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Specifications
Voltage Rating:
25V
Capacitance:
4.7uF
Temperature Coefficient:
X7R
Tolerance:
±10%
Mfr. Part #:
0805X7R475K250NT
Model Number:
0805X7R475K250NT
Package:
0805
Key Attributes
Product Description
Product Overview
These Multi-Layer Ceramic Capacitors (MLCCs) are designed for high-voltage applications, including coupling, wave filtering, and resonant functions. They are suitable for use in switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamp ballasts. The MLCCs offer various temperature characteristics, tolerances, and voltage ratings, with robust construction and reliable performance.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode, Nickel layer, Tin layer
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Certifications: ROHS/REACH compliance
Technical Specifications
| Item | Specification/Requirement | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa | N/A | ||||||||
| Relative Condition | Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa | N/A | ||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| Item | Description | Details | ||||||||
| 1. Dimension Code | Size | 0201 (0.02*0.01 inch / 0.50*0.25 mm), 0402 (0.04*0.02 inch / 1.00*0.50 mm), 0603 (0.06*0.03 inch / 1.60*0.80 mm), 0805 (0.08*0.05 inch / 2.00*1.25 mm), 1206 (0.12*0.06 inch / 3.20*1.60 mm), 1210 (0.12*0.10 inch / 3.20*2.50 mm), 1808 (0.18*0.08 inch / 4.50*2.00 mm), 1812 (0.18*0.12 inch / 4.50*3.20 mm), 1825 (0.18*0.25 inch / 4.50*6.30 mm), 2211 (0.22*0.11 inch / 5.70*2.8 mm), 2225 (0.22*0.25 inch / 5.70*6.30 mm) | ||||||||
| 2. Temperature Characteristic | Dielectric Type | C0G (030 PPM/), X7R (15%), X5R (15%) | ||||||||
| 3. Nominal Electrostatic Capacity | Capacity Value (pF) | 8R0=8.0, 100=10, 101=100 | ||||||||
| 4. Tolerance of Electrostatic Capacity | Tolerance | B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20% | ||||||||
| 5. Rated Voltage (DC) | Voltage (V) | 250=25V, 251=250V, 252=2500V | ||||||||
| 6. Terminal Composition | Plating | Au/Ag-Ni-Sn | ||||||||
| 7. Packing | Packaging Type | T=Tape/Reel, P=Bag packing (PE) | ||||||||
| Construction and Dimension | ||||||||||
| Part Number | Dimension (mm) L x W x T | WB | ||||||||
| 0201 (0603) | 0.600.10 x 0.300.05 x 0.300.05 | 0.100.05 | ||||||||
| 0402 (1005) | 1.000.15 x 0.500.15 x 0.500.10 | 0.200.10 | ||||||||
| 0603 (1608) | 1.600.20 x 0.800.15 x 0.800.15 | 0.300.10 | ||||||||
| 0805 (2012) | 2.000.20 x 1.250.20 x 0.800.20 | 0.500.20 | ||||||||
| 1206 (3216) | 3.200.30 x 1.600.30 x 1.000.20 | 0.600.30 | ||||||||
| 1210 (3225) | 3.200.30 x 2.500.30 (2.70) | 0.800.30 | ||||||||
| 1808 (4520) | 4.500.40 x 2.000.20 (2.70) | 0.800.30 | ||||||||
| 1812 (4532) | 4.500.40 x 3.200.30 (3.50) | 0.800.30 | ||||||||
| 1825 (4563) | 4.500.40 x 6.300.50 (3.50) | 0.800.30 | ||||||||
| 2220 (5750) | 5.700.50 x 5.000.50 (3.50) | 1.000.40 | ||||||||
| 2225 (5763) | 5.700.50 x 6.300.50 (6.20) | 1.000.40 | ||||||||
| Specification and Testing Method | ||||||||||
| Temperature | -55~+125 | N/A | ||||||||
| Visual/Dimension | 1. No Damage, 2. Dimension meet Spec | Naked eye (Visual inspection), Digital caliper | ||||||||
| Static Capacity | Meet standard specification and tolerance | NPO: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF). X7R/X7T/X7P: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) | ||||||||
| Dissipation Factor (DF) | NPO: DF0.56 (Cr5pF), DF1.5[(150/Cr)+7]10-4 (5pFCr50pF), DF0.15% (50pFCr). Cr1000pF: 1MHz10%, 1V0.2rms. Cr1000pF: 1KHz10%, 1V0.2rms. X7R/X7T/X7P: Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 120Hz24, 0.5V0.1rms. | See Note 1 | ||||||||
| IR Insulation Resistance | NPO: IR50000M (C10nF), IR*Cr500S (C>10nF). X7R/X7T/X7P: IR10000M (C25nF), IR*Cr100S (C>25nF). Testing condition: Rated voltage, 605s, Humidity:75%, Temperature:255, Current:50mA. | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current:50mA | ||||||||
| Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V,...2.5 x rated voltage; Ur=200V/250V,...2.0 x rated voltage; Ur=450/500/630V,...1.5 x rated voltage; 1KVUr2KV,...1.2 x rated voltage; 2KVUr,...1.1 x rated voltage. Voltage Raising time:110S, Voltage maintaining time2S | ||||||||
| Solderability | Soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. | ||||||||
| Resistance to the heat of soldering | No visual damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||
| Electrostatic capacity change rate | NPO: C/C0.5% or 0.5pF; X7R: C/C15%; X7T: -33% C/C22%; X7P: C/C10% | DF, IR refer to NO#4, NO#5 | ||||||||
| Flexural strength | No damage | Base board: Al2O3 /PCB, PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm, Flexural depth: 1mm, Bend speed: 0.5mm/sec. Electro static capacity change rate C/C10% | ||||||||
| Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S | ||||||||
| Thermal shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | Pre-condition (X7R h characteristic): Upper limit temperature 1hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test after place 242 hours normal temp & humidity. | ||||||||
| Temperature moisture exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR: NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after place 242 hours normal temp & humidity. | ||||||||
| High temperature exposure | Visual: No visual damage. Capacity change rate: NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR: NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after place 48 hours under normal pressure & temperature. | ||||||||
| PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction base on the photo. | ||||||||
| Embossed Plastic Taping Dimensions (mm) | ||||||||||
| Code | Tape size A | B | C | D | E | F | G | H | J | T |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing Dimensions (mm) | ||||||||||
| Code | Paper size W1 | L1 | D | C | B | P1 | P2 | P0 | d | t |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size A | B | C | D | E | F | G | H | J | T |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Type | A | B | C | D | E | F | ||||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | ||||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | ||||
| Taping Specification | ||||||||||
| Top tape peeling strength | 0.1N < peeling strength < 0.7N | No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | ||||||||
| Packing Quantity | ||||||||||
| Size | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T>1.60mm) | ||||||||
| 1210 | - | 3000 (T1.85mm), 1000 (T>1.85mm) | ||||||||
| 1808 | - | 800 | ||||||||
| 1812 | - | 500 | ||||||||
| Precautions For Use | ||||||||||
| Soldering Profile | To avoid crack problem by sudden temperature change, follow the temperature profile in the adjacent graph. | |||||||||
| Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks. Handle soldering iron carefully, pay attention to tip selection and temperature contact. | |||||||||
| Optimum Solder Amount for Reflow Soldering | Recommended Soldering amounts. | |||||||||
| Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Soldering Method | ||||||||
| 1005 | NPO, X7R/X5R/X7S/X6S | R | ||||||||
| 0201 | NPO, X7R/X5R/X7S/X6S, Y5V | R | ||||||||
| 0402 | NPO, X7R/X5R/X7S/X6S, Y5V | R | ||||||||
| 0603 | NPO, X7R/X5R/X7S/X6S, Y5V | R/W (C1uf for X7R, C<1uf for X7R) | ||||||||
| 0805 | NPO, X7R/X5R/X7S/X6S, Y5V | R/W (C4.7uf for X7R, C<4.7uf for X7R) | ||||||||
| 1206 | NPO, X7R/X5R/X7S/X6S, Y5V | R/W (C10uf for X7R, C<10uf for X7R) | ||||||||
| 1210 | NPO, X7R/X5R/X7S/X6S, Y5V | R | ||||||||
| Soldering method: RReflow Soldering, WWave Soldering | ||||||||||
| Soldering Temperature Profile | ||||||||||
| While in preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||||||||
2509251626_AIDE-CAPACITOR-0805X7R475K250NT_C48579646.pdf
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