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Specifications
Voltage Rating:
500V
Capacitance:
470pF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R471K501NT
Model Number:
0805X7R471K501NT
Package:
0805
Key Attributes
Product Description
Product Overview
High-performance Multi-layer Ceramic Capacitors (MLCCs) designed for demanding applications in high-voltage circuits. These capacitors are ideal for coupling, wave filtering, and resonant functions within switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. Available in a range of standard sizes and dielectric characteristics, they offer reliable performance and robust construction for medium and high-voltage requirements.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickle layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- Certifications: RoHS/REACH compliant
Technical Specifications
| Item | Description | Specification | |
|---|---|---|---|
| Application Field | Coupling | High voltage circuits | |
| Wave filtering | High voltage circuits | ||
| Resonant | High voltage circuits | ||
| Switch power supplier | Medium and High voltage MLCC | ||
| AC-DC power charger | Medium and High voltage MLCC | ||
| DC-DC power charger | Medium and High voltage MLCC | ||
| Networking/Communication interface | Medium and High voltage MLCC | ||
| LCD backlight unit power supplier | Medium and High voltage MLCC | ||
| Amperite of energy saving lamps | Medium and High voltage MLCC | ||
| General | Medium and High voltage MLCC | ||
| Testing Conditions | Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | |
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | ||
| Initial Capacitance Testing | Pre-heating 150 for 1 hour, then 48 hours under normal pressure & temperature. | ||
| Part Number Description | Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | ||
| Construction | Ceramic dielectric | - | |
| Inner electrode | - | ||
| Dimension (mm) | British System | Metric System | |
| 0201 | 0603 | 0.600.10 (L) x 0.300.05 (W) x 0.300.05 (T) | |
| 0402 | 1005 | 1.000.15 (L) x 0.500.15 (W) x 0.500.10 (T) | |
| 0603 | 1608 | 1.600.20 (L) x 0.800.15 (W) x 0.800.15 (T) | |
| 0805 | 2012 | 2.000.20 (L) x 1.250.20 (W) x 0.800.20 (T) | |
| 1206 | 3216 | 3.200.30 (L) x 1.600.30 (W) x 1.000.20 (T) | |
| 1210 | 3225 | 3.200.30 (L) x 2.500.30 (W) x 0.800.30 (T) | |
| 1808 | 4520 | 4.500.40 (L) x 2.000.20 (W) x 0.800.30 (T) | |
| 1812 | 4532 | 4.500.40 (L) x 3.200.30 (W) x 0.800.30 (T) | |
| 1825 | 4563 | 4.500.40 (L) x 6.300.50 (W) x 0.800.30 (T) | |
| 2211 | 5728 | 5.700.50 (L) x 2.800.50 (W) x 1.000.40 (T) | |
| 2220 | 5750 | 5.700.50 (L) x 5.000.50 (W) x 1.000.40 (T) | |
| 2225 | 5763 | 5.700.50 (L) x 6.300.50 (W) x 1.000.40 (T) | |
| Specifications & Testing Method | Temperature Characteristic | -55~+125 | |
| Static Capacity | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF); DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | ||
| Insulation Resistance (IR) | NPO Characteristic | IR50000M, C10nF; IR*Cr500S, C10nF (Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA) | |
| X7R/X7T/X7P Characteristic | IR10000M, C25nF; IR*Cr100S, C25nF | ||
| Hi-pot (DC) | - | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage (Voltage Raising time: 110S, Voltage maintaining time: 2S) | |
| Solderability | - | Soldering area 90%, Visual-No damage (Pre-heating temperature 80-120, time 10-30s, lead free solder, flux; Soldering temperature 2455, Solder time 20.5s) | |
| Resistance to the heat of soldering | - | Visual-No damage, soldering area 90% (Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s) | |
| Electrostatic Capacity Change Rate | NPO Characteristic | C/C0.5% or 0.5pF (larger reading) | |
| X7R | C/C15% | ||
| X7T | -33% C/C22% | ||
| X7P | C/C10% | ||
| Flexural Strength | - | No damage (Base board: Al2O3 /PCB, Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec) | |
| Electro static capacity change rate (under flexural status) | - | C/C10% | |
| Terminal Bonding Strength | - | No visual damage (Applied Force: 5N, Duration: 101S) | |
| Thermal Shock | NPO Characteristic | C/C2.5% or 0.25pF (larger reading) | |
| X7R/X7P characteristic | C/C0.5% | ||
| X7T characteristic | C/C10% | ||
| Temperature Moisture Exposure | Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C10% (Temperature 402, Humidity 90~95%RH, time 50024 hours) | |
| DF | 2 times initial standard | ||
| IR | NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S | ||
| High Temperature Exposure | Electrostatic capacitance change rate | NPO: C/C2% or 1pF (larger reading); X7R/X7T/X7P: C/C20% (Temperature 1253, Time 100048 hours) | |
| DF | 2 X initial standard | ||
| IR | NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S | ||
| PCB Flexural Strength | - | No crack and other defect (Testing based on MLCC size and dimensions A, B, C) | |
| Embossed Plastic Taping | Tape Sizes (mm) | 0805: 1.550.20 (A), 2.350.20 (B), 8.000.20 (C), 3.500.05 (D), 1.750.10 (E), 4.000.10 (F), 2.000.10 (G), 4.000.10 (H), 1.50 -0/+0.10 (J), 1.50 Max (T) 1206: 1.950.20 (A), 3.600.20 (B), 8.000.20 (C), 3.500.05 (D), 1.750.10 (E), 4.000.10 (F), 2.000.10 (G), 4.000.10 (H), 1.50 -0/+0.10 (J), 1.85 Max (T) 1210: 2.700.10 (A), 3.420.10 (B), 8.000.10 (C), 3.500.05 (D), 1.750.10 (E), 4.000.10 (F), 2.000.05 (G), 4.000.10 (H), 1.55 -0/+0.10 (J), 3.2 Max (T) 1808: 2.200.10 (A), 4.950.10 (B), 12.000.10 (C), 5.500.05 (D), 1.750.10 (E), 4.000.10 (F), 2.000.05 (G), 4.000.10 (H), 1.50 -0/+0.10 (J), 3.0 Max (T) 1812: 3.660.10 (A), 4.950.10 (B), 12.000.10 (C), 5.500.05 (D), 1.750.10 (E), 8.000.10 (F), 2.000.05 (G), 4.000.10 (H), 1.55 -0/+0.10 (J), 4.0 Max (T) | |
| Paper Tape Reel Packing | Paper Sizes (mm) | 1005: 0.240.02 (W1), 0.450.02 (L1), 8.000.10 (D), 3.500.05 (C), 1.750.10 (B), 2.000.05 (P1), 2.000.05 (P2), 4.000.10 (P0), 1.50 -0/+0.10 (d), 0.30 Below (t) 0201: 0.370.10 (W1), 0.670.10 (L1), 8.000.10 (D), 3.500.05 (C), 1.750.10 (B), 2.000.05 (P1), 2.000.05 (P2), 4.000.10 (P0), 1.50 -0/+0.10 (d), 0.80 Below (t) 0402: 0.650.10 (W1), 1.150.10 (L1), 8.000.10 (D), 3.500.05 (C), 1.750.10 (B), 2.000.05 (P1), 2.000.05 (P2), 4.000.10 (P0), 1.50 -0/+0.10 (d), 0.80 Below (t) 0603: 1.100.10 (A), 1.900.10 (B), 8.000.10 (C), 3.500.05 (D), 1.750.10 (E), 4.000.10 (F), 2.000.10 (G), 4.000.10 (H), 1.50 -0/+0.10 (J), 1.10 Max (T) 0805: 1.450.15 (A), 2.300.15 (B), 8.00.15 (C), 3.500.05 (D), 1.750.10 (E), 4.000.10 (F), 2.000.10 (G), 4.000.10 (H), 1.50 -0/+0.10 (J), 1.10 Max (T) 1206: 1.800.20 (A), 3.400.20 (B), 8.000.20 (C), 3.500.05 (D), 1.750.10 (E), 4.000.10 (F), 2.000.10 (G), 4.000.10 (H), 1.50 -0/+0.10 (J), 1.10 Max (T) | |
| Reel Dimensions (unit: mm) | 7REEL: 1782.0 (A), 3.0 (B), 130.5 (C), 210.5 (D), 21 or Bigger (E), 1010.5 (F), 12max (G) | ||
| 13REEL: 3302.0 (A), 3.0 (B), 130.5 (C), 210.5 (D), 21 or Bigger (E), 1010.5 (F), 12max (G) | |||
| Packing Quantity | - | 0603 Paper T/R: 4000 pcs; 0805 Paper T/R: 4000 pcs; 0805 Plastic T/R: 3000 pcs; 1206 Plastic T/R: T1.35mm: 3000 pcs, T1.35mm: 2000 pcs; 1210 Plastic T/R: T1.60mm: 3000 pcs, T1.60mm: 2000 pcs; 1808 Plastic T/R: 1000 pcs; 1812 Plastic T/R: T1.85mm: 1000 pcs, T1.85mm: 800 pcs; 1812 above Plastic T/R: 500 pcs | |
| Recommended Soldering Method | Size | Capacitance | Soldering Method |
| 1005 | NPO / X7R/X5R/X7S/X6S / Y5V | / / R | |
| 0201 | NPO / X7R/X5R/X7S/X6S / Y5V | / / R | |
| 0402 | NPO / X7R/X5R/X7S/X6S / Y5V | / / R | |
| 0603 | NPO / X7R/X5R/X7S/X6S / Y5V | / R/W (C1uf) / R/W (C1uf) | |
| 0805 | NPO / X7R/X5R/X7S/X6S / Y5V | / R/W (C4.7uf) / R/W (C4.7uf) for X7R... / R (C1uf) / R/W (C1uf) for Y5V | |
| 1206 | NPO / X7R/X5R/X7S/X6S / Y5V | / R/W (C10uf) / R/W (C10uf) for X7R... / R (C10uf) / R/W (C10uf) for Y5V | |
| 1210 | NPO / X7R/X5R/X7S/X6S / Y5V | / / R |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCCs) may fail in a short circuit or open circuit mode when subjected to severe electrical or mechanical stress beyond specified ratings and conditions. This can lead to burn out, flaming, or glowing. Adhere to the following precautions for safety and application notes. Contact the engineering section or factory for handling questions.
- Soldering Profile: Follow the provided temperature profile graph to avoid cracks due to sudden temperature changes.
- Manual Soldering: Exercise caution to prevent thermal cracks. Ensure the soldering iron tip is handled carefully and select appropriate tips and temperatures.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Soldering Method Key: RReflow Soldering, WWave Soldering
Soldering Temperature Profile: During preheating, keep the temperature difference between soldering temperature and chip surface temperature T 150.
2509251626_AIDE-CAPACITOR-0805X7R471K501NT_C48579635.pdf
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