3.500.05, C: 1.750.10, B: 2.000.05, P1: 2.000.05, P2: 4.000.10, P0: 1.50 -0/+0.10, t: 0.30 Below | |||
| 0201 | Paper Size: 0.370.10, W1: 0.670.10, L1: 8.000.10, D: 3.500.05, C: 1.750.10, B: 2.000.05, P1: 2.000.05, P2: 4.000.10, P0: 1.50 -0/+0.10, t: 0.80 Below | ||||
| 0402 | Paper Size: 0.650.10, W1: 1.150.10, L1: 8.000.10, D: 3.500.05, C: 1.750.10, B: 2.000.05, P1: 2.000.05, P2: 4.000.10, P0: 1.50 -0/+0.10, t: 0.80 Below | ||||
| 0603 | Paper Size: 1.10 0.10, A: 1.90 0.10, B: 8.00 0.10, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 1.10 Max | ||||
| 0805 | Paper Size: 1.45 0.15, A: 2.30 0.15, B: 8.0 0.15, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 1.10 Max | ||||
| 1206 | Paper Size: 1.80 0.20, A: 3.40 0.20, B: 8.00 0.20, C: 3.50 0.05, D: 1.75 0.10, E: 4.00 0.10, F: 2.00 0.10, G: 4.00 0.10, H: 1.50 -0/+0.10, J: 1.10 Max | ||||
| Reel Dimensions (mm) | 7' REEL | 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | |||
| 13' REEL | 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | ||||
| Packing Quantity | 0603 | Paper T/R: 4000 pcs | |||
| 0805 | Plastic T/R: 3000 pcs | ||||
| 1206 | Plastic T/R (T1.35mm): 3000 pcs; (T>1.35mm): 2000 pcs | ||||
| 1210 | Plastic T/R (T1.60mm): 3000 pcs; (T>1.60mm): 2000 pcs | ||||
| 1812 | Plastic T/R (T1.85mm): 1000 pcs; (T>1.85mm): 800 pcs | ||||
| 1812 Above | Plastic T/R: 500 pcs |
Precautions for Use
MLCCs may fail in short or open circuit modes under severe electrical or mechanical stress exceeding specified ratings. To prevent failure modes like burnout, flaming, or glowing, adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is appropriate and contact is carefully managed.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering Method: RReflow Soldering, WWave Soldering. Specific recommendations vary by size, temperature characteristic, rated voltage, and capacitance.
- Soldering Temperature Profile: Maintain a temperature difference T 150 between soldering temperature and chip surface temperature during preheating.
2509251626_AIDE-CAPACITOR-0603X7R474K500NT_C48579309.pdf
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