Product Overview
High-reliability Multi-Layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer a wide range of capacitance values, temperature characteristics (C0G, X7R, X5R), and voltage ratings, ensuring suitability for diverse medium and high-voltage requirements.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from the inside out)
- RoHS/REACH Compliance: Meets standards
Technical Specifications
| Item | Description/Specification | Testing Method |
|---|---|---|
| Application Field | Coupling, wave filtering, resonant in high voltage circuits (e.g., switch power supplies, AC-DC power chargers, DC-DC power chargers, networking/Communication interfaces, LCD backlight unit power supplies, energy-saving lamps). | - |
| Testing Conditions (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | - |
| Testing Conditions (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | - |
| Part Number Description | Example: 1812 X7R 684 M 251 N T Dimension Code Temperature Characteristic (C0G, X7R, X5R) Nominal Electrostatic Capacity (pF) Tolerance of Electrostatic Capacity (e.g., M: 20%) Rated Voltage (DC) Terminal Composition Packing (T: Tape/Reel, P: Bag) | - |
| Dimension Codes & Sizes (mm) | 0201 (0603): L 0.600.10, W 0.300.05, T 0.300.05, WB 0.100.05 0402 (1005): L 1.000.15, W 0.500.15, T 0.500.10, WB 0.200.10 0603 (1608): L 1.600.20, W 0.800.15, T 0.800.15, WB 0.300.10 0805 (2012): L 2.000.20, W 1.250.20, T 0.800.20, WB 0.500.20 1206 (3216): L 3.200.30, W 1.600.30, T 1.000.20, WB 0.600.30 1210 (3225): L 3.200.30, W 2.500.30 (2.70), T 0.800.30 1808 (4520): L 4.500.40, W 2.000.20 (2.70), T 0.800.30 1812 (4532): L 4.500.40, W 3.200.30 (3.50), T 0.800.30 1825 (4563): L 4.500.40, W 6.300.50 (3.50), T 0.800.30 2220 (5750): L 5.700.50, W 5.000.50 (3.50), T 1.000.40 2225 (5763): L 5.700.50, W 6.300.50 (6.20), T 1.000.40 | Digital Caliper |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | - |
| Temperature Range | -55~+125 | - |
| Dissipation Factor (DF) | Refer to Note 1 for specific values based on characteristic, rated voltage, and capacitance. | Refer to Specification Section 5.4 |
| Insulation Resistance (IR) | NPO: 50000M (C10nF), IR*Cr 500S (C>10nF) X7R/X7T/X7P: 10000M (C25nF), IR*Cr 100S (C>25nF) | Rated voltage, 605s, 75% Humidity, 255, 50mA Current |
| Hi-pot (DC) | 1.2 to 2.5 x rated voltage (depending on rated voltage) | Voltage Raising time: 110S, Voltage maintaining time: 2S |
| Solderability | Soldering area 90%, No damage | Pre-heating 80-120 (10-30s), Solder temp 2455 (20.5s), Lead free solder, flux |
| Resistance to the heat of soldering | No damage, Soldering area 90% | Pre-heating 100-200 (102s), Solder temp 2655 (51s), Cleaning with solvent, Room temp (242 hours) |
| Flexural Strength | No damage, Electrostatic capacity change rate 10% | Base board: Al2O3 /PCB, PCB dimension: 1.6mm thickness, 100mm length, 40mm width, Flexural depth: 1mm, Bend speed: 0.5mm/sec |
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S |
| Thermal Shock | NPO: 2.5% or 0.25pF X7R/X7P: 0.5% X7T: -33% C/C22% | 5 cycles, tested after 242 hours at normal temp & humidity |
| Temperature Moisture Exposure | Visual: No damage Capacitance Change: NPO 2% or 1pF, X7R/X7T/X7P 10% DF 2 times initial standard IR: NPO 2500M or IR*Cr 25S, X7R/X7T/X7P 1000M or IR*Cr 25S | 402, 90~95%RH, 50024 hours, tested after 242 hours at normal temp & humidity |
| High Temperature Exposure | Visual: No damage Capacitance Change: NPO 2% or 1pF, X7R/X7T/X7P 20% DF 2 x initial standard IR: NPO 4000M or IR*Cr 40S, X7R/X7T/X7P 2000M or IR*Cr 50S | 1253, 100048 hours, Voltage dependent on rating (2x Rated Voltage, 1.5x Rated Voltage, 1.2x Rated Voltage) |
| PCB Flexural Strength | No crack and other defect | Soldered MLCC on PCB, pressing direction based on diagrams (SIZE A, B, C values provided for various sizes) |
| Embossed Plastic Taping Dimensions | Refer to Page 8 for detailed dimensions (A, B, C, D, E, F, G, H, J, T) for sizes 0805 to 1812. | - |
| Paper Tape Reel Packing Dimensions | Refer to Page 9 for detailed dimensions (W1, L1, D, C, B, P1, P2, P0, d, t) for sizes 1005, 0201, 0402, 0603, 0805, 1206. | - |
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | - |
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N (Embossed Taping) | - |
| Packing Quantity | Refer to Page 11 for quantities per reel based on size and tape type (Paper T/R, Plastic T/R). | - |
| Soldering Method Recommendations | RReflow Soldering, WWave Soldering. Specific recommendations based on size, characteristic, rated voltage, and capacitance. | - |
| Soldering Temperature Profile | Keep temperature difference T150 between soldering temperature and surface temperature of chips during preheating. | - |
2509251626_AIDE-CAPACITOR-0805X7R223K101NT_C48579618.pdf
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