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Specifications
Voltage Rating:
630V
Capacitance:
100pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G101J631NT
Model Number:
0805C0G101J631NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, serving as coupling, wave filtering, and resonant components. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. Available in various sizes and temperature characteristics, these MLCCs offer reliable performance in demanding electrical environments.
Product Attributes
- Material: Ceramic dielectric with inner and outer electrodes, nickel layer, and tin layer.
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out).
- Certifications: ROHS/REACH compliant.
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | ||
| Coupling, wave filtering, resonant in high voltage circuits. | ||
| Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. | ||
| Testing Conditions | ||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| 3. Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | |
| 4. Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | |
| 5. Rated Voltage (DC) | 250 25, 251 250, 252 2500 (V) | |
| 6. Terminal Composition | Au/Ag-Ni-Sn | |
| 7. Packing | T Tape/Reel, P Bag packing (PE) | |
| Construction and Dimension | ||
| Construction | 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer | |
| Dimension (mm) | Part Number | L | W | T | WB 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 1210 (3225) | 3.200.30 | 2.500.30 (2.70) | 0.800.30 | 0.800.20 1808 (4520) | 4.500.40 | 2.000.20 (2.70) | 0.800.30 | 0.800.20 1812 (4532) | 4.500.40 | 3.200.30 (3.50) | 0.800.30 | 0.800.20 1825 (4563) | 4.500.40 | 6.300.50 (3.50) | 0.800.30 | 0.800.20 2220 (5750) | 5.700.50 | 5.000.50 (3.50) | 1.000.40 | 1.000.40 2225 (5763) | 5.700.50 | 6.300.50 (6.20) | 1.000.40 | 1.000.40 | Digital caliper |
| Specification and Testing Method | ||
| Temperature | -55~+125 | |
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) |
| Dissipation Factor (DF) | NPO: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: 1MHz10%, 1V0.2rms (Cr1000pF); 1KHz10%, 1V0.2rms (Cr1000pF) X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF); 120Hz24, 0.5V0.1rms (Cr10uF) |
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C10nF X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C25nF | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA |
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5x rated voltage; Ur=200V/250V, 2.0x rated voltage; Ur=450/500/630V, 1.5x rated voltage; 1KVUr2KV, 1.2x rated voltage; 2KVUr, 1.1x rated voltage. Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time: 242 hours. |
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | |
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity. |
| Temperature Moisture Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test it after place 242 hours normal temp & humidity. |
| High Temperature Exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test it after place 48 hours under normal pressure & temperature. |
| PCB Flexural Strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction based on the photo. |
| Embossed Plastic Taping | ||
| Embossed tape reel packing for 0805(2012)~1812(4532) type | Code | Tape size A | B | C | D | E | F | G | H | J T | 1.550.20 | 2.350.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.950.20 | 3.600.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.1 | 1.50 -0/+0.10 | 2.700.10 | 3.420.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | 2.200.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 4.000.10 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 3.660.10 | 4.950.10 | 12.000.10 | 5.500.05 | 1.750.10 | 8.000.10 | 2.000.05 | 4.000.10 | 1.55 -0/+0.10 | |
| Paper Tape Reel Packing | ||
| Paper tape reel packing for 10050402~12063216 | Code | Papersize W1 | L1 | D | C | B | P1 | P2 | P0 | d | t 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below 0603 | 1.100.10 | 1.900.10 | 8.000.10 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 0805 | 1.450.15 | 2.300.15 | 8.00.15 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max 1206 | 1.800.20 | 3.400.20 | 8.000.20 | 3.500.05 | 1.750.10 | 4.000.10 | 2.000.10 | 4.000.10 | 1.50 -0/+0.10 | 1.10 Max | |
| Reel Dimensions | ||
| Unit: mm | A | B | C | D | E | F | G 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | ||
| Taping Specification | ||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | (a) Paper Taping Reel type, (b) Embossed Taping Standard |
| Packing Quantity | ||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) 0603 | 4000 | 0805 | 4000 | 3000 (T1.35mm) 1206 | | 3000 (T1.60mm) / 2000 (T1.60mm) 1210 | | 1000 (T1.85mm) / 800 (T1.85mm) 1808 | | 500 1812 | | 500 | ||
| Precautions For Use | ||
| Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |
| Manual Soldering | Risk of creating thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |
| Recommended Soldering Method | Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method 1005 | NPO / X7R/X5R/X7S/X6S | / / | / / | R / R 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / C1uf / C1uf | R/W / R C1uf R/W / R C1uf R/W 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / C4.7uf / C1uf | R/W / R C4.7uf R/W / R C1uf R/W 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / C10uf / C10uf | R/W / R C10uf R/W / R C10uf R/W 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / / / | / / / | R / R / R | RReflow Soldering, WWave Soldering |
| Soldering Temperature Profile | Keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | |
2509251626_AIDE-CAPACITOR-0805C0G101J631NT_C48579316.pdf
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