Product Overview
High-voltage Multi-Layer Ceramic Capacitors (MLCCs) designed for applications such as coupling, wave filtering, and resonance in high-voltage circuits. These capacitors are suitable for switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. They offer a wide range of temperature characteristics, including C0G, X7R, and X5R, with various tolerance and voltage ratings.
Product Attributes
- Construction: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS compliant, REACH compliant
Technical Specifications
| Item | Specification/Requirement | Testing Method | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| Application Field | Coupling, wave filtering, resonant in high voltage circuits (switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc.) (Medium and High voltage MLCC) | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Testing Conditions | Normal: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa Relative: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Part Number Description | Example: 1812 X7R 684 M 251 N T Item Breakdown: 1. Dimension Code (e.g., 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225) 2. Temperature Characteristic (C0G, X7R, X5R) 3. Nominal Electrostatic Capacity (pF) 4. Tolerance of Electrostatic Capacity (B, C, D, F, G, J, K, M, Z) 5. Rated Voltage (DC) 6. Terminal Composition (Au/Ag-Ni-Sn) 7. Packing (T: Tape/Reel, P: Bag packing) | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dimensions (mm) |
| N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Operating Temperature Range | -55~+125 | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Static Capacity Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Rated Voltage (DC) | 250 (25V), 251 (250V), 252 (2500V) | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5 pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr) X7R/X7T/X7P: See Note 1 | NPO: Frequency 110%MHz, Voltage 1V0.2rms (Cr1000pF); Frequency 110%KHz, Voltage 1V0.2rms (Cr1000pF) X7R/X7T/X7P: Frequency 110%KHz, Voltage 1V0.1rms (Cr10uF); Frequency 12024Hz, Voltage 0.5V0.1rms (Cr10uF) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Insulation Resistance (IR) | NPO: IR50000M (C10nF), IR*Cr500S (C10nF) X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C25nF) | Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Hi-pot (DC) | Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage | Voltage Raising time: 110S, Voltage maintaining time: 2S | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Solderability | Soldering area 90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Resistance to the heat of soldering | No visual damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Electrostatic Capacity Change Rate | NPO: C/C0.5% or 0.5pF (larger reading) X7R: C/C15% X7T: -33% C/C22% X7P: C/C10% | Pre-heating 150 1hour, then place 48 hours under normal pressure & temperature. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Flexural Strength | No damage. Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB. PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Terminal Bonding Strength | No visual damage | Applied Force: 5N, Duration: 101S | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Thermal Shock | NPO: C/C2.5% or 0.25pF (larger reading) X7R/X7P: C/C0.5% X7T: C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Temperature Moisture Exposure | No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C10% DF: 2 times initial standard IR: NPO: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| High Temperature Exposure | No visual damage. Capacity Change Rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Flexural Strength | No crack and other defect. IR | Soldering the MLCC on the PCB, then pressing direction based on the photo. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Embossed Plastic Taping Dimensions |
| N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Paper Tape Reel Packing Dimensions |
| N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Reel Dimensions | 7' REEL: 1782.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max 13' REEL: 3302.0, 3.0, 130.5, 210.5, 21 or Bigger, 1010.5, 12max | N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Top Tape Peeling Strength | 0.1N < peeling strength < 0.7N | Standard: No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Packing Quantity |
| N/A | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Soldering Method Recommendations | RReflow Soldering, WWave Soldering | See Page 13 for detailed size/characteristic recommendations. |
2509251626_AIDE-CAPACITOR-0805X7R474K500NT_C48579645.pdf
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