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quality High voltage MLCC AIDE CAPACITOR 0805X7R105K250NT for networking communication and energy saving lamps factory
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quality High voltage MLCC AIDE CAPACITOR 0805X7R105K250NT for networking communication and energy saving lamps factory
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Specifications
Voltage Rating:
25V
Capacitance:
1uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R105K250NT
Model Number:
0805X7R105K250NT
Package:
0805
Key Attributes
Product Description

Product Overview

This product is a Multi-layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is utilized for coupling, wave filtering, and resonance in various high-voltage circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in various sizes and temperature characteristics, adhering to strict testing conditions and specifications for reliable performance.

Product Attributes

  • Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
  • Terminal Composition: Au/Ag-Ni-Sn
  • RoHS/REACH Compliance: Meets standard

Technical Specifications

Item Description/Specification Details
Application Field Coupling, wave filtering, resonant in high voltage circuits
Switch Power Supplier
AC-DC Power Charger
DC-DC Power Charger
Networking/Communication Interface
LCD Backlight Unit Power Supplier
Amperite of Energy Saving Lamps
Medium and High voltage MLCC
Testing Condition Normal Condition: Temp: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
Relative Condition: Temp: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description Dimension Code 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%)
Nominal Electrostatic Capacity e.g., 8R0=8.0pF, 100=10pF, 101=100pF
Tolerance of Electrostatic Capacity B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
Rated Voltage (DC) e.g., 250=25V, 251=250V, 252=2500V
Terminal Composition Au/Ag-Ni-Sn
Packing T (Tape/Reel), P (Bag packing)
Construction and Dimension Construction 1. Ceramic dielectric, 2. Inner electrode, 3. Outer electrode, 4. Nickle layer, 5. Tin layer
Dimension (mm) Part Number L W T WB
0201 (0603) 0.600.10 0.300.05 0.300.05 0.100.05
0402 (1005) 1.000.15 0.500.15 0.500.10 0.200.10
0603 (1608) 1.600.20 0.800.15 0.800.15 0.300.10
0805 (2012) 2.000.20 1.250.20 0.800.20 0.500.20
1206 (3216) 3.200.30 1.600.30 1.000.20 0.600.30
1210 (3225) 3.200.30 2.500.30 2.70 0.800.30
1808 (4520) 4.500.40 2.000.20 2.70 0.800.30
1812 (4532) 4.500.40 3.200.30 3.50 0.800.30
1825 (4563) 4.500.40 6.300.50 3.50 0.800.30
2220 (5750) 5.700.50 5.000.50 3.50 1.000.40
2225 (5763) 5.700.50 6.300.50 6.20 1.000.40
Specification and Testing Method Temperature -55~+125
Visual/Dimension 1. No Damage, 2. Dimension meet Spec Naked eye (Visual inspection), Digital calliper
Static Capacity Meet standard specification and tolerance NPO: 1MHz10%, 1.00.2Vrms; X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF) or 120Hz24, 0.50.1Vrms (>10uF)
Dissipation Factor (DF) NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) NPO: 1MHz10%, 1V0.2rms (Cr1000pF) or 1KHz10%, 1V0.2rms (Cr1000pF); X7R/X7T/X7P: 1KHz10%, 1V0.1rms (Cr10uF) or 120Hz24, 0.5V0.1rms (Cr10uF)
IR Insulation Resistance NPO: IR50000M (C10nF) or IR*Cr500S (C10nF); X7R/X7T/X7P: IR10000M (C25nF) or IR*Cr100S (C25nF) Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA
Hi-pot (DC) No dielectric breakdown or damage Ur=100V: 2.5 x rated voltage; Ur=200V/250V: 2.0 x rated voltage; Ur=450/500/630V: 1.5 x rated voltage; 1KVUr2KV: 1.2 x rated voltage; 2KVUr: 1.1 x rated voltage. Voltage Raising time: 110S, Voltage maintaining time2S
Solderability Soldering area 90% Pre-heating 80-120 (10-30s), Lead free solder, flux. Soldering temp 2455 (20.5s)
Resistance to the heat of soldering No visual damage, soldering area 90% Pre-heating 100-200 (102s), Soldering temp 2655 (51s). Cleaning with solvent. Room temp, 242 hours.
Electrostatic capacity change rate NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10%
Flexural Strength No damage Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electro static capacity change rate: C/C10%
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% 5 cycles. Test after 242 hours normal temp & humidity.
Temperature Moisture Exposure Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF: 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S Temp: 402, Humidity: 90~95%RH, Time: 50024 hours. Test after 242 hours normal temp & humidity.
High Temperature Exposure Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF: 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S Temp: 1253, Time: 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage).
PCB Flexural Strength No crack and other defect IR Soldering the MLCC on the PCB, then pressing.
Embossed Plastic Taping Tape Size A B C D E F G H J T
0805 1.55 0.20 2.35 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.10 1.50 -0/+0.10 1.50 Max
1206 1.95 0.20 3.60 0.20 8.00 0.20 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.10 4.00 0.1 1.50 -0/+0.10 1.85 Max
1210 2.70 0.10 3.42 0.10 8.00 0.10 3.50 0.05 1.75 0.10 4.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 3.2 Max
1812 3.66 0.10 4.95 0.10 12.00 0.10 5.50 0.05 1.75 0.10 8.00 0.10 2.00 0.05 4.00 0.10 1.55 -0/+0.10 4.0 Max
Paper Tape Reel Packing Papersize W1 L1 D C B P1 P2 P0 d t
1005 0.240.02 0.450.02 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.30 Below
0402 0.650.10 1.150.10 8.000.10 3.500.05 1.750.10 2.000.05 2.000.05 4.000.10 1.50 -0/+0.10 0.80 Below
Reel Dimensions Unit: mm A B C D E F G
7' REEL 1782.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
13' REEL 3302.0 3.0 130.5 210.5 21 or Bigger 1010.5 12max
Packing Quantity (Pcs) Size Paper T/R Plastic T/R
0805 4000 3000
1206 4000 3000 (T1.35mm), 2000 (T>1.35mm)
1210 - 3000 (T1.60mm), 2000 (T>1.60mm)
1812 - 1000 (T1.85mm), 800 (T>1.85mm)

Precautions For Use

Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings. To avoid potential issues like burn out, flaming, or glowing, adhere to the following precautions and application notes. For handling questions, contact the engineering section or factory.

  • Soldering Profile: Follow the recommended temperature profile to prevent cracks due to sudden temperature changes.
  • Manual Soldering: Exercise caution to avoid thermal cracks. Ensure the soldering iron tip is handled carefully, with attention to tip selection and temperature contact.
  • Optimum Solder Amount for Reflow Soldering
  • Recommended Soldering amounts

Recommended Soldering Method

Size Temperature Characteristics Rated Voltage Capacitance Soldering Method
1005 NPO / / R
X7R/X5R/X7S/X6S / / R
0201 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0402 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R
0603 NPO / / R/W
X7R/X5R/X7S/X6S / C1uf R
C1uf R/W
Y5V / C1uf R
C1uf R/W
0805 NPO / / R/W
X7R/X5R/X7S/X6S / C4.7uf R
C4.7uf R/W
Y5V / C1uf R
C1uf R/W
1206 NPO / / R/W
X7R/X5R/X7S/X6S / C10uf R
C10uf R/W
Y5V / C10uf R
C10uf R/W
1210 NPO / / R
X7R/X5R/X7S/X6S / / R
Y5V / / R

Soldering Method: RReflow Soldering, WWave Soldering

Soldering Temperature Profile

During preheating, maintain the temperature difference between soldering temperature and surface temperature of chips as T 150.


2509251626_AIDE-CAPACITOR-0805X7R105K250NT_C48579602.pdf

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