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Specifications
Voltage Rating:
100V
Capacitance:
22pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
0805C0G220J101NT
Model Number:
0805C0G220J101NT
Package:
0805
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics (C0G, X7R, X5R) with different capacitance, tolerance, and voltage ratings. They are constructed with ceramic dielectric, inner and outer electrodes, and a nickel/tin layer. The product also adheres to RoHS and REACH compliance standards.
Product Attributes
- Material: Ceramic dielectric, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn
- Compliance: RoHS, REACH
Technical Specifications
| Item | Description/Specification | Details | |||
|---|---|---|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps. | ||||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||
| Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | ||||
| Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||
| Rated Voltage (DC) | 25025, 251250, 2522500 (V) | ||||
| Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | ||||
| Packing | T Tape/Reel, P Bag packing(PE) | ||||
| Construction | Item | Description | |||
| 1 | Ceramic dielectric | ||||
| 2 | Inner electrode | ||||
| 3 | Outer electrode | ||||
| 4 | Nickle layer | ||||
| 5 | Tin layer | ||||
| Dimension (mm) | Part number | L | W | T | WB |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | |
| Specification and Testing Method | Item | Specification/Requirement | Testing Method | ||
| Temperature | -55~+125 | N/A | |||
| Visual/ Dimension | 1, No Damage; 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |||
| Static Capacity | Meet standard specification and tolerance | See detailed specification in source | |||
| Dissipation Factor (DF) | See detailed specification in source | See detailed specification in source | |||
| IR Insulation Resistance | NPO: IR50000M, C10nF; IR*Cr500S, C>10nF. X7R/X7T/X7P: IR10000M, C25nF; IR*Cr100S, C>25nF | Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||
| Hi-pot (DC) | No dielectric breakdown or damage. Voltage depends on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S | |||
| Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||
| Resistance to the heat of soldering | No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF. X7R: C/C15%. X7T: -33% C/C22%. X7P: C/C10%. | See detailed specification in source | |||
| DF | Refer to NO#4 | Refer to NO#4 | |||
| IR | Refer to NO#5 | Refer to NO#5 | |||
| Flexural strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | |||
| Thermal shock | NPO: C/C2.5% or 0.25pF. X7R/X7P: C/C0.5%. X7T: C/C10%. | Pre-condition(X7R h characteristic):Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||
| Temperature moisture exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S. X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |||
| High temperature exposure | Visual: No visual damage. Capacitance change rate: NPO: C/C2% or 1pF. X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S. X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |||
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB. Pressing direction based on diagram. See source for SIZE A, B, C values for different sizes. | |||
| Embossed Plastic Taping | See detailed dimensions in source for 0805 to 1812 types. | N/A | |||
| Paper Tape Reel Packing | See detailed dimensions in source for 1005, 0201, 0402, 0603, 0805, 1206 types. | N/A | |||
| Reel Dimensions | 7REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. 13REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max. | N/A | |||
| Taping Specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains. | N/A | |||
| Packing Quantity | See detailed quantity in source for Paper T/R and Plastic T/R for various sizes. | N/A | |||
| Soldering Profile | Follow temperature profile in adjacent graph (refer to graph in enclosure page). | N/A | |||
| Recommended Soldering Method | RReflow Soldering, WWave Soldering. See detailed specification in source for sizes and capacitance. | N/A | |||
| Soldering Temperature Profile | While preheating, keep temperature difference between soldering temperature and surface temperature of chips as: T150. | N/A | |||
2509251626_AIDE-CAPACITOR-0805C0G220J101NT_C48579569.pdf
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