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Specifications
Voltage Rating:
50V
Capacitance:
4.7uF
Temperature Coefficient:
X5R
Tolerance:
±10%
Mfr. Part #:
1206X5R475K500NT
Model Number:
1206X5R475K500NT
Package:
1206
Key Attributes
Product Description
Product Overview
This product is a Multi-Layer Ceramic Capacitor (MLCC) designed for high-voltage applications. It is suitable for coupling, wave filtering, and resonant functions in various power supply and networking circuits, including switch power supplies, AC-DC and DC-DC power chargers, networking/communication interfaces, LCD backlight unit power supplies, and energy-saving lamps. These MLCCs are available in medium and high voltage ratings.
Product Attributes
- Terminal Composition: Au/Ag-Ni-Sn (from inside out)
- RoHS/REACH Compliance: Meets RoHS and REACH standards.
Technical Specifications
| Item | Description/Specification | Testing Method | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Application Field | ||||||||||
| Coupling, wave filtering, resonant in high voltage circuits, switch power supplier, AC-DC power charger, DC-DC power charger, networking/Communication interface, LCD backlight unit power supplier, amperite of energy saving lamps, etc. (Medium and High voltage MLCC). | ||||||||||
| Testing Conditions | ||||||||||
| Normal Condition | Temperature: 15~35 Humidity: 45~75% RH Normal atmosphere: 86~106 kPa | |||||||||
| Relative Condition | Temperature: 252 Humidity: 60~70% RH Atmosphere: 86~106 kPa | |||||||||
| Part Number Description Example: 1812 X7R 684 M 251 N T | ||||||||||
| 1. Dimension Code | 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2211, 2225 | |||||||||
| 2. Temperature Characteristic | C0G (030 PPM/), X7R (15%), X5R (15%) | |||||||||
| 3. Nominal Electrostatic Capacity | 8R0 = 8.0pF, 100 = 10pF, 101 = 100pF | |||||||||
| 4. Tolerance of Electrostatic Capacity | B: 0.1pF, C: 0.25pF, D: 0.5pF, F: 1%, G: 2%, J: 5%, K: 10%, M: 20%, Z: +80%/-20% | |||||||||
| 5. Rated Voltage (DC) | 250 = 25V, 251 = 250V, 252 = 2500V | |||||||||
| 6. Terminal Composition | Au/Ag-Ni-Sn | |||||||||
| 7. Packing | T = Tape/Reel, P = Bag packing (PE) | |||||||||
| Construction | ||||||||||
| 1. Ceramic dielectric | ||||||||||
| 2. Inner electrode | ||||||||||
| 3. Outer electrode | ||||||||||
| 4. Nickel layer | ||||||||||
| 5. Tin layer | ||||||||||
| Dimension (mm) | ||||||||||
| Part Number | L | W | T | WB | ||||||
| 0201 (0603) | 0.600.10 | 0.300.05 | 0.300.05 | 0.100.05 | ||||||
| 0402 (1005) | 1.000.15 | 0.500.15 | 0.500.10 | 0.200.10 | ||||||
| 0603 (1608) | 1.600.20 | 0.800.15 | 0.800.15 | 0.300.10 | ||||||
| 0805 (2012) | 2.000.20 | 1.250.20 | 0.800.20 | 0.500.20 | ||||||
| 1206 (3216) | 3.200.30 | 1.600.30 | 1.000.20 | 0.600.30 | ||||||
| 1210 (3225) | 3.200.30 | 2.500.30 | 2.70 | 0.800.30 | ||||||
| 1808 (4520) | 4.500.40 | 2.000.20 | 2.70 | 0.800.30 | ||||||
| 1812 (4532) | 4.500.40 | 3.200.30 | 3.50 | 0.800.30 | ||||||
| 1825 (4563) | 4.500.40 | 6.300.50 | 3.50 | 0.800.30 | ||||||
| 2220 (5750) | 5.700.50 | 5.000.50 | 3.50 | 1.000.40 | ||||||
| 2225 (5763) | 5.700.50 | 6.300.50 | 6.20 | 1.000.40 | ||||||
| Specification and Testing Method | ||||||||||
| 1. Temperature | -55~+125 | |||||||||
| 2. Visual/Dimension | 1. No Damage 2. Dimension meet Spec | Naked eye (Visual inspection) Digital caliper | ||||||||
| 3. Static Capacity | Meet standard specification and tolerance | NPO characteristic: 1000pF: 1MHz10%, 1.00.2Vrms >1000pF: 1KHz10%, 1.00.2Vrms X7R/X7T/X7P characteristic: 10uF: 1KHz10%, 1.00.2Vrms >10uF: 120Hz24, 0.50.1Vrms | ||||||||
| 4. Dissipation Factor (DF) | NPO Characteristic: DF0.56, Cr < 5 pF DF1.5[(150/Cr)+7]10-4 (5pFCr<50pF) DF0.15%, (50pFCr) Cr1000pF, 110%MHz, 1V0.2rms Cr>1000pF, 110%KHz, 1V0.2rms. X7R/X7T/X7P characteristic: Cr10uF, 110%KHz, 1V0.1rms. Cr>10uF, 12024Hz, 0.5V0.1rms. See Note 1 for exceptions. | |||||||||
| 5. IR Insulation Resistance | NPO Characteristic: IR50000M, C10nF IR*Cr500S, C>10nF Testing condition: Rated voltage, Time: 605s, Humidity: 75%, Temperature: 255, Current: 50mA X7R/X7T/X7P Characteristic: IR10000M, C25nF IR*Cr100S, C>25nF | |||||||||
| 6. Hi-pot (DC) | No dielectric breakdown or damage Ur=100V: 2.5 x rated voltage Ur=200V/250V: 2.0 x rated voltage Ur=450/500/630V: 1.5 x rated voltage 1KVUr2KV: 1.2 x rated voltage 2KVUr: 1.1 x rated voltage Voltage Raising time: 110S, Voltage maintaining time: 2S | |||||||||
| 7. Solderability | Soldering area 90% | Visual-No damage Pre-heating temperature 80-120, time 10-30s, lead free solder, flux Soldering temperature 2455 Solder time 20.5s | ||||||||
| 8. Resistance to the heat of soldering | Visual-No damage, soldering area 90% | Pre-heating temperature 100-200, time 102 s, soldering temperature: 2655, Soldering time: 51s. Cleaning with solvent. Room temperature, time: 242 hours. | ||||||||
| 9. Flexural strength | No damage Electro static capacity change rate C/C10% | Base board: Al2O3 /PCB PCB dimension: Thickness: 1.6mm, Length: 100mm, Width: 40mm Flexural depth: 1mm Bend speed: 0.5mm/sec. Test it under the flexural status. | ||||||||
| 10. Terminal bonding strength | No visual damage | Applied Force: 5N Duration: 101S | ||||||||
| 11. Thermal shock | NPO Characteristic: C/C2.5% or 0.25pF (larger reading) X7R/X7P characteristic: C/C0.5% X7T characteristic: C/C10% | Pre-condition(X7R h characteristic): Upper limit temperature 1 hour, place 241 hours, start testing. Run 5 cycles Thermal shock. Test it after place 242 hours normal temp & humidity | ||||||||
| 12. Temperature moisture exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO characteristic: C/C2% or 1pF (larger reading) X7R/X7T/X7P characteristic: C/C10% DF: 2 times initial standard IR: NPO characteristic: IR2500M or IR*Cr25S (Lower reading) X7R/X7T/X7P: IR1000M or IR*Cr25S (Lower reading) | Test it after place 242 hours normal temp & humidity Temperature 402 Humidity 90~95%RH Time 50024 hours | ||||||||
| 13. High temperature exposure | Visual: No visual damage Electrostatic capacitance change rate: NPO: C/C2% or 1pF (larger reading) X7R/X7T/X7P: C/C20% DF: 2 X initial standard IR: NPO: IR4000M or IR*Cr40S (Lower reading) X7R/X7T/X7P: IR2000M or IR*Cr50S (Lower reading) | Test it after place 48hours under normal pressure & temperature Temperature 1253 Time 100048 hours Voltage: 100VV250V: 2x Rated voltage 250VV1KV: 1.5x rated voltage 1KVV: 1.2x rated voltage | ||||||||
| 14. PCB flexural strength | No crack and other defect | Soldering the MLCC on the PCB, Then pressing direction base on the photo. SIZE: 0805(2012): A=1.2, B=4, C=1.65 1206(3216): A=2.2, B=5, C=2 1210(3225): A=2.2, B=5, C=2.9 1812(4532): A=3.5, B=7, C=3.7 2220(5750): A=4.5, B=8, C=5.6 | ||||||||
| Embossed Plastic Taping | ||||||||||
| Code | Tape size (A) | (B) | (C) | (D) | (E) | (F) | (G) | (H) | (J) | (T) |
| 0805 | 1.55 0.20 | 2.35 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.50 Max |
| 1206 | 1.95 0.20 | 3.60 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.1 | 1.50 -0/+0.10 | 1.85 Max |
| 1210 | 2.70 0.10 | 3.42 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 3.2 Max |
| 1808 | 2.20 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.50 -0/+0.10 | 3.0 Max |
| 1812 | 3.66 0.10 | 4.95 0.10 | 12.00 0.10 | 5.50 0.05 | 1.75 0.10 | 8.00 0.10 | 2.00 0.05 | 4.00 0.10 | 1.55 -0/+0.10 | 4.0 Max |
| Paper Tape Reel Packing | ||||||||||
| Code | Paper size (W1) | (L1) | (D) | (C) | (B) | (P1) | (P2) | (P0) | (d) | (t) |
| 1005 | 0.240.02 | 0.450.02 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.30 Below |
| 0201 | 0.370.10 | 0.670.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| 0402 | 0.650.10 | 1.150.10 | 8.000.10 | 3.500.05 | 1.750.10 | 2.000.05 | 2.000.05 | 4.000.10 | 1.50 -0/+0.10 | 0.80 Below |
| Code | Paper size (A) | (B) | (C) | (D) | (E) | (F) | (G) | (H) | (J) | (T) |
| 0603 | 1.10 0.10 | 1.90 0.10 | 8.00 0.10 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 0805 | 1.45 0.15 | 2.30 0.15 | 8.0 0.15 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| 1206 | 1.80 0.20 | 3.40 0.20 | 8.00 0.20 | 3.50 0.05 | 1.75 0.10 | 4.00 0.10 | 2.00 0.10 | 4.00 0.10 | 1.50 -0/+0.10 | 1.10 Max |
| Reel Dimensions (unit: mm) | ||||||||||
| Unit | A | B | C | D | E | F | G | |||
| 7REEL | 1782.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| 13REEL | 3302.0 | 3.0 | 130.5 | 210.5 | 21 or Bigger | 1010.5 | 12max | |||
| Taping Specification | ||||||||||
| Top tape peeling strength | (a) Paper Taping Reel type: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. (b) Embossed Taping Standard: 0.1N < peeling strength < 0.7N. No paper dirty remains on the scotch when peeling, and sticks to top and bottom tape. | |||||||||
| Packing Quantity | ||||||||||
| Dimension | Paper T/R (Pcs) | Plastic T/R (Pcs) | ||||||||
| 0603 | 4000 | - | ||||||||
| 0805 | 4000 | 3000 (T1.35mm) | ||||||||
| 1206 | - | 3000 (T1.60mm), 2000 (T>1.60mm) | ||||||||
| 1210 | - | 1000 (T1.85mm), 800 (T>1.85mm) | ||||||||
| 1808 | - | 500 | ||||||||
| 1812 | - | |||||||||
| 1812 | - | |||||||||
| Precautions For Use | ||||||||||
| 1. Soldering Profile | To avoid the crack problem by sudden temperature change, follow the temperature profile in the adjacent graph (refer to the graph in the enclosure page). | |||||||||
| 2. Manual Soldering | Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operators careless may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip. | |||||||||
| 3. Optimum Solder Amount for Reflow Soldering | ||||||||||
| 4. Recommended Soldering amounts | ||||||||||
| Recommended Soldering Method | ||||||||||
| Size | Temperature Characteristics | Capacitance | Soldering Method | |||||||
| 1005 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| 0201 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| Y5V | / | R | ||||||||
| 0402 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| Y5V | / | R | ||||||||
| 0603 | NPO | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C1uf | R | ||||||||
| C1uf | R/W | |||||||||
| Y5V | C1uf | R | ||||||||
| C1uf | R/W | |||||||||
| 0805 | NPO | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C4.7uf | R | ||||||||
| C4.7uf | R/W | |||||||||
| Y5V | C1uf | R | ||||||||
| C1uf | R/W | |||||||||
| 1206 | NPO | / | R/W | |||||||
| X7R/X5R/X7S/X6S | C10uf | R | ||||||||
| C10uf | R/W | |||||||||
| Y5V | C10uf | R | ||||||||
| C10uf | R/W | |||||||||
| 1210 | NPO | / | R | |||||||
| X7R/X5R/X7S/X6S | / | R | ||||||||
| Y5V | / | R | ||||||||
| Soldering method: RReflow Soldering, WWave Soldering | ||||||||||
| The temperature profile for soldering | ||||||||||
| While in preheating, please keep the temperature difference between soldering temperature and surface temperature of chips as: T150. | ||||||||||
2509251626_AIDE-CAPACITOR-1206X5R475K500NT_C48579676.pdf
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