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quality Multilayer ceramic capacitor AIDE CAPACITOR 0805X7R223K101NT designed for high voltage coupling wave filtering and resonant factory
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quality Multilayer ceramic capacitor AIDE CAPACITOR 0805X7R223K101NT designed for high voltage coupling wave filtering and resonant factory
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Specifications
Voltage Rating:
100V
Capacitance:
22nF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R223K101NT
Model Number:
0805X7R223K101NT
Package:
0805
Key Attributes
Product Description

Product Overview

High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer a wide range of capacitance values, temperature characteristics (C0G, X7R, X5R), and voltage ratings, ensuring suitability for diverse medium and high-voltage requirements.

Product Attributes

  • Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
  • RoHS/REACH Compliance: Meets standards

Technical Specifications

Item Description/Specification Testing Method
Application Field Coupling, wave filtering, resonant in high voltage circuits (e.g., switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, energy-saving lamps). -
Testing Conditions (Normal) Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa -
Testing Conditions (Relative) Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa -
Part Number Description Example: 1812 X7R 684 M 251 N T
Dimension Code
Temperature Characteristic (C0G, X7R, X5R)
Nominal Electrostatic Capacity (pF)
Tolerance of Electrostatic Capacity (e.g., M: 20%)
Rated Voltage (DC)
Terminal Composition
Packing (T: Tape/Reel, P: Bag)
-
Dimension Codes & Sizes (mm) 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05
0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10
0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10
0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20
1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30
1210 (3225): L 3.200.30, W 2.500.30 (2.70), T 0.800.30
1808 (4520): L 4.500.40, W 2.000.20 (2.70), T 0.800.30
1812 (4532): L 4.500.40, W 3.200.30 (3.50), T 0.800.30
1825 (4563): L 4.500.40, W 6.300.50 (3.50), T 0.800.30
2220 (5750): L 5.700.50, W 5.000.50 (3.50), T 1.000.40
2225 (5763): L 5.700.50, W 6.300.50 (6.20), T 1.000.40
Digital Caliper
Temperature Characteristic C0G (030 PPM/), X7R (15%), X5R (15%) -
Temperature Range -55~+125 -
Dissipation Factor (DF) Refer to Note 1 for specific values based on characteristic, rated voltage, and capacitance. Refer to Specification Section 5.4
Insulation Resistance (IR) NPO: 50000M (C10nF), IR*Cr 500S (C>10nF)
X7R/X7T/X7P: 10000M (C25nF), IR*Cr 100S (C>25nF)
Rated voltage, 605s, 75% Humidity, 255, 50mA Current
Hi-pot (DC) 1.2 to 2.5 x rated voltage (depending on rated voltage) Voltage Raising time: 110S, Voltage maintaining time: 2S
Solderability Soldering area 90%, No damage Pre-heating 80-120 (10-30s), Solder temp 2455 (20.5s), Lead free solder, flux
Resistance to the heat of soldering No damage, Soldering area 90% Pre-heating 100-200 (102s), Solder temp 2655 (51s), Cleaning with solvent, Room temp (242 hours)
Flexural Strength No damage, Electrostatic capacity change rate 10% Base board: Al2O3 /PCB, PCB dimension: 1.6mm thickness, 100mm length, 40mm width, Flexural depth: 1mm, Bend speed: 0.5mm/sec
Terminal Bonding Strength No visual damage Applied Force: 5N, Duration: 101S
Thermal Shock NPO: 2.5% or 0.25pF
X7R/X7P: 0.5%
X7T: -33% C/C22%
5 cycles, tested after 242 hours at normal temp & humidity
Temperature Moisture Exposure Visual: No damage
Capacitance Change: NPO 2% or 1pF, X7R/X7T/X7P 10%
DF 2 times initial standard
IR: NPO 2500M or IR*Cr 25S, X7R/X7T/X7P 1000M or IR*Cr 25S
402, 90~95%RH, 50024 hours, tested after 242 hours at normal temp & humidity
High Temperature Exposure Visual: No damage
Capacitance Change: NPO 2% or 1pF, X7R/X7T/X7P 20%
DF 2 x initial standard
IR: NPO 4000M or IR*Cr 40S, X7R/X7T/X7P 2000M or IR*Cr 50S
1253, 100048 hours, Voltage dependent on rating (2x Rated Voltage, 1.5x Rated Voltage, 1.2x Rated Voltage)
PCB Flexural Strength No crack and other defect Soldered MLCC on PCB, pressing direction based on diagrams (SIZE A, B, C values provided for various sizes)
Embossed Plastic Taping Dimensions Refer to Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for sizes 0805 to 1812. -
Paper Tape Reel Packing Dimensions Refer to Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for sizes 1005, 0201, 0402, 0603, 0805, 1206. -
Reel Dimensions 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max
-
Top Tape Peeling Strength 0.1N < peeling strength < 0.7N (Embossed Taping) -
Packing Quantity Refer to Page 11 for quantities per reel based on size and tape type (Paper T/R, Plastic T/R). -
Soldering Method Recommendations RReflow Soldering, WWave Soldering. Specific recommendations based on size, characteristic, rated voltage, and capacitance. -
Soldering Temperature Profile Keep temperature difference T150 between soldering temperature and surface temperature of chips during preheating. -

2509251626_AIDE-CAPACITOR-0805X7R223K101NT_C48579618.pdf

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