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Specifications
Voltage Rating:
630V
Capacitance:
220pF
Temperature Coefficient:
C0G
Tolerance:
±5%
Mfr. Part #:
1206C0G221J631NT
Model Number:
1206C0G221J631NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and electronic circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Material: Ceramic dielectric, Inner electrode, Outer electrode (Au/Ag-Ni-Sn terminal composition)
- Certifications: RoHS compliant, REACH compliant
Technical Specifications
Application Fields
- Coupling
- Wave filtering
- Resonant in high voltage circuits
- Switch power suppliers
- AC-DC power chargers
- DC-DC power chargers
- Networking/Communication interfaces
- LCD backlight unit power suppliers
- Amperite of energy saving lamps
Testing Conditions
- Normal Condition: Temperature: 15~35, Humidity: 45~75%RH, Atmosphere: 86~106kPa
- Relative Condition: Temperature: 252, Humidity: 60~70%RH, Atmosphere: 86~106kPa
Part Number Description
Example: 1812 X7R 684 M 251 N T
- Dimension Code: 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225
- Temperature Characteristic: C0G (030 PPM/), X7R (15%), X5R (15%)
- Nominal Electrostatic Capacity: e.g., 8R0=8.0pF, 100=10pF, 101=100pF
- Tolerance of Electrostatic Capacity: B:0.1pF, C:0.25pF, D:0.5pF, F:1%, G: 2%, J:5%, K:10%, M:20%, Z:+80%/-20%
- Rated Voltage (DC): e.g., 250=25V, 251=250V, 252=2500V
- Terminal Composition: Au/Ag-Ni-Sn (From the inside out)
- Packing: T Tape/Reel, P Bag packing (PE)
Construction
- Ceramic dielectric
- Inner electrode
- Outer electrode
- Nickel layer
- Tin layer
Dimensions (mm)
| Part Number | Dimension (mm) L | Dimension (mm) W | Dimension (mm) T | Dimension (mm) WB |
|---|---|---|---|---|
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 |
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 |
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 |
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 |
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 |
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 |
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 |
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 |
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 |
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 |
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 |
Specification and Testing Method
| No | Item | Specification/Requirement | Testing method |
|---|---|---|---|
| 1 | Temperature | -55~+125 | |
| 2 | Visual/ Dimension | 1, No Damage 2, Dimension meet Spec | Naked eye (Visual inspection), Digital calliper |
| 3 | Static capacity | Meet standard specification and tolerance | NPO characteristic: 1MHz10%, 1.00.2Vrms (1000pF); 1KHz10%, 1.00.2Vrms (>1000pF) X7R/X7T/X7P characteristic: 1KHz10%, 1.00.2Vrms (10uF); 120Hz24, 0.50.1Vrms (>10uF) |
| 4 | Dissipation factor (DF) | NPO Characteristic: DF0.56, Cr5 pF; DF1.5[(150/Cr)+7]10-4 (5pFCr50pF); DF0.15%, (50pFCr) X7R/X7T/X7P characteristic: see Note 1 | Cr1000pF, 1MHz10%, 1V0.2rms; Cr1000pF, 1KHz10%, 1V0.2rms. Cr10uF, 1KHz10%, 1V0.1rms. Cr10uF, 12024Hz, 0.5V0.1rms. |
| 5 | IR Insulation Resistance | NPO Characteristic: IR50000M,C10nF; IR*Cr500S,C10nF X7R/X7T/X7P Characteristic: IR10000M,C25nF; IR*Cr100S,C25nF | Rated voltage, Time:605s, Humidity:75%, Temperature:255, Current :50mA |
| 6 | Hi-pot (DC) | No dielectric breakdown or damage | Ur=100V, 2.5 x rated voltage; Ur=200V/250V, 2.0 x rated voltage; Ur=450/500/630V, 1.5 x rated voltage; 1KVUr2KV, 1.2 x rated voltage; 2KVUr, 1.1 x rated voltage. Voltage Raising time:110S, Voltage maintaining time2S |
| 7 | Solderability | soldering area90% | Pre-heating temperature 80-120, time 10-30s, lead free solder, flux. Soldering temperature 2455, Solder time 20.5s. |
| 8 | Resistance to the heat of soldering | Visual-No damage, soldering area90% | Pre-heating temperature 100-200, time 102 s, soldering temperature :2655, Soldering time:51s. Cleaning with solvent. Room temperature, time :242 hours. |
| 9 | Flexural strength | No damage. Electro static capacity change rate C/C10% | Base boardAl2O3 /PCB. PCB dimension Thickness: 1.6mm, Length: 100mm, Width: 40mm. Flexural depth: 1mm. Bend speed: 0.5mm/sec. |
| 10 | Terminal bonding strength | No visual damage | Applied Force: 5N, Duration: 101S |
| 11 | Thermal shock | NPO: C/C2.5% or 0.25pF; X7R/X7P: C/C0.5%; X7T: C/C10% | 5 cycles. Test after 242 hours normal temp & humidity. |
| 12 | Temperature moisture exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C10%. DF 2 times initial standard. IR NPO: IR2500M or IR*Cr25S; X7R/X7T/X7P: IR1000M or IR*Cr25S. | Temperature 402, Humidity 90~95%RH, time 50024 hours. Test after 242 hours normal temp & humidity. |
| 13 | High temperature exposure | NPO: C/C2% or 1pF; X7R/X7T/X7P: C/C20%. DF 2 X initial standard. IR NPO: IR4000M or IR*Cr40S; X7R/X7T/X7P: IR2000M or IR*Cr50S. | Temperature 1253, Time 100048 hours. Voltage: 100VV250V (2x Rated voltage), 250VV1KV (1.5x rated voltage), 1KVV (1.2x rated voltage). Test after 48 hours normal pressure & temperature. |
| 14 | PCB flexural strength | No crack and other defect | IR Soldering the MLCC on the PCB, then pressing direction base on the photo. |
Embossed Plastic Taping
| Code | Tape size A | Tape size B | Tape size C | Tape size D | Tape size E | Tape size F | Tape size G | Tape size H | Tape size J | Tape size T |
|---|---|---|---|---|---|---|---|---|---|---|
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
Paper Tape Reel Packing
| Code | Paper size W1 | Paper size L1 | Paper size D | Paper size C | Paper size B | Paper size P1 | Paper size P2 | Paper size P0 | Paper size d | Paper size t |
|---|---|---|---|---|---|---|---|---|---|---|
| 1005 | 0.24 0.02 | 0.45 0.02 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.37 0.10 | 0.67 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.65 0.10 | 1.15 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 2.00 0.05 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size A | Paper size B | Paper size C | Paper size D | Paper size E | Paper size F | Paper size G | Paper size H | Paper size J | Paper size T |
|---|---|---|---|---|---|---|---|---|---|---|
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
Reel Dimensions
| Unit: mm | A | B | C | D | E | F | G |
|---|---|---|---|---|---|---|---|
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max |
Taping Specification
Top tape peeling strength: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape.
Packing Quantity
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) |
|---|---|---|
| 0603 | 4000 | - |
| 0805 | 4000 | 3000 (T1.35mm) |
| 1206 | - | 3000 (T1.60mm) / 2000 (T1.60mm) |
| 1210 | - | 3000 (T1.60mm) / 2000 (T1.60mm) |
| 1808 | - | 1000 (T1.85mm) |
| 1812 | - | 1000 (T1.85mm) |
| 1812 | 800 | 500 |
Precautions For Use
Multi-layer Ceramic Capacitors (MLCC) may fail in a short circuit mode when subjected to severe conditions beyond specified ratings. Following precautions and application notes are essential for safety.
- Soldering Profile: Follow the recommended temperature profile to avoid cracks due to sudden temperature changes.
- Manual Soldering: Handle soldering irons carefully to prevent thermal cracks. Pay attention to tip selection and temperature.
- Optimum Solder Amount for Reflow Soldering
- Recommended Soldering amounts
Recommended Soldering Method
| Size | Temperature Characteristics | Rated Voltage | Capacitance | Soldering Method |
|---|---|---|---|---|
| 1005 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| 0201 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0402 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R | |
| 0603 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C1uf | R | |
| C1uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 0805 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C4.7uf | R | |
| C4.7uf | R/W | |||
| Y5V | / | C1uf | R | |
| C1uf | R/W | |||
| 1206 | NPO | / | / | R/W |
| X7R/X5R/X7S/X6S | / | C10uf | R | |
| C10uf | R/W | |||
| Y5V | / | C10uf | R | |
| C10uf | R/W | |||
| 1210 | NPO | / | / | R |
| X7R/X5R/X7S/X6S | / | / | R | |
| Y5V | / | / | R |
Soldering method: RReflow Soldering, WWave Soldering
Temperature profile for soldering
While preheating, keep the temperature difference between soldering temperature and surface temperature of chips as: T150.
2509251626_AIDE-CAPACITOR-1206C0G221J631NT_C48579665.pdf
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