Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and energy-saving lamp circuits. Key applications include switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. The MLCCs are available in a range of standard sizes and temperature characteristics, including C0G, X7R, and X5R, with various capacitance, tolerance, and voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: ROHS compliant, REACH compliant
Technical Specifications
| Item | Description | Specification/Requirement | Testing Method | |
|---|---|---|---|---|
| 1 | Application Field | Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC) | N/A | |
| 2 | Testing Condition (Normal) | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A | |
| 2 | Testing Condition (Relative) | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |
| 3 | Part Number Description Example | 1812 X7R 684 M 251 N T | N/A | |
| 3.1 | Dimension Code & Size (inch/mm) | |||
| Code | L*W (inch) | L*W (mm) | ||
| 0201 | 0.02*0.01 | 0.50*0.25 | ||
| 0402 | 0.04*0.02 | 1.00*0.50 | ||
| 0603 | 0.06*0.03 | 1.60*0.80 | ||
| 0805 | 0.08*0.05 | 2.00*1.25 | ||
| 1206 | 0.12*0.06 | 3.20*1.60 | ||
| 3.1 | Dimension Code & Size (inch/mm) Continued | |||
| Code | L*W (inch) | L*W (mm) | ||
| 1210 | 0.12*0.10 | 3.20*2.50 | ||
| 1808 | 0.18*0.08 | 4.50*2.00 | ||
| 1812 | 0.18*0.12 | 4.50*3.20 | ||
| 1825 | 0.18*0.25 | 4.50*6.30 | ||
| 2211 | 0.22*0.11 | 5.70*2.8 | ||
| 2225 | 0.22*0.25 | 5.70*6.30 | ||
| 3 | Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |
| 3 | Nominal Electrostatic Capacity | 8R08.0, 10010, 101100 (pF) | N/A | |
| 3 | Tolerance of Electrostatic Capacity | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |
| 3 | Rated Voltage (DC) | 25025, 251250, 2522500 (V) | N/A | |
| 3 | Terminal Composition | Au/Ag-Ni-Sn (From the inside out) | N/A | |
| 3 | Packing | T Tape/Reel, P Bag packing (PE) | N/A | |
| 4.1 | Construction | |||
| Item | Description | N/A | N/A | |
| 1 | Ceramic dielectric | N/A | N/A | |
| 2 | Inner electrode | N/A | N/A | |
| 3 | Outer electrode | N/A | N/A | |
| 4 | Nickle layer | N/A | N/A | |
| 5 | Tin layer | N/A | N/A | |
| 4.2 | Dimension (mm) | |||
| Part number | L | W | T | |
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | |
| 5 | Specification and Testing Method | |||
| Item | Specification/Requirement | Testing method | N/A | |
| 1 | Temperature | -55~+125 | N/A | |
| 2 | Visual/ Dimension | 1, No Damage 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper | |
| 3 | Static Capacity | Meet standard specification and tolerance | See detailed specification in source | |
| 4 | Dissipation Factor (DF) | See detailed specification in source | See detailed specification in source | |
| 5 | IR Insulation Resistance | See detailed specification in source | See detailed specification in source | |
| 6 | Hi-pot (DC) | No dielectric breakdown or damage. Voltage levels vary based on rated voltage (Ur). | Voltage Raising time: 110S, Voltage maintaining time: 2S | |
| 7 | Solderability | Soldering area 90%, No damage | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |
| 8 | Resistance to the heat of soldering | No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |
| 9 | Flexural Strength | No damage. Electro static capacity change rate C/C10%. | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. Test under flexural status. | |
| 10 | Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |
| 11 | Thermal Shock | See detailed specification in source | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |
| 12 | Temperature Moisture Exposure | See detailed specification in source | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |
| 13 | High Temperature Exposure | See detailed specification in source | Charging and discharging current 50mA Max. Test after place 48 hours under normal pressure & temperature. Temperature 1253, Time 100048 hours. Voltage levels vary based on rated voltage. | |
| 14 | PCB Flexural Strength | No crack and other defect. | Soldering the MLCC on the PCB, then pressing direction based on the photo. | |
| 6 | EMBOSSED PLASTIC TAPING | |||
| 6.1 | Embossed tape reel packing for 0805(2012)~1812(4532) type | See detailed dimensions in source | ||
| 6.2 | Paper tape reel packing for 10050402~12063216 | See detailed dimensions in source | ||
| 6.3 | Structure of leader part and end part of the carrier paper | N/A | ||
| 6.4 | Reel Dimensions | See detailed dimensions in source (unit: mm) | ||
| 6.5 | Taping specification | Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||
| 7 | Packing quantity | |||
| 7.1 | Paper T/R (Pcs) | 0201: 10000, 0402: 10000, 0603: 10000, 0805: 4000, 1206: 4000 | N/A | |
| 7.2 | Plastic T/R (Pcs) | 0805: 3000, 1206: 3000 (T1.35mm), 1210: 2000 (T1.60mm), 1808: 2000, 1812: 1000 (T1.85mm) | N/A | |
| 8 | Precautions For Use | |||
| 8.1 | Soldering Profile | Follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | ||
| 8.2 | Manual Soldering | Handle soldering iron carefully, pay attention to the selection of the soldering iron tip and temperature contact. | ||
| 9 | Recommended Soldering Method | |||
| Size | Temperature Characteristics | Capacitance | Soldering Method | |
| 1005 | NPO, X7R/X5R/X7S/X6S | / | R | |
| 0201 | NPO, X7R/X5R/X7S/X6S, Y5V | / | R | |
| 0402 | NPO, X7R/X5R/X7S/X6S, Y5V | / | R | |
| 0603 | NPO, X7R/X5R/X7S/X6S, Y5V | C1uf (Y5V), C1uf (Y5V) | R/W (NPO), R (X7R/X5R/X7S/X6S), R (Y5V C1uf), R/W (Y5V C1uf) | |
| 0805 | NPO, X7R/X5R/X7S/X6S, Y5V | C4.7uf (X7R/X5R/X7S/X6S), C1uf (Y5V), C1uf (Y5V) | R/W (NPO), R (X7R/X5R/X7S/X6S C4.7uf), R/W (X7R/X5R/X7S/X6S C4.7uf), R (Y5V C1uf), R/W (Y5V C1uf) | |
| 1206 | NPO, X7R/X5R/X7S/X6S, Y5V | C10uf (X7R/X5R/X7S/X6S), C10uf (Y5V), C10uf (Y5V) | R/W (NPO), R (X7R/X5R/X7S/X6S C10uf), R/W (X7R/X5R/X7S/X6S C10uf), R (Y5V C10uf), R/W (Y5V C10uf) | |
| 1210 | NPO, X7R/X5R/X7S/X6S, Y5V | / | R (NPO), R (X7R/X5R/X7S/X6S), R (Y5V) | |
2509251626_AIDE-CAPACITOR-0805X7R331K201NT_C48579625.pdf
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