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Specifications
Voltage Rating:
630V
Capacitance:
150pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G151J631NT
Model Number:
0805C0G151J631NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCC) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for a wide range of power supplies and electronic circuits such as switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs offer various temperature characteristics (C0G, X7R, X5R) and are available in a range of standard sizes and electrical ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Details |
|---|---|---|
| Application Field | High voltage circuits | |
| Function | Coupling, wave filtering, resonant | |
| Applications | Switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps | |
| Type | Medium and High voltage MLCC | |
| Testing Condition: Normal | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Testing Condition: Relative | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | |
| Part Number Description | Example: 1812 X7R 684 M 251 N T | |
| Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |
| Nominal Electrostatic Capacity | 8R0 (8.0pF), 100 (10pF), 101 (100pF) | |
| Tolerance of Electrostatic Capacity | B (0.1pF), C (0.25pF), D (0.5pF), F (1%), G (2%), J (5%), K (10%), M (20%), Z (+80%/-20%) | |
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | |
| Packing | T (Tape/Reel), P (Bag packing) | |
| Construction and Dimension | Construction Item | Description |
| 1 | Ceramic dielectric | |
| 2 | Inner electrode | |
| 3 | Outer electrode | |
| 4 | Nickel layer | |
| 5 | Tin layer | |
| Dimension (mm) | British System | Metric System |
| 0201 | 0.600.10 (L) x 0.300.05 (W) | 0603 |
| 0402 | 1.000.15 (L) x 0.500.15 (W) | 1005 |
| 0603 | 1.600.20 (L) x 0.800.15 (W) | 1608 |
| 0805 | 2.000.20 (L) x 1.250.20 (W) | 2012 |
| 1206 | 3.200.30 (L) x 1.600.30 (W) | 3216 |
| 1210 | 3.200.30 (L) x 2.500.30 (W) | 3225 |
| 1808 | 4.500.40 (L) x 2.000.20 (W) | 4520 |
| 1812 | 4.500.40 (L) x 3.200.30 (W) | 4532 |
| 1825 | 4.500.40 (L) x 6.300.50 (W) | 4563 |
| 2220 | 5.700.50 (L) x 5.000.50 (W) | 5750 |
| 2225 | 5.700.50 (L) x 6.300.50 (W) | 5763 |
| Specification and Testing Method | Temperature Range | -55~+125 |
| Visual/Dimension | No Damage, Dimension meet Spec. Tested by naked eye and digital caliper. | |
| Static Capacity | Meets standard specification and tolerance. Testing conditions vary by characteristic (NPO, X7R/X7T/X7P) and capacitance value. | |
| Dissipation Factor (DF) | Specifications vary by characteristic (NPO, X7R/X7T/X7P) and capacitance value. Detailed in Note 1. | |
| Insulation Resistance (IR) | Specifications vary by characteristic (NPO, X7R/X7T/X7P) and capacitance value. Testing conditions: Rated voltage, 605s, Humidity75%, Temperature: 255, Current 50mA. | |
| Hi-pot (DC) | No dielectric breakdown or damage. Test voltage is a multiple of rated voltage (e.g., 2.5x for Ur=100V, 2.0x for Ur=200V/250V). Voltage raising time: 1-10S, maintaining time: 2S. | |
| Solderability | Soldering area 90%. Visual-No damage. Pre-heating: 80-120 (10-30s), Lead-free solder, flux. Soldering temperature: 2455, Solder time: 20.5s. | |
| Resistance to the heat of soldering | Visual-No damage, soldering area 90%. Pre-heating: 100-200 (102s), Soldering temperature: 2655 (51s). Cleaning with solvent. Room temperature, time: 242 hours. | |
| Electrostatic Capacity Change Rate | Varies by characteristic (NPO, X7R, X7T, X7P). | |
| Flexural Strength | No damage. Base board: Al2O3 /PCB. Test under flexural status. Electro static capacity change rate C/C10%. Flexural depth: 452mm. | |
| Terminal Bonding Strength | No visual damage. Applied Force: 5N, Duration: 101S. | |
| Thermal Shock | Capacity change rate and DF specifications vary by characteristic (NPO, X7R/X7P, X7T). 5 cycles of thermal shock. | |
| Temperature Moisture Exposure | Visual-No damage. Capacity change rate and DF specifications vary by characteristic (NPO, X7R/X7T/X7P). IR specifications vary by characteristic. Test conditions: 402, 90~95%RH, 50024 hours. | |
| High Temperature Exposure | Visual | No visual damage. |
| Test Conditions | Temperature: 1253, Time: 100048 hours. Voltage: 2x Rated voltage (100VV250V), 1.5x rated voltage (250VV1KV), 1.2x rated voltage (1KVV). | |
| Specifications | Capacity change rate, DF, and IR vary by characteristic (NPO, X7R/X7T/X7P). | |
| PCB Flexural Strength | No crack and other defect. IR measurement after soldering MLCC on PCB. Dimensions (A, B, C) provided for various sizes (0805 to 2220). | |
| Embossed Plastic Taping | Taping Specification | Embossed tape reel packing for 0805(2012) to 1812(4532) type. Dimensions (A, B, C, D, E, F, G, H, J, T) provided for various tape sizes. |
| Reel Dimensions | 7REEL (1782.0mm), 13REEL (3302.0mm). | |
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | |
| Packing Quantity | Quantities vary by size and tape type (Plastic T/R). E.g., 0805: 3000 Pcs (T1.35mm), 1210: 2000 Pcs (T1.60mm). | |
| Paper Tape Reel Packing | Taping Specification | For 1005 (0402), 0201, 0402 types and 0603, 0805, 1206 types. Dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) provided. |
| Reel Dimensions | 7REEL (1782.0mm), 13REEL (3302.0mm). | |
| Top Tape Peeling Strength | Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling. | |
| Packing Quantity | Quantities vary by size and tape type (Paper T/R). E.g., 0805: 4000 Pcs. | |
| Soldering Profile | Follow the temperature profile graph (adjacent) to avoid crack problems from sudden temperature change. | |
| Manual Soldering | Handle soldering iron carefully, pay attention to tip selection and temperature contact to avoid thermal cracks. | |
| Recommended Soldering Method | Methods R (Reflow Soldering) and W (Wave Soldering) are recommended based on size, temperature characteristics, rated voltage, and capacitance. | |
| Soldering Temperature Profile | Preheating: Keep temperature difference between soldering temperature and surface temperature of chips T 150. | |
2509251626_AIDE-CAPACITOR-0805C0G151J631NT_C48579568.pdf
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